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1. 发明公开

US20240153708A1 WOUND CAPACITOR PACKAGE STRUCTURE 审中-公开
公开(公告)号：US20240153708A1
公开(公告)日：2024-05-09
申请号：US18170536
申请日：2023-02-17
申请人： APAQ TECHNOLOGY CO., LTD.
发明人： CHIEH LIN , CHUNG-JUI SU , CHENG-HAO LU
IPC分类号： H01G4/224 , H01G4/242 , H01G4/32
CPC分类号： H01G4/224 , H01G4/242 , H01G4/32
摘要： A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.

2. 发明授权

US10629378B2 Multilayer capacitor 有权
公开(公告)号：US10629378B2
公开(公告)日：2020-04-21
申请号：US16018767
申请日：2018-06-26
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jong Pil Lee , Jin Kyung Joo , Young Key Kim , Taek Jung Lee
IPC分类号： H01G4/30 , H01G4/232 , H01G4/012 , H01G4/38 , H01G4/12 , H01G4/242
CPC分类号： H01G4/232 , H01G4/012 , H01G4/12 , H01G4/30 , H01G4/385 , H01G4/1227 , H01G4/242
摘要： A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be electrically connected to the first and second internal electrodes, respectively; a connection electrode penetrating through the body to thereby be electrically connected to the third internal electrode; and a third external electrode disposed on the body to be electrically connected to the connection electrode.

3. 发明授权

US10079105B2 Multi-layer ceramic capacitor assembly 有权
公开(公告)号：US10079105B2
公开(公告)日：2018-09-18
申请号：US15399029
申请日：2017-01-05
申请人： SAMHWA CAPACITOR CO., LTD.
发明人： Young Joo Oh , Jung Rag Yoon , Young Min Yoo
IPC分类号： H01G4/228 , H01G2/06 , H01G4/30 , H01G4/008 , H01G4/12 , H01G4/012 , H01G4/242 , H01G4/258
CPC分类号： H01G4/30 , H01G4/0085 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/242 , H01G4/258 , H01G4/38 , H01G4/40
摘要： A multi-layer ceramic capacitor assembly includes a first terminal assembly member formed by arranging first protruded members at specific intervals, a second terminal assembly member formed by arranging second protruded members at specific intervals so that they face the respective first protruded members, insulated heat dissipation members supported by the first protruded members and the second protruded members and disposed therein, and multi-layer ceramic capacitors alternately disposed between the insulated heat dissipation members so that each multi-layer ceramic capacitor comes into contact with one side and the other side of each insulated heat dissipation member in a first direction, the end on one side of the multi-layer ceramic capacitor in a second direction orthogonal to the first direction is connected to the first terminal assembly member, and the end on the other side of the multi-layer ceramic capacitor in the second direction is connected to the second terminal assembly member.

4. 发明申请

US20170103852A1 ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20170103852A1
公开(公告)日：2017-04-13
申请号：US15286122
申请日：2016-10-05
申请人： TDK CORPORATION
发明人： Norihisa ANDO , Masahiro MORI , Sunao MASUDA , Kayou KUSANO
IPC分类号： H01G4/002 , H01G4/242 , H01G4/12 , H01G4/30
CPC分类号： H01G4/002 , H01C7/02 , H01C7/13 , H01G2/06 , H01G2/14 , H01G4/1227 , H01G4/1236 , H01G4/232 , H01G4/242 , H01G4/30 , H01G4/40 , H05K3/3426 , H05K2201/10015 , H05K2201/10181 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053 , H05K2201/10537 , H05K2201/10757 , H05K2201/10946 , H05K2201/10962 , H05K2201/2045
摘要： A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

