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1. 发明授权

US10646976B2 Method for producing substrate 有权
公开(公告)号：US10646976B2
公开(公告)日：2020-05-12
申请号：US15682821
申请日：2017-08-22
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Yoko Ishitsuka , Atsushi Watabe , Masaki Takeuchi
IPC分类号： B24B29/00 , B24B7/07 , B24B1/00 , B24B37/16 , B24B23/02
摘要： There is furnished a working tool comprising a rotating shaft (6), a polishing plate (3) mounted on the shaft, an expandable elastomer sheet (4) attached to the polishing plate (3), an abrasive cloth (5) attached to the elastomer sheet (4), and means for pressing the elastomer sheet (4) at a plurality of positions under respective predetermined different pressures such that a lower surface of the abrasive cloth (5) is deformed to the desired inverted convex shape in accordance with differences of pressing force applied to the elastomer sheet (4) at the plurality of positions. A substrate is produced by bringing the inverted convexly deformed surface of the abrasive cloth (5) in contact with a substrate stock, and rotating and moving the working tool for polishing the substrate over a selected area.

2. 发明申请

US20190061109A1 GRINDING APPARATUS 审中-公开
公开(公告)号：US20190061109A1
公开(公告)日：2019-02-28
申请号：US16107538
申请日：2018-08-21
申请人： DISCO CORPORATION
发明人： Kenji Takenouchi , Takayuki Gawazawa
IPC分类号： B24D7/06 , B24B7/22 , B24B7/24 , B24B41/047 , B24B55/02 , B24B7/07 , H01L21/304
摘要： A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, the grinding apparatus further includes: a supply unit that supplies grinding water to at least the grindstone when grinding the workpiece; and a light applying unit that is disposed adjacent to the table and that applies light to a grinding surface of the grindstone grinding the workpiece held by the table. The light applying unit includes a light emission section that emits light, and a diffusion preventive wall that surrounds the light emission section and prevents diffusion of the light.

3. 发明授权

US09132521B2 Main shaft structure of tool machine 有权
标题翻译：工具机主轴结构
公开(公告)号：US09132521B2
公开(公告)日：2015-09-15
申请号：US13444084
申请日：2012-04-11
申请人： Richard Chang
发明人： Richard Chang
IPC分类号： A01B3/00 , A01B5/08 , A01B5/14 , B24B7/07 , B27C1/04
CPC分类号： B24B7/07 , B27C1/04
摘要： A main shaft structure of a tool machine includes a base, a worktable, a motor fixing seat, a cutter seat, and a cutter wheel unit. The worktable is mounted on the base. The motor fixing seat is connected to one side of the base, and another side is connected with the cutter seat. Two ends of the cutter seat respectively have bearing recesses and first positioning portions close to the bearing recesses. The cutter wheel unit is coupled to the cutter seat. Two ends of the cutter wheel unit are provided with bearing seats which are placed into the bearing recesses. The bearing seats have second positioning portions to connect with the first positioning portions, so that the cutter wheel unit can be detached from the cutter seat quickly.
摘要翻译：工具机的主轴结构包括基座，工作台，马达固定座，切割座和切割轮单元。工作台安装在底座上。马达固定座与基座的一侧连接，另一侧与刀座连接。刀座的两端分别具有靠近轴承凹部的轴承凹部和第一定位部。切割轮单元联接到切割器座。切割轮单元的两端设置有放置在轴承凹槽中的轴承座。轴承座具有与第一定位部分连接的第二定位部分，使得切割轮单元能够快速地从切割器座脱离。

4. 发明申请

US20100291840A1 SYSTEM AND METHOD FOR CONDITIONING CHEMICAL MECHANICAL POLISHING APPARATUS USING MULTIPLE CONDITIONING DISKS 审中-公开
标题翻译：使用多个调节盘调节化学机械抛光装置的系统和方法
公开(公告)号：US20100291840A1
公开(公告)日：2010-11-18
申请号：US12464223
申请日：2009-05-12
申请人： Soon Kang HUANG , Kun-Ku HUNG , Zin-Chang WEI , Chyi Shyuan CHERN
发明人： Soon Kang HUANG , Kun-Ku HUNG , Zin-Chang WEI , Chyi Shyuan CHERN
IPC分类号： B24B1/00 , B24B7/07
CPC分类号： B24B53/003 , B24B53/017
摘要： A chemical mechanical polishing (CMP) apparatus provides for polishing semiconductor wafers and for conditioning the polishing pad of the CMP apparatus using multiple conditioning disks at the same time. The conditioning disks may be moved together or independently along the surface of polishing pad to condition the entire surface of the rotating polishing pad.
摘要翻译：化学机械抛光（CMP）装置提供用于抛光半导体晶片并且同时使用多个调节盘来调节CMP设备的抛光垫。调理盘可以沿着抛光垫的表面一起移动或独立地移动，以调节旋转抛光垫的整个表面。

