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1. 发明申请

US20040120097A1 Methods of forming metal-insulator-metal capacitors 审中-公开
标题翻译：金属绝缘体金属电容器的形成方法
公开(公告)号：US20040120097A1
公开(公告)日：2004-06-24
申请号：US10329214
申请日：2002-12-23
发明人： Stephen T. Chambers , John Barnak
IPC分类号： H01G004/00
CPC分类号： H01G4/008 , H01G4/1272 , H01G4/33 , H01L23/5223 , H01L28/55 , H01L28/75 , H01L2924/0002 , H01L2924/00
摘要： Methods for fabricating a capacitor in a microelectronic device utilizing a sputter deposition technique for forming a capacitor dielectric material on a copper-containing plate of the capacitor. Such a sputter deposition technique can be achieved at about room temperature, which should not induce stresses on the copper-containing plate, and, thus, should not generate hillocks.
摘要翻译：在利用溅射沉积技术在电容器的含铜板上形成电容器介电材料的微电子装置中制造电容器的方法。这样的溅射沉积技术可以在大约室温下实现，其不应该在含铜板上引起应力，因此不应该产生小丘。

2. 发明申请

US20030156376A1 Apparatus for producing capacitor element member 有权
标题翻译：用于制造电容器元件的装置
公开(公告)号：US20030156376A1
公开(公告)日：2003-08-21
申请号：US10363307
申请日：2003-03-03
发明人： Hiroshi Nitoh , Toshihiro Okabe , Kenji Ishii , Atsushi Sakai
IPC分类号： H01G004/00
CPC分类号： H01G13/00 , Y10T29/49121 , Y10T29/5313 , Y10T29/53183 , Y10T29/53187 , Y10T29/532 , Y10T29/53213 , Y10T29/53217
摘要： The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like foil by a constant lenght toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.
摘要翻译：本发明涉及一种用于制造梳状电容器元件的装置，该梳状电容器元件包括引导件和多个矩形金属箔片，该多个矩形金属箔片接合到引导件上，该自动进给机构用于将带状箔片以恒定的长度引导构件，用于将金属箔接合到引导构件的接合机构，以及用于切割接合的金属箔的切割机构。根据本发明的装置，可以有效地制造具有多个矩形金属箔片的梳状电容器元件，通过将细长的带状金属箔粘合而不会损坏。

3. 发明申请

US20030184948A1 SELF-LEADED SURFACE MOUNT COMPONENT HOLDER 失效
标题翻译：自引导表面安装组件支架
公开(公告)号：US20030184948A1
公开(公告)日：2003-10-02
申请号：US10109162
申请日：2002-03-27
发明人： Todd Settergren , Jimmy D. Holdahl
IPC分类号： H01G004/00
CPC分类号： H05K3/301 , H01F5/04 , H01F27/027 , H01F27/292
摘要： A self-leaded, surface mountable component package is provided for holding a wide variety of electrical components having widely variant conductor wire sizes in a manner achieving standardized conductor contact positioning. The general box-like configuration provides for component style variability and has a set of progressively stepped or tapered winding bosses to position and secure component conductors of multiple wire size, thereby ensuring proper registration with conductive traces of surface mount printed circuit boards and substrates.
摘要翻译：提供了一种自引导的，可表面安装的部件封装，用于以实现标准化的导体接触定位的方式保持具有广泛变化的导线尺寸的各种电气部件。一般的盒状配置提供部件风格的可变性，并且具有一组渐进的阶梯式或锥形的卷绕凸台，用于定位和固定多个导线尺寸的部件导体，从而确保与表面安装印刷电路板和基板的导电迹线正确对准。

4. 发明申请

US20030067054A1 Surface mountable device 失效
标题翻译：表面贴装装置
公开(公告)号：US20030067054A1
公开(公告)日：2003-04-10
申请号：US10265540
申请日：2002-10-07
发明人： Edward Fu-Hua Chu , David Shau-Chew Wang , Yun-Ching Ma
IPC分类号： H01G004/00
CPC分类号： H01C1/1406 , H01C7/02 , H01C7/027
摘要： The present invention discloses a surface mountable device comprising a current-sensitive element and two electrodes. The current-sensitive element is composed of a PTC conductive composite, comprising at least one polymer and a conductive filler. The feature of the present invention is that the current-sensitive element is a three-dimensional bent structure so that the shape, length and height of the device can be varied according to the space of the circuit board and the resistance of the surface mountable device. Therefore, the mountable surface of the circuit board can be used more efficiently. Moreover, the area of the current-sensitive element of the present invention is larger than that of the conventional surface mountable device. Consequently, the normal resistance of the surface mountable device of the present invention is smaller than that of the conventional surface mountable device and the voltage endurance of the surface mountable device of the present invention is increased.
摘要翻译：本发明公开了一种包括电流敏感元件和两个电极的可表面安装的装置。电流敏感元件由包含至少一种聚合物和导电填料的PTC导电复合材料构成。本发明的特征在于，电流敏感元件是三维弯曲结构，使得该装置的形状，长度和高度可以根据电路板的空间和表面可安装装置的电阻而变化。因此，可以更有效地使用电路基板的安装面。此外，本发明的电流敏感元件的面积大于常规表面可安装装置的面积。因此，本发明的表面安装装置的正常电阻小于常规的表面安装装置，并且本发明的表面安装装置的耐压性提高。

