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1. 发明授权

US06506293B1 Process for the application of a metal film on a polymer surface of a subject 失效
标题翻译：在受试者的聚合物表面上施加金属膜的方法
公开(公告)号：US06506293B1
公开(公告)日：2003-01-14
申请号：US09719802
申请日：2001-02-08
申请人： Thomas Rumpf
发明人： Thomas Rumpf
IPC分类号： C23C2802
CPC分类号： C08J7/123 , C23C18/22 , C23C18/30 , H05K3/381
摘要： A process for the application of a metal film on a polymer surface of a subject, to which, after nucleation with a catalytically active platinum metal and/or a platinum metal compound, a coating metal is precipitated autocatalytically from an aqueous solution without any external current supply, before at least another layer is applied, preferably electrolytically under external current supply, to this preliminary coating. To achieve favorable construction features, it is suggested that centers of a Lewis acid or Lewis base are enriched first on the polymer surface to be coated by a vacuum plasma treatment via a plasma gas adapted to the polymer used, before the polymer surface is nucleated under vacuum with the platinum metal and/or the platinum metal compound by another plasma gas containing an evaporated platinum metal and/or a platinum metal compound for nucleophilic and/or electrophilic reaction on the Lewis acids and/or Lewis bases.
摘要翻译：在受试者的聚合物表面上施加金属膜的方法，在用催化活性的铂金属和/或铂金属化合物成核后，涂覆金属在水溶液中自发沉淀而没有任何外部电流在至少另外一层被施加之前，优选在外部电流供给下电解，供给到该初步涂层。为了获得有利的构造特征，建议在聚合物表面成核之前，通过适于所用聚合物的等离子体气体，通过真空等离子体处理在聚合物表面上首先富集路易斯酸或路易斯碱的中心用铂金属和/或铂金属化合物通过另一种含有蒸发的铂金属和/或铂金属化合物的等离子体气体在路易斯酸和/或路易斯碱上进行亲核和/或亲电子反应而真空。

2. 发明授权

US06562219B2 Method for the formation of copper wiring films 失效
标题翻译：形成铜布线膜的方法
公开(公告)号：US06562219B2
公开(公告)日：2003-05-13
申请号：US09987940
申请日：2001-11-16
申请人： Akiko Kobayashi , Atsushi Sekiguchi , Tomoaki Koide , Minjuan Zhang , Hideki Sunayama , Shiqin Xiao , Kaoru Suzuki
发明人： Akiko Kobayashi , Atsushi Sekiguchi , Tomoaki Koide , Minjuan Zhang , Hideki Sunayama , Shiqin Xiao , Kaoru Suzuki
IPC分类号： C23C2802
CPC分类号： H01L21/76843 , C23C26/00 , C23C28/322 , C23C28/34 , C23C28/36 , C25D7/123 , H01L21/76864 , H01L21/76873
摘要： A method for the formation of copper wiring films includes the steps of forming a first copper film by a CVD method on a diffusion barrier film, which diffusion barrier film has been formed on a semiconductor substrate and in which a concavity has been established; heating the first copper film to a temperature within the range from 200 to 500° C.; and subsequently forming a second copper film on the first copper film by a plating method using the first copper film as an electrode.
摘要翻译：形成铜布线膜的方法包括以下步骤：通过CVD方法在扩散阻挡膜上形成第一铜膜，该扩散阻挡膜已经形成在半导体衬底上并且已经建立了凹陷; 将第一铜膜加热至200〜500℃的温度范围。并且随后通过使用第一铜膜作为电极的镀覆方法在第一铜膜上形成第二铜膜。

