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1. 发明申请

US20040247930A1 Composite reactive multilayer foil 有权
标题翻译：复合反应多层箔
公开(公告)号：US20040247930A1
公开(公告)日：2004-12-09
申请号：US10761440
申请日：2004-01-21
发明人： Timothy P. Weihs , Todd Hufnagel , Omar Knio , Michael Reiss , David van Heerden , Howard Feldmesser
IPC分类号： C25D007/04
CPC分类号： B23K35/0238 , B23K1/0006 , B23K20/00 , B23K20/06 , B23K20/08 , B23K20/165 , B23K28/00 , B23K35/0233 , B23K35/34 , B32B15/01 , B32B15/017 , B32B18/00 , B32B2311/24 , C04B37/006 , C04B37/026 , C04B2235/6562 , C04B2235/6565 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/368 , C04B2237/40 , C04B2237/402 , C04B2237/60 , C04B2237/68 , C04B2237/708 , C04B2237/72 , C04B2237/78 , C06B21/0083 , C06B45/14 , C21D2211/008 , C23C14/14 , F24V30/00 , H05K3/3463 , H05K3/3494 , H05K2203/0405 , H05K2203/1163 , Y10S72/70 , Y10S228/902 , Y10S428/924 , Y10S428/926 , Y10S428/94 , Y10S428/941 , Y10T29/302 , Y10T29/308 , Y10T29/49925 , Y10T29/49929 , Y10T156/1002 , Y10T428/12028 , Y10T428/12063 , Y10T428/12069 , Y10T428/12076 , Y10T428/1209 , Y10T428/12229 , Y10T428/12361 , Y10T428/12431 , Y10T428/12438 , Y10T428/12451 , Y10T428/12493 , Y10T428/1259 , Y10T428/12632 , Y10T428/12736 , Y10T428/1275 , Y10T428/12778 , Y10T428/12819 , Y10T428/12903 , Y10T428/12944 , Y10T428/24942 , Y10T428/25 , Y10T428/265 , Y10T428/2993 , Y10T428/31678
摘要： Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt the joining materials, which upon cooling will form a strong bond, joining two or more bulk materials.
摘要翻译：活性箔及其用途被提供为例如在点燃，接合和推进中有用的局部热源。改进的活性箔优选是独立的多层箔结构，其由选自在放热和自蔓延反应中将彼此反应的材料的交替层组成。当箔反应时，该箔片提供高度局部化的热能，其可以被应用于例如接合层，或者直接地应用于待接合的散装材料。这种箔片热源允许在几乎任何环境（例如空气，真空，水等）中在室温下快速结合。如果使用接合材料，箔反应将提供足够的热量以熔化接合材料，其在冷却时将形成强结合，连接两种或更多种散装材料。

2. 发明授权

US5538176A Method of forming a ball end for a solder wire 失效
公开(公告)号：US5538176A
公开(公告)日：1996-07-23
申请号：US361190
申请日：1994-12-21
申请人： Miki Hasegawa , Chojiro Kuriyama
发明人： Miki Hasegawa , Chojiro Kuriyama
IPC分类号： H01L21/60 , B23K35/02 , B23K35/14
CPC分类号： H01L24/85 , B23K35/0244 , H01L24/48 , H01L24/78 , H01L2224/05599 , H01L2224/45015 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/48799 , H01L2224/78301 , H01L2224/85043 , H01L2224/85075 , H01L2224/85181 , H01L2224/85205 , H01L24/45 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3025 , Y10S228/902
摘要： A method is provided for forming a ball at a lower end of a material solder wire which is arranged generally vertically. The method comprises the steps of: forming an upward stream of an oxygen-free gas surrounding the solder wire; bringing a lateral flame of combustion to a ball forming position adjacent to the upward gas stream but short of the solder wire to thermally melt the lower end of the solder wire into a ball; and causing the lower ball end of the solder wire to solidify in the upward gas stream.

