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    • 6. 发明申请
    • METHOD FOR ADHESION OF RESIN MATERIAL COMPRISING OXYMETHYLENE POLYMER, AND STRUCTURE
    • 粘合含有甲基丙烯聚合物的树脂材料的方法和结构
    • US20100041854A1
    • 2010-02-18
    • US12517472
    • 2007-12-03
    • Akira OkamuraSatoshi Nagai
    • Akira OkamuraSatoshi Nagai
    • B32B37/06C08G16/02B32B38/00
    • C09J159/02B29C65/02B29C66/71B29C66/7212B29C66/73115B29C66/73116B29C66/91411B29C66/91931B29C66/91935B29K2059/00B29K2105/0008B29K2105/0026B29K2105/0044B29K2105/126B29K2105/16B29K2309/08B29K2309/10C09J159/00
    • Provided are a method of bonding resin materials for bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), and a structure obtained by the bonding method. The method includes the steps of: preparing as the resin material (Y) an oxymethylene-based polymer composition (B) satisfying the following conditions (1) and (2); or preparing as the resin material (Y) the resin material (X) or another resin material and providing the oxymethylene-based polymer composition (B) between the resin material (Y) and the resin material (X); and heating the resin materials: (1) the oxymethylene-based polymer composition (B) has a melting point lower than that of the oxymethylene-based polymer (A), and a difference in melting point between the composition and the polymer is smaller than 5° C.; and (2) 50% or more of a peak area determined from a peak showing the molten state of the oxymethylene-based polymer composition (B) measured by DSC is present in a temperature region lower than the peak temperature of the oxymethylene-based polymer (A) by 5° C. or more.
    • 提供一种将含有甲醛系聚合物(A)和树脂材料(Y)的树脂材料(X)的接合用树脂材料的接合方法和通过接合方法得到的结构。 该方法包括以下步骤:制备满足以下条件(1)和(2)的甲醛基聚合物组合物(B)的树脂材料(Y); 或在树脂材料(Y)和树脂材料(X)之间制备作为树脂材料(Y)的树脂材料(X)或其它树脂材料并提供氧化亚甲基类聚合物组合物(B))。 加热树脂材料:(1)甲醛系聚合物组合物(B)的熔点低于甲醛系聚合物(A)的熔点,组合物与聚合物之间的熔点差小于 5°C。 和(2)从通过DSC测定的表示甲醛系聚合物组合物(B)的熔融状态的峰确定的峰面积的50%以上存在于低于甲醛系聚合物的峰值温度的温度区域 (A)5℃以上。