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US08007631B2 System and method for imprint lithography to facilitate dual damascene integration with two imprint acts 有权
标题翻译：用于压印光刻的系统和方法，以促进双重镶嵌与两个印记动作的整合
公开(公告)号：US08007631B2
公开(公告)日：2011-08-30
申请号：US11741991
申请日：2007-04-30
申请人： Srikanteswara Dakshina-Murthy , Bhanwar Singh , Ramkumar Subramanian
发明人： Srikanteswara Dakshina-Murthy , Bhanwar Singh , Ramkumar Subramanian
IPC分类号： C23C10/00 , C29C59/02 , C03C17/22
CPC分类号： H01L21/76817 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L21/31144 , H01L21/76811
摘要： A system and method are provided to facilitate dual damascene interconnect integration with two imprint acts. The method provides for creation of a pair of translucent imprint molds containing the dual damascene pattern to be imprinted. The first imprint mold of the pair contains the via features of the dual damascene pattern and the second imprint mold of the pair contains the trench features. The via feature imprint mold is brought into contact with a first imaging layer deposited upon a first transfer layer which is deposited upon a dielectric layer of a substrate. The trench feature imprint mold is brought into contact with a second imaging layer deposited upon a second transfer layer which is deposited upon the first imaging layer of the substrate. When each imaging layer is exposed to a source of illumination, it cures with a structure matching the features of the corresponding imprint mold. A sequence of etches transfer and combine the via features from the first imaging layer with the trenches from the second imaging layer to create the dual damascene openings within the dielectric layer.
摘要翻译：提供了一种系统和方法来促进与两个印记动作的双镶嵌互连集成。该方法提供了一对包含要印制的双镶嵌图案的半透明压印模具。该对的第一压印模具包含双镶嵌图案的通孔特征，并且该对的第二压印模具包含沟槽特征。通孔特征压印模具与沉积在沉积在基板的电介质层上的第一转印层上的第一成像层接触。沟槽特征压印模具与沉积在沉积在基板的第一成像层上的第二转印层上的第二成像层接触。当每个成像层暴露于照明源时，它将以匹配相应压印模具的特征的结构固化。一系列蚀刻将来自第一成像层的通孔特征与来自第二成像层的沟槽结合，以在介电层内形成双镶嵌开口。

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