5. 发明授权

US09589729B2 Multilayer ceramic capacitor 有权
标题翻译：多层陶瓷电容器
公开(公告)号：US09589729B2
公开(公告)日：2017-03-07
申请号：US14855571
申请日：2015-09-16
申请人： Murata Manufacturing Co., Ltd.
发明人： Hiroyuki Wada , Kohei Shimada , Kenji Takagi , Tomomi Koga , Tomotaka Hirata , Hitoshi Nishimura , Hiroki Awata , Sui Uno
IPC分类号： H01G4/30 , H01G2/24 , H01G4/12 , H01G4/224 , H01G4/012 , H01G4/242 , H05K1/18 , H05K3/30 , H01G4/232
CPC分类号： H01G4/30 , H01G2/24 , H01G4/012 , H01G4/12 , H01G4/1209 , H01G4/1227 , H01G4/1236 , H01G4/1245 , H01G4/224 , H01G4/232 , H01G4/242 , H01G4/248 , H05K1/181 , H05K3/30 , H05K2201/10015
摘要： A multilayer ceramic capacitor includes a laminated body including an inner layer portion including ceramic dielectric layers and internal electrodes, and outer layer portions including ceramic dielectric layers. External electrodes connected to the internal electrodes are provided on both ends of the laminated body. The main constituent of the inner layer portion is a perovskite-type compound represented by ABO3. The outer layer portions include first outer layers and second outer layers respectively containing oxides that differ from each other in main constituents, and boundary reaction layers are provided between the first outer layers and the second outer layers. First ceramic dielectric layers outside the boundary reaction layers differ in color from second ceramic dielectric layers inside the boundary reaction layers.
摘要翻译：多层陶瓷电容器包括层叠体，其包括包含陶瓷电介质层和内部电极的内层部分和包括陶瓷电介质层的外层部分。连接到内部电极的外部电极设置在层叠体的两端。内层部分的主要成分是由ABO 3表示的钙钛矿型化合物。外层部分包括分别包含在主要成分中彼此不同的氧化物的第一外层和第二外层，并且边界反应层设置在第一外层和第二外层之间。边界反应层之外的第一陶瓷电介质层的颜色与边界反应层内部的第二陶瓷介电层的颜色不同。

6. 发明授权

US08988851B1 Capacitor including four terminal electrodes 有权
标题翻译：电容器包括四个端子电极
公开(公告)号：US08988851B1
公开(公告)日：2015-03-24
申请号：US14503464
申请日：2014-10-01
申请人： Murata Manufacturing Co., Ltd.
发明人： Takashi Sawada , Shigekatsu Yamamoto
IPC分类号： H01G4/30 , H01G4/12 , H01G4/008 , H01G4/248 , H01G4/012
CPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/242 , H01G4/248
摘要： A capacitor includes first and second grounding terminal electrodes each including first and second electrode layers. The first electrode layers are provided on third and fourth side surfaces. The second electrode layers are provided on the first electrode layers. The first and the second electrode layers each include Si and a conductive material. A ratio by weight of Si in the first electrode layer is higher than a ratio by weight of Si in the second electrode layer.
摘要翻译：电容器包括每个包括第一和第二电极层的第一和第二接地端子电极。第一电极层设置在第三和第四侧面上。第二电极层设置在第一电极层上。第一和第二电极层各自包括Si和导电材料。第一电极层中的Si的重量比高于第二电极层中的Si的重量比。

7. 发明申请

US20080033496A1 FILTERED FEEDTHROUGH ASSEMBLY AND METHOD OF MANUFACTURE 有权
标题翻译：过滤生产的组装和制造方法
公开(公告)号：US20080033496A1
公开(公告)日：2008-02-07
申请号：US11872452
申请日：2007-10-15
申请人： Rajesh Iyer , Susan Tettemer , John Tardiff , Shawn Knowles
发明人： Rajesh Iyer , Susan Tettemer , John Tardiff , Shawn Knowles
IPC分类号： A61N1/362 , H01G4/35
CPC分类号： H01G4/242 , H01G2/106 , H01G4/35 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49004 , Y10T29/49078 , Y10T29/4913 , Y10T29/49165 , Y10T29/49171 , Y10T29/49176
摘要： A method for attaching a capacitor to the feedthrough assembly of a medical device is provided. The capacitor includes a lower surface, and the feedthrough assembly includes a ferrule having a cavity therethrough for receiving at least one terminal pin. The feedthrough assembly is configured to be coupled to the medical device, and the cavity is configured to receive therein an insulating structure having an upper surface. The method comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the terminal pin such that the first washer and the body of epoxy are between the lower surface of the capacitor and the upper surface of the insulating structure. The body of epoxy is cured to couple the capacitor to the insulating structure. During curing, the body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the first washer.
摘要翻译：提供了一种用于将电容器附接到医疗装置的馈通组件的方法。电容器包括下表面，并且馈通组件包括具有穿过其中的空腔的套圈，用于容纳至少一个端子销。馈通组件被配置为联接到医疗装置，并且空腔构造成在其中容纳具有上表面的绝缘结构。该方法包括将第一垫圈穿过端子销，并将环氧体与第一垫圈接触。电容器位于端子销上方，使得第一垫圈和环氧树脂体位于电容器的下表面和绝缘结构的上表面之间。环氧树脂体被固化以将电容器耦合到绝缘结构。在固化期间，环氧树脂体通过套圈，绝缘结构，电容器和第一垫圈基本上限制在上表面和下表面之间。