5. 发明申请

US20100197205A1 GRINDING DEVICE USING ULTRASONIC VIBRATION 审中-公开
标题翻译：使用超声波振动的研磨装置
公开(公告)号：US20100197205A1
公开(公告)日：2010-08-05
申请号：US11993427
申请日：2006-06-21
申请人： Kazumasa Ohnishi
发明人： Kazumasa Ohnishi
IPC分类号： B24B7/07
CPC分类号： B24B1/04 , B24B41/0475
摘要： A grinding device (30) for grinding an object (31) at high accuracy has a support table (32) on which the object (31) is supported and fixed, a vertically movable rotating shaft (34) arranged above the support table, a drive device (35) for vertically moving the rotating shaft, a drive device (36) for rotating the rotating shaft, an elastic body (37) fixed to a base section of the rotating shaft, an annular grind stone (38) provided to a bottom of the elastic body, ultrasonic vibrators (39) arranged on the elastic body, and a transmission unit (41) for transmitting electric energy to the ultrasonic vibrators, in which the elastic body is an annular elastic body and a connection plate (42) is provided between the annular elastic body and the base section of the rotating shaft under such condition that the connection plate and the annular elastic body are connected by connection means (45) having alternately arranged connection sections and space sections and each ultrasonic vibrator is arranged at a predetermined position of the elastic body.
摘要翻译：用于高精度地研磨物体（31）的研磨装置（30）具有支撑并固定物体（31）的支撑台（32），设置在支撑台上方的可上升方向的旋转轴（34），用于使旋转轴垂直移动的驱动装置（35），用于使旋转轴旋转的驱动装置（36），固定到旋转轴的基部的弹性体（37），设置在旋转轴弹性体的底部，布置在弹性体上的超声波振动器（39）和用于将电能传递到超声波振动器的传输单元（41），其中弹性体是环形弹性体和连接板（42）设置在环形弹性体和旋转轴的基部之间，在连接板和环形弹性体通过具有交替布置的连接部分和空间部分的连接装置（45）连接的条件下，并且每个超声波振动器布置在弹性体的预定位置。

6. 发明申请

US20080090505A1 Wafer grinding method 有权
标题翻译：晶圆磨削法
公开(公告)号：US20080090505A1
公开(公告)日：2008-04-17
申请号：US11906853
申请日：2007-10-04
申请人： Shinji Yoshida , Osamu Nagai
发明人： Shinji Yoshida , Osamu Nagai
IPC分类号： B24B7/07
CPC分类号： B24B7/228 , B24B1/00 , Y10S438/959
摘要： A recessed portion is formed in an area, of a rear surface of a wafer, corresponding to a device formation area is formed by a rough grinding wheel of a rough grinding unit and an annular protruding portion is concurrently formed around the recessed portion. The inner circumferential lateral surface of the recessed portion is next ground by a finishing grinding wheel of a finishing grinding unit and the bottom surface is subsequently ground.
摘要翻译：通过粗磨单元的粗砂轮形成与晶片的后表面对应的区域的凹部，并且在凹部周围同时形成环状的突出部。凹陷部分的内圆周侧表面由精磨机组的精磨砂轮接下来研磨，底面随后研磨。

7. 发明授权

US5681211A Drop-on grinding bit for a grinding apparatus 失效
标题翻译：用于研磨设备的滴入磨头
公开(公告)号：US5681211A
公开(公告)日：1997-10-28
申请号：US602948
申请日：1996-02-16
申请人： Richard K. Wiand
发明人： Richard K. Wiand
IPC分类号： B24B7/08 , B24B7/20 , B24B7/22 , B24B7/24 , B24B7/30 , B24B9/00 , B24B9/10 , B24B9/14 , B24B27/02 , B24B45/00 , B24B55/02 , B24D7/16 , B24D7/18 , B24B7/07
CPC分类号： B24B7/22 , B24B27/02 , B24B45/006 , B24B55/02 , B24B7/08 , B24B7/20 , B24B7/24 , B24B7/30 , B24B9/00 , B24B9/10 , B24B9/14 , B24D7/16 , B24D7/18
摘要： A grinding wheel assembly to be mounted on a vertical drive shaft extending from an electric motor through a horizontal table of a grinding apparatus. The grinding wheel assembly includes a core element that is rigidly secured to the drive shaft. A drop-on cylindrical grinding bit of the grinding bit assembly is slidably engaged onto a cylindrical portion of the core element. A slot is formed in the cylindrical portion of the core element and a ridge is formed on the internal bore of the grinding bit so that when the grinding bit is placed on the core element, the grinding bit will rotate upon rotation of the drive shaft.
摘要翻译：一种砂轮组件，其安装在从电动机通过研磨装置的水平台延伸的垂直驱动轴上。砂轮组件包括刚性地固定到驱动轴的芯元件。研磨钻头组件的下落式圆柱形磨头可滑动地接合到芯元件的圆柱形部分上。在芯元件的圆柱形部分中形成有槽，并且在磨头的内孔上形成有脊，使得当研磨钻头放置在芯元件上时，磨头将在驱动轴旋转时旋转。

8. 发明授权

US3354587A Grinding machine control system 失效
标题翻译：磨床控制系统
公开(公告)号：US3354587A
公开(公告)日：1967-11-28
申请号：US37203264
申请日：1964-06-02
申请人： PETTIBONE MULLIKEN CORP
发明人： JANIS JR VINCENT , BHATIA GUL P
IPC分类号： B24B7/07 , B24B49/16
CPC分类号： B24B7/075 , B24B49/16

9. 发明授权

US3253368A Surface conditioning grinding machine 失效
标题翻译：表面处理磨床
公开(公告)号：US3253368A
公开(公告)日：1966-05-31
申请号：US31470663
申请日：1963-10-08
申请人： PETTIBONE MULLIKEN CORP
发明人： VEKOVIUS CHARLES W
IPC分类号： B24B7/07
CPC分类号： B24B7/075

10. 发明授权

US3128578A Surface grinder 失效
标题翻译：平面磨床
公开(公告)号：US3128578A
公开(公告)日：1964-04-14
申请号：US22093162
申请日：1962-07-18
申请人： MORRIS PLAN COMPANY OF CEDAR R
发明人： BALL JAMES A
IPC分类号： B24B7/07 , B24B27/00
CPC分类号： B24B7/07 , B24B27/0046

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