3. 发明授权

US06383306B1 Preparation of a nickel-base superalloy article having a decarburized coating containing aluminum and a reactive element 失效
标题翻译：制备具有包含铝和反应性元素的脱碳涂层的镍基超级合金制品
公开(公告)号：US06383306B1
公开(公告)日：2002-05-07
申请号：US09513871
申请日：2000-02-28
申请人： Irene T. Spitsberg , Jeffrey A. Pfaendtner , Joseph D. Rigney
发明人： Irene T. Spitsberg , Jeffrey A. Pfaendtner , Joseph D. Rigney
IPC分类号： C23C2802
CPC分类号： C23C28/00 , Y02T50/67
摘要： A nickel-base superalloy article substrate has more nickel than any other element and a nominal bulk composition of carbon. A protective layer is deposited overlying the surface of the article substrate. The protective layer includes aluminum and one or more of the reactive elements hafnium, zirconium, yttrium, lanthanum, and cerium. The depositing of the protective layer includes steps of decarburizing locations where the carbon may serve as a barrier to the mobility of the reactive elements within the protective layer, and depositing an aluminum-containing protective layer overlying the substrate. The decreasing of the carbon concentration may be accomplished. by decarburizing the substrate, depositing a platinum-containing layer and then decarburizing, depositing an aluminum-containing layer in a reducing atmosphere, and/or decarburizing the deposited protective layer. A ceramic thermal barrier coating may be deposited overlying the protective layer.
摘要翻译：镍基超合金制品基材具有比任何其它元素更多的镍和标称的碳组成。保护层沉积在物品基底的表面上。保护层包括铝和一种或多种反应元素铪，锆，钇，镧和铈。保护层的沉积包括脱碳位置的步骤，其中碳可以用作阻挡保护层内的反应元件的迁移率，以及沉积覆盖在基底上的含铝保护层。可以实现碳浓度的降低。通过使基板脱碳，沉积含铂层然后脱碳，在还原气氛中沉积含铝层和/或使沉积的保护层脱碳。陶瓷热障涂层可以沉积在覆盖保护层上。

4. 发明授权

US06436267B1 Method for achieving copper fill of high aspect ratio interconnect features 有权
标题翻译：实现高宽比互连特征铜填充的方法
公开(公告)号：US06436267B1
公开(公告)日：2002-08-20
申请号：US09650108
申请日：2000-08-29
申请人： Daniel A. Carl , Barry Chin , Liang Chen , Robin Cheung , Peijun Ding , Yezdi Dordi , Imran Hashim , Peter Hey , Ashok K. Sinha
发明人： Daniel A. Carl , Barry Chin , Liang Chen , Robin Cheung , Peijun Ding , Yezdi Dordi , Imran Hashim , Peter Hey , Ashok K. Sinha
IPC分类号： C23C2802
CPC分类号： H01L21/2885 , H01L21/76877
摘要： One aspect of the invention provides a consistent metal electroplating technique to form void-less metal interconnects in sub-micron high aspect ratio features on semiconductor substrates. One embodiment of the invention provides a method for filling sub-micron features on a substrate, comprising reactive precleaning the substrate, depositing a barrier layer on the substrate using high density plasma physical vapor deposition; depositing a seed layer over the barrier layer using high density plasma physical vapor deposition; and electro-chemically depositing a metal using a highly resistive electrolyte and applying a first current density during a first deposition period followed by a second current density during a second period.
摘要翻译：本发明的一个方面提供一致的金属电镀技术，以在半导体衬底上形成亚微米高纵横比特征的无空隙金属互连。本发明的一个实施方案提供了一种用于在基底上填充亚微米特征的方法，包括反应性预清洗基底，使用高密度等离子体物理气相沉积在基底上沉积阻挡层; 使用高密度等离子体物理气相沉积在阻挡层上沉积种子层; 以及使用高电阻电解质电化学沉积金属，并且在第一周期期间在第一沉积期间施加第一电流密度，然后施加第二电流密度。

5. 发明授权

US06254758B1 Method of forming conductor pattern on wiring board 有权
标题翻译：在布线板上形成导体图案的方法
公开(公告)号：US06254758B1
公开(公告)日：2001-07-03
申请号：US09243507
申请日：1999-02-01
申请人： Toshinori Koyama
发明人： Toshinori Koyama
IPC分类号： C23C2802
CPC分类号： C23F1/18 , H05K3/067 , H05K3/108 , H05K3/181 , H05K2203/0796 , H05K2203/121
摘要： A method of forming a conductor pattern on a wiring board, in which a conductor pattern forming process on the wiring board can be simplified; and an interval between the conductor patterns can be further reduced by suppressing the etching conducted on the side portions of the electrolytic copper plated layer. The method of forming a conductor pattern on a wiring board in which an electroless copper plated layer 12 is formed on a surface of an insulating layer 10 of the wiring board and an electrolytic copper plated layer 16 is formed on the electroless copper plated layer 12, comprises the steps of: forming an electroless copper plated layer 12 on the insulating layer 10; forming and patterning a layer of resist 14 on the electroless copper plated layer 12; forming an electrolytic copper plated layer 16 on the electroless copper plated layer 12 exposed from the layer of plated resist 14; removing the layer of plated resist 14 for exposing the electroless copper plated layer 12 except for a portion in which the electrolytic copper plated layer 16 is formed; and removing the exposed electroless copper plated layer 12 by using an etching solution composed of a mixed aqueous solution containing sulfuric acid, hydrogen peroxide and Cu chelate agent.
摘要翻译：在布线基板上形成导体图案的方法，其中可以简化布线板上的导体图形形成处理; 并且通过抑制在电解镀铜层的侧面进行的蚀刻，可以进一步减小导体图案之间的间隔。在化学镀铜层12上形成在布线基板的绝缘层10的表面上形成化学镀铜层12的布线基板上形成导体图案的方法和电解镀铜层16，包括以下步骤：在绝缘层10上形成化学镀铜层12; 在化学镀铜层12上形成和图案化抗蚀剂层14; 在从镀覆抗蚀剂层14暴露的化学镀铜层12上形成电解镀铜层16; 除去电镀抗蚀剂14的层，以暴露除了形成电解镀铜层16的部分之外的无电镀铜层12; 并且通过使用由含有硫酸，过氧化氢和Cu螯合剂的混合水溶液组成的蚀刻溶液除去暴露的化学镀铜层12。