5. 发明申请

US20020056697A1 Ruthenium and ruthenium dioxide removal method and material 有权
标题翻译：钌和二氧化钌去除方法和材料
公开(公告)号：US20020056697A1
公开(公告)日：2002-05-16
申请号：US09990481
申请日：2001-11-16
发明人： Donald L. Westmoreland
IPC分类号： H01G004/00
CPC分类号： C23C16/4407 , C22B11/046 , C23F1/30 , H01L21/32134 , Y02P10/214
摘要： A method for removing at least a portion of a structure, such as a layer, film, or deposit, including ruthenium metal and/or ruthenium dioxide includes contacting the structure with a material including ceric ammonium nitrate. A material for removing ruthenium metal and amorphous ruthenium dioxide includes ceric ammonium nitrate and may be in the form of an aqueous solution including ceric ammonium nitrate and, optionally, other solid or liquid solutes providing desired properties. In one application, the method and material may be utilized to etch, shape, or pattern layers or films of ruthenium metal and/or ruthenium dioxide in the fabrication of semiconductor systems and their elements, components, and devices, such as wires, electrical contacts, word lines, bit lines, interconnects, vias, electrodes, capacitors, transistors, diodes, and memory devices.
摘要翻译：一种用于去除包括钌金属和/或二氧化钌在内的诸如层，膜或沉积物的结构的至少一部分的方法包括使结构与包括硝酸铈铵的材料接触。用于除去钌金属和无定形二氧化钌的材料包括硝酸铈铵，并且可以是包括硝酸铈铵和任选地提供所需性质的其它固体或液体溶质的水溶液形式。在一个应用中，可以利用该方法和材料在制造半导体系统及其元件，组件和器件（例如导线，电触头）中蚀刻，形成或图案钌金属和/或二氧化钌的层或膜，字线，位线，互连，通孔，电极，电容器，晶体管，二极管和存储器件。

6. 发明申请

US20010033473A1 Nonflammable and disaster prevention type capacitor 审中-公开
标题翻译：不可燃和防灾型电容器
公开(公告)号：US20010033473A1
公开(公告)日：2001-10-25
申请号：US09824737
申请日：2001-04-04
申请人： NISSIN ELECTRIC CO., LTD.
发明人： Satoru Itahashi , Masaru Kamba , Yoshihisa Tanaka
IPC分类号： H01G004/00
CPC分类号： H01G2/14
摘要： In a nonflammable and disaster prevention type capacitor, the sealing property of the capacitor container is increased, a plurality of capacitor elements are collected, is accommodated in the container, and its inside is vacuum deaerated, the perfluorocarbon liquid deaerated by a deaeration apparatus is filled, and a capacitor which maintains an amount of residual air in the perfluorocarbon liquid to be not larger than 5%, is formed. A fluoride liquid to be filled in the container, consisting of a connection of carbon, fluorine and oxygen, and which includes per fluoropolyether by not smaller than 90% and whose boiling point is not lower than 120null C. and not higher than 270null C., and whose dynamic viscosity at 25null C. is from 0.9 mm2/s to not larger than 14 mm2/s, is impregnated into the capacitor element. An absolute pressure in the container is not smaller than 120 kPa and not larger than 300 kPa.
摘要翻译：在不易燃防灾型电容器中，电容器容器的密封性能增加，多个电容器元件被收集在容器中，其内部被真空脱气，填充了由脱气装置脱气的全氟化碳液体并且形成将全氟化碳液体中的残留空气量维持在5％以下的电容器。填充在容器中的氟化物液体，其由碳，氟和氧的连接构成，并且其包含全氟聚醚不低于90％且沸点不低于120℃且不高于270° 并且其在25℃下的动态粘度为0.9mm 2 / s至不大于14mm 2 / s，被浸渍到电容器元件中。容器内的绝对压力不小于120kPa且不大于300kPa。