3. 发明授权

US5222654A Hot pressure welding of hot steel stock 失效
标题翻译：热钢焊接热压焊接
公开(公告)号：US5222654A
公开(公告)日：1993-06-29
申请号：US770488
申请日：1991-10-03
申请人： Masami Oki , Hitoshi Teshigawara , Takao Taka , Yasuto Fukada , Yutaka Suzuki , Seiji Okada
发明人： Masami Oki , Hitoshi Teshigawara , Takao Taka , Yasuto Fukada , Yutaka Suzuki , Seiji Okada
IPC分类号： B21B1/26 , B21B15/00 , B23K20/00 , B23K20/02 , B23K20/04 , B23K20/24
CPC分类号： B21B15/0085 , B23K20/00 , B23K20/028 , B23K20/04 , B23K20/24 , B21B1/26 , Y10S228/902
摘要： A method of carrying out hot pressure welding of hot steel stock is disclosed, which is effective for achieving a continuous hot rolling line. The hot steel stock to be joined is subjected to butt joining or lap joining in a reducing atmosphere under pressure while under hot conditions.

4. 发明授权

US4860938A Automated method of brazing 失效
标题翻译：钎焊自动化方法
公开(公告)号：US4860938A
公开(公告)日：1989-08-29
申请号：US215863
申请日：1988-07-06
申请人： Clair D. Clark
发明人： Clair D. Clark
IPC分类号： B23K1/00
CPC分类号： B23K1/00 , B23K2201/06 , Y10S228/902
摘要： An automated method of brazing to join two metal parts together at a joint with a braze alloy. The two parts are moved to a brazing station and maintained in a fixed position. The two metal parts are heated at the joint at a high heat rate to a predetermined temperature which exceeds the temperature that would melt the braze alloy and less than a temperature that would cause degradation of the metal parts. The temperature of the metal parts in close proximity to the joint is detected and when the first predetermined temperature is reached, the heating rate is reduced to a lower heat rate sufficient to keep the braze alloy in a liquidous state. The braze alloy is introduced to the joint between the two metal parts while they are being heated at the lower heat rate to join the two parts together and then the joined two metal parts are removed from the brazing station.
摘要翻译：一种钎焊的自动化方法，在钎焊合金的接头处将两个金属部件连接在一起。将两个部件移动到钎焊站并保持固定位置。两个金属部件在接头处以高热速率加热到超过熔化钎焊合金的温度并小于将导致金属部件劣化的温度的预定温度。检测靠近接头的金属部件的温度，当达到第一预定温度时，加热速率降低到足以保持钎焊合金处于液态状态的较低热速。钎焊合金被引入到两个金属部件之间的接头处，同时以较低的加热速率加热，以将两个部件接合在一起，然后将连接的两个金属部件从钎焊站移除。

5. 发明授权

US4724995A Pin joining method and apparatus 失效
标题翻译：针连接方法和装置
公开(公告)号：US4724995A
公开(公告)日：1988-02-16
申请号：US890568
申请日：1986-07-25
申请人： Friedrich Zettl
发明人： Friedrich Zettl
IPC分类号： A44C27/00 , B23K3/08 , B23K5/00 , B23K31/02 , B23K1/02
CPC分类号： B23K3/087 , A44C27/00 , B23K5/006 , Y10S228/902 , Y10T29/49595
摘要： In a method and apparatus for the automatic joining of pins to the surfaces of articles, especially of ear pins to associated pieces of jewelry, the joining step utilizes flame soldering in the automatic joining process in order to reduce costs for small lot manufacturing and firm joining of the pin to the article. The apparatus has an article receptacle movably disposed on a base plate which also carries a solder supply gun, a pin supply and support structure and a soldering flame nozzle, all being movable between a remote rest position and an operating position in which they are properly located for performing the pin soldering task.
摘要翻译：在用于将销钉自动地连接到物品表面的方法和装置中，特别是耳钉到相关联的首饰件的接合步骤中，接合步骤在自动接合过程中使用火焰焊接，以便降低小批量制造和坚固连接的成本的针脚到文章。该装置具有可移动地设置在基板上的物品插座，其还承载焊料供应枪，销供应和支撑结构以及焊接火焰喷嘴，所有这些都可在远程静止位置和它们正确定位的操作位置之间移动用于执行引脚焊接任务。

