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    • 3. 发明授权
    • Resin diamond blade and optical waveguide manufacturing method using the blade
    • 树脂金刚石刀片和光波导制造方法采用刀片
    • US06669537B2
    • 2003-12-30
    • US10102687
    • 2002-03-22
    • Akio MaedaTakashi Shiotani
    • Akio MaedaTakashi Shiotani
    • B28B102
    • H01L21/67092B24B19/226B28D5/022
    • A silicon base optical waveguide manufacturing method including the steps of preparing a silicon wafer having a plurality of embedded optical waveguides, performing first-stage dicing of the silicon wafer to form a cut groove by using a first resin diamond blade having a thickness t1, and performing second-stage dicing of the silicon wafer along the cut groove to polish an end face of each optical waveguide by using a second resin diamond blade having a thickness t2 greater than the thickness t1. The second resin diamond blade includes diamond abrasive grains having a grain diameter of 2 &mgr;m or less, and the relation between the thicknesses t1 and t2 is set to t1+0.01 mm≦t2≦t1+0.05 mm.
    • 一种硅基光波导制造方法,包括以下步骤:制备具有多个嵌入式光波导的硅晶片,通过使用具有厚度t1的第一树脂金刚石刀片,进行硅晶片的第一阶段切割以形成切割槽;以及 通过使用厚度t2大于厚度t1的第二树脂金刚石刀片,沿切割槽进行硅晶片的第二阶段切割以抛光每个光波导的端面。 第二树脂金刚石刀片包括晶粒直径为2μm或更小的金刚石磨粒,厚度t1和t2之间的关系设定为t1 + 0.01mm <= T2 <= T1 + 0.05mm。