8. 发明授权

US4347551A Ceramic capacitor with terminals in sockets 失效
标题翻译：带插座端子的陶瓷电容器
公开(公告)号：US4347551A
公开(公告)日：1982-08-31
申请号：US157864
申请日：1980-06-09
申请人： Yukio Tanaka
发明人： Yukio Tanaka
IPC分类号： H01G4/12 , H01G4/228 , H01G4/242 , H01G1/14
CPC分类号： H01G4/242 , H01G4/228 , Y10T29/435
摘要： A ceramic capacitor arrangement includes a cylindrical ceramic body having a socket formed at each end thereof, and an electrode film deposited on each end of the ceramic body. A terminal pin is pressure-fitted into each socket and is temporarily held therein. A solder bead is deposited on each of the electrode film to secure the terminal pin rigidly in each socket.
摘要翻译：一种陶瓷电容器装置，其包括：圆筒形陶瓷体，其具有在其两端形成的插座和沉积在陶瓷体的每一端的电极膜。端子销被压配合到每个插座中并暂时保持在其中。在每个电极膜上沉积焊珠，以将端子针牢固地固定在每个插座中。

9. 发明申请

US20170301471A1 Multi-Layer Ceramic Capacitor and Method of Producing the Same 审中-公开
公开(公告)号：US20170301471A1
公开(公告)日：2017-10-19
申请号：US15488102
申请日：2017-04-14
申请人： Taiyo Yuden Co., Ltd.
发明人： Ryo Ono , Tetsuhiko Fukuoka
IPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/242
CPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/242
摘要： A multi-layer ceramic capacitor includes: a body, a first external electrode, and a second external electrode. The body includes a first end surface and a second end surface that face each other, a side surface that extends between the first end surface and the second end surface, a first recess that extends along a first ridge of the first end surface and the side surface, a second recess that extends along a second ridge of the second end surface and the side surface, a first internal electrode that is drawn to the first end surface and the first recess, and a second internal electrode that faces the first internal electrode and is drawn to the second end surface and the second recess. The first external electrode covers the body from the first end surface. The second external electrode covers the body from the second end surface.

10. 发明申请

US20170169949A1 Micro- and Nanoscale Capacitors that Incorporate an Array of Conductive Elements Having Elongated Bodies 审中-公开
公开(公告)号：US20170169949A1
公开(公告)日：2017-06-15
申请号：US15224856
申请日：2016-08-01
申请人： California Institute of Technology
发明人： Harish Manohara , Linda Y. Del Castillo , Mohammed M. Mojarradi
IPC分类号： H01G4/30 , H01G4/12 , H01G4/01 , H01G4/14 , H01G4/242
CPC分类号： H01G4/30 , B82Y10/00 , H01G4/01 , H01G4/1209 , H01G4/14 , H01G4/232 , H01G4/242 , H01G4/33 , H01G4/38 , H01L28/60 , H01L28/86 , H01L28/90
摘要： Systems and methods in accordance with embodiments of the invention implement micro- and nanoscale capacitors that incorporate a conductive element that conforms to the shape of an array elongated bodies. In one embodiment, a capacitor that incorporates a conductive element that conforms to the shape of an array of elongated bodies includes: a first conductive element that conforms to the shape of an array of elongated bodies; a second conductive element that conforms to the shape of an array of elongated bodies; and a dielectric material disposed in between the first conductive element and the second conductive element, and thereby physically separates them.

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