7. 发明申请

US20040240146A1 Multilayer ceramic electronic component and mounting structure and method for the same 有权
标题翻译：多层陶瓷电子元件及其安装结构及方法相同
公开(公告)号：US20040240146A1
公开(公告)日：2004-12-02
申请号：US10830721
申请日：2004-04-23
申请人： Murata Manufacturing Co., Ltd.
发明人： Takayuki Kayatani , Shinichi Kobayashi
IPC分类号： H01G004/06 , H01G004/00 , H01G004/228
CPC分类号： H01G2/103 , H05K3/3442 , H05K2201/0129 , H05K2201/10636 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , Y10T29/43 , Y10T29/435
摘要： A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.
摘要翻译：通过用通过焊接安装在基板上的热塑性树脂层覆盖电容器元件来制备多层陶瓷电子部件。由于焊接所需的热量，热塑性树脂层熔融。熔融树脂层流动以暴露电子部件的外部电极。暴露的外部电极焊接到基板的电极。在所得到的安装结构中，除了电子部件的焊接部分和焊料的一部分之外，热塑性树脂层基本上覆盖整个表面。

8. 发明申请

US20030112578A1 Tuneable ferroelectric decoupling capacitor 失效
标题翻译：可调铁电去耦电容器
公开(公告)号：US20030112578A1
公开(公告)日：2003-06-19
申请号：US10305767
申请日：2002-11-27
申请人： International Business Machines Corporation
发明人： Thomas M. Shaw , W. David Pricer , Deborah A. Neumayer , John D. Baniecki , Robert B. Laibowitz
IPC分类号： H01G004/00
CPC分类号： H01L27/0805 , H01L28/55
摘要： A voltage supply bypass capacitor for use with a semiconductor integrated circuit chip or module comprising a ferroelectric dielectric having electromechanical properties designed to provide maximum losses at selected frequencies.
摘要翻译：一种与半导体集成电路芯片或模块一起使用的电压旁路电容器，其包括具有机电特性的铁电电介质，其设计成在选定频率下提供最大损耗。

9. 发明申请

US20030103316A1 Capacitor and manufacturing method of capacitor 失效
标题翻译：电容器和电容器的制造方法
公开(公告)号：US20030103316A1
公开(公告)日：2003-06-05
申请号：US10221635
申请日：2002-11-14
发明人： Gilvan Schabbach
IPC分类号： H01G004/00 , H01G004/06
CPC分类号： H01G4/224 , Y10T29/435
摘要： It is described a capacitor (8) provided with a thermo shrinkable film (6) directly 5 on the capacitive element (1). That capacitor (8) including a capacitive element (1), plurality of metallic armatures (2), contact terminals (3), the capacitor (8) with a thermo shrinkable cover (6) applied directly on the capacitive element (1). It is also foreseen a manufacturer method of capacitor (8), particularly a manufacturer method of a dry capacitor (8) including a step where a thermo shrinkable tube (6) is applied directly on the capacitive element and a next step where the thermo shrinkable tube (6) is warmed up.
摘要翻译：描述了在电容元件（1）上直接设置有热收缩膜（6）的电容器（8）。包括电容元件（1）的电容器（8），多个金属电枢（2），接触端子（3），具有直接施加在电容元件（1）上的热收缩罩（6）的电容器（8）。还预见电容器（8）的制造方法，特别是干电容器（8）的制造方法，其包括将热收缩管（6）直接施加在电容元件上的步骤，以及下一步骤，其中热收缩管（6）被加热。

10. 发明申请

US20010022292A1 Method of manufacturing a ferroelectric capacitor configuration 失效
标题翻译：铁电电容器配置的制造方法
公开(公告)号：US20010022292A1
公开(公告)日：2001-09-20
申请号：US09793350
申请日：2001-02-26
发明人： Walter Hartner , Gunther Schindler , Volker Weinrich , Igor Kasko
IPC分类号： H01G004/00
CPC分类号： H01L28/55 , H01L28/60 , H01L28/75
摘要： A ferroelectric capacitor configuration is configured with at least two different coercitive voltages. A first electrode structure having a surface which forms at least two levels is firstly produced. A layer of ferroelectric material of varying thickness is deposited over the first electrode by spin coating. A second electrode structure is subsequently formed on the layer of ferroelectric material.
摘要翻译：铁电电容器配置配置有至少两个不同的强制电压。首先制造具有形成至少两个层次的表面的第一电极结构。通过旋涂在第一电极上沉积不同厚度的铁电材料层。随后在铁电材料层上形成第二电极结构。

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