6. 发明授权

US3286340A Fabrication of semiconductor units 失效
标题翻译：半导体装置的制造
公开(公告)号：US3286340A
公开(公告)日：1966-11-22
申请号：US34807164
申请日：1964-02-28
申请人： PHILCO CORP
发明人： KRITZLER WILLIAM R , SIRVYDAS VICTOR C
IPC分类号： H01L23/488 , H01L29/00
CPC分类号： H01L24/85 , H01L24/45 , H01L24/49 , H01L24/78 , H01L29/00 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/49 , H01L2224/78301 , H01L2224/85099 , H01L2224/85201 , H01L2224/85203 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , Y10S228/902 , H01L2924/00 , H01L2924/20752 , H01L2224/05599 , H01L2224/85399
摘要： 1,086,254. Semi-conductor devices. PHILCOFORD CORPORATION. Feb. 25, 1965 [Feb. 28, 1964], No. 8244/65. Heading H1K. A connection is made to the surface of a semi-conductor body by attaching a fusible wire connector to the surface of the body, enlarging the free end of the wire by thermally fusing the wire and making connection to the enlarged end of the wire. A series of gold wires 30 are joined to the surface 31 of silicon body 29 by thermocompression bonding at "nailheads" 32. When joined initially, the wires 30 are upstanding and each has a blob on the upper end thereof formed by the process of flamecutting the wire from its supply reel after bonding the other end to the body 29. The blobs are brought into contiguity and then melted by a flame to give a single blob 34 which is enlarged and displaced towards the body 29 by the action of the flame. The body 29 which is mounted on a stud 27 is placed within a holder together with stud 26 having thereon solder 59 which solder is brought into contact with gold blob 34 and melted to surround the blob and thus make contact therewith. The device may have up to 10 wires joined in a blob and is said to be suitable for high frequency and large current since the skin effect is minimized by a number of small wires.

7. 发明授权

US2220741A Seal for lead-in conductors 失效
标题翻译：导线导体密封
公开(公告)号：US2220741A
公开(公告)日：1940-11-05
申请号：US26656939
申请日：1939-04-07
申请人： GEN ELECTRIC
发明人： THORSON HARRY L
IPC分类号： C03C3/102 , C03C3/108 , C03C3/112 , C03C3/115 , C03C27/02 , C03C29/00 , H01J5/40 , H01J7/18 , H01J19/50 , H01J19/66
CPC分类号： C03C29/00 , C03C3/102 , C03C3/108 , C03C3/112 , C03C3/115 , C03C27/02 , H01J5/40 , H01J7/186 , H01J19/50 , H01J2893/0008 , H01J2893/0035 , Y10S228/902 , Y10S228/903

8. 发明授权

US2191631A Brazing of thin metal structures 失效
标题翻译：薄金属结构的钎焊
公开(公告)号：US2191631A
公开(公告)日：1940-02-27
申请号：US23208438
申请日：1938-09-28
申请人： GEN MOTORS CORP
发明人： SHUTTS LEROY W , ROSENBERG PHILIP S
IPC分类号： B23K1/00
CPC分类号： B23K1/0002 , Y10S29/039 , Y10S228/902 , Y10T29/49373

9. 发明授权

US2100294A Method and machine for producing brazed seams in wire cloth 失效
标题翻译：生产铜丝焊缝的方法和机器
公开(公告)号：US2100294A
公开(公告)日：1937-11-23
申请号：US2644635
申请日：1935-06-13
申请人： EASTWOOD NEALLY CORP
发明人： WEBB NELSON W
IPC分类号： B23K1/00
CPC分类号： B23K1/0008 , Y10S228/902

10. 发明授权

US1999854A Method of welding 失效
公开(公告)号：US1999854A
公开(公告)日：1935-04-30
申请号：US66312233
申请日：1933-03-28
申请人： AIR REDUCTION
发明人： ANDERSON JAMES L
IPC分类号： B23K28/02
CPC分类号： B23K28/02 , Y10S228/902

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