6. 发明授权

US06695931B1 Composition and method for metal coloring process 有权
标题翻译：金属着色工艺的组成和方法
公开(公告)号：US06695931B1
公开(公告)日：2004-02-24
申请号：US10336506
申请日：2003-01-02
申请人： Keith N. Ravenscroft , William V. Block
发明人： Keith N. Ravenscroft , William V. Block
IPC分类号： C23C2802
CPC分类号： C23C22/83 , C23C22/84
摘要： This invention is a method for forming a chemical conversion coating on ferrous metal substrates, the chemical solutions used in the coating and the articles coated thereby. By modifying and combining the features of two existing, but heretofore unrelated, coating technologies, a hybrid conversion coating is formed. Specifically, a molecular iron/oxygen-enriched intermediate coating, such as a dicarboxylate or phosphate, is applied to a ferrous substrate by a first oxidation. The intermediate coating pre-conditions the substrate to form a surface rich in molecular iron and oxygen in a form easily accessible for further reaction. This oxidation procedure is followed by a coloring procedure using a heated (about 120-220° F.) oxidizing solution containing alkali metal hydroxide, alkali metal nitrate, alkali metal nitrite or mixtures thereof, which reacts with the iron and oxygen enriched intermediate coating to form magnetite (Fe3O4). The result is the formation of a brown or black finish under much more favorable, milder and safer conditions than previously seen with conventional caustic blackening processes, by virtue of the chemical reaction between the intermediate coating and the second oxidation solution. When sealed with an appropriate rust preventative topcoat, the final result is an ultra-thin, attractive and protective finish applied through simple immersion techniques. The finish is a final protective coating on a fabricated metal article and also affords a degree of lubricity to aid assembly, break-in of sliding surfaces or provide anti-galling protection. The finish also provides an adherent base for paint finishes.
摘要翻译：本发明是一种用于在黑色金属基材上形成化学转化涂层的方法，用于涂层的化学溶液和由此涂覆的制品。通过修改和组合两个现有的但迄今不相关的涂覆技术的特征，形成了混合转化涂层。具体地说，通过第一次氧化将铁分子铁/富氧中间涂层如二羧酸盐或磷酸盐施加到铁基质上。中间涂层预处理基底以形成富含分子铁和氧的表面，其易于进一步反应。该氧化方法之后是使用含有碱金属氢氧化物，碱金属硝酸盐，碱金属亚硝酸盐或其混合物的加热（约120-220°F）氧化溶液的着色程序，其与富含铁和富氧中间体涂层反应形成磁铁矿（Fe3O4）。结果是由于中间涂层和第二氧化溶液之间的化学反应，在比现有的苛性碱黑化工艺更好的，温和和更安全的条件下形成棕色或黑色整理。当用适当的防锈面漆密封时，最终的结果是通过简单的浸渍技术施加的超薄，有吸引力和保护性的涂层。涂饰是在金属制品上的最终保护涂层，并且还提供一定程度的润滑性，以有助于组装，滑入表面的插入或提供抗磨损保护。完成也为油漆装饰提供了坚固的基础。

7. 发明授权

US06423201B1 Method of improving the adhesion of copper 失效
标题翻译：提高铜的附着力的方法
公开(公告)号：US06423201B1
公开(公告)日：2002-07-23
申请号：US09644968
申请日：2000-08-23
申请人： Tushar Mandrekar
发明人： Tushar Mandrekar
IPC分类号： C23C2802
CPC分类号： H01L21/76873 , H01L21/28556 , H01L21/76843 , H01L21/76876 , H01L23/53238 , H01L2221/1089 , H01L2924/0002 , H01L2924/12044 , H01L2924/3011 , H01L2924/00
摘要： The present invention provides a method of improving the adhesion of a copper layer to a barrier layer on a substrate. After deposition of a barrier layer, such as TiN, an amorphous silicon layer is deposited by striking a plasma over the substrate using a silicon source gas, such as silane, and an inert gas, such as argon (Ar). A Cu layer is deposited on the amorphous silicon. In another aspect of the invention, a TiSiN layer is deposited using a silicon source gas, such as silane, and a titanium source gas, such as TDMAT, during the deposition of the TiN barrier layer.
摘要翻译：本发明提供一种提高铜层对基材上的阻挡层的粘附性的方法。在诸如TiN的阻挡层沉积之后，通过使用诸如硅烷的硅源气体和诸如氩（Ar）的惰性气体将等离子体击穿在衬底上来沉积非晶硅层。 Cu层沉积在非晶硅上。在本发明的另一方面，在沉积TiN阻挡层期间，使用诸如硅烷的硅源气体和诸如TDMAT的钛源气体来沉积TiSiN层。

8. 发明授权

US06221231B1 Process for applying protective and decorative coating on an article 失效
标题翻译：在物品上施加保护性和装饰性涂层的方法
公开(公告)号：US06221231B1
公开(公告)日：2001-04-24
申请号：US09264361
申请日：1999-03-08
申请人： Dennis Foster
发明人： Dennis Foster
IPC分类号： C23C2802
CPC分类号： C23C28/321 , C23C14/025 , C23C28/00 , C23C28/34 , C23C28/3455 , C23C28/42 , Y10T428/12944
摘要： A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by chemical vapor deposition, at least one chemically vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The chemical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.
摘要翻译：一种用于在制品上沉积多层保护性和装饰性涂层的方法，包括首先通过电镀沉积所述制品上的至少一层涂层，从所述电镀浴中移除所述电镀制品并使其经受脉冲吹风干燥以产生无斑点表面，然后通过化学气相沉积沉积在电镀制品上的至少一个化学气相沉积涂层。电镀层选自铜，镍和铬。化学气相沉积层选自非贵重难熔金属，非贵重难熔金属合金，非贵重难熔金属化合物和非贵重难熔金属合金化合物。

9. 发明授权

US06827834B2 Non-cyanide copper plating process for zinc and zinc alloys 有权
标题翻译：锌和锌合金的非氰化物镀铜工艺
公开(公告)号：US06827834B2
公开(公告)日：2004-12-07
申请号：US10096411
申请日：2002-03-12
申请人： Ronald Stewart , Carl Steinecker
发明人： Ronald Stewart , Carl Steinecker
IPC分类号： C23C2802
CPC分类号： C25D3/38 , C25D5/34
摘要： The invention consists of a method for producing an adherent copper coating on a zinc or zinc alloy article without the use of cyanide as a component of the process. The zinc or zinc alloy article is first immersed in an aqueous nickel pyrophosphate solution and is then electroplated with a copper pyrophosphate solution. The method produces an adherent copper coating on the zinc or zinc alloy, which can be deformed without any loss of the copper coating.
摘要翻译：本发明包括在锌或锌合金制品上生产粘附铜涂层的方法，而不使用氰化物作为该方法的组分。锌或锌合金制品首先浸入焦磷酸镍水溶液中，然后用焦磷酸铜溶液电镀。该方法在锌或锌合金上产生粘附铜涂层，可以在不损失铜涂层的情况下变形。

10. 发明授权

US06824665B2 Seed layer deposition 失效
标题翻译：种子层沉积
公开(公告)号：US06824665B2
公开(公告)日：2004-11-30
申请号：US09978797
申请日：2001-10-17
申请人： James G. Shelnut , David Merricks , Oleh B. Dutkewych , Charles R. Shipley
发明人： James G. Shelnut , David Merricks , Oleh B. Dutkewych , Charles R. Shipley
IPC分类号： C23C2802
CPC分类号： H01L21/76868 , C23C18/1671 , C23C18/38 , C23C18/405 , H01L21/288 , H01L21/2885 , H01L21/76843 , H01L21/76874 , H01L2221/1089 , H05K3/181 , H05K3/388 , H05K3/422 , Y10S205/916
摘要： Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
摘要翻译：公开了在具有导电层的基板上沉积铜籽晶层的方法。这种方法特别适用于在具有小孔径的基底上沉积铜籽晶层，并且优选地非常小的孔。

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