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    • 1. 发明授权
    • High energy, real time capable, direct radiation conversion X-ray imaging system for Cd-Te and Cd-Zn-Te based cameras
    • 高能量,实时能力,直接辐射转换用于Cd-Te和Cd-Zn-Te相机的X射线成像系统
    • US08530850B2
    • 2013-09-10
    • US11226877
    • 2005-09-14
    • Konstantinos SpartiotisTuomas Pantsar
    • Konstantinos SpartiotisTuomas Pantsar
    • G01T1/24
    • G01T1/24H01L27/14634H01L31/0296H04N5/325H04N5/3651H04N5/3655H04N5/367
    • A calibrated real-time, high energy X-ray imaging system is disclosed which incorporates a direct radiation conversion, X-ray imaging camera and a high speed image processing module. The high energy imaging camera utilizes a Cd—Te or a Cd—Zn—Te direct conversion detector substrate. The image processor includes a software driven calibration module that uses an algorithm to analyze time dependent raw digital pixel data to provide a time related series of correction factors for each pixel in an image frame. Additionally, the image processor includes a high speed image frame processing module capable of generating image frames at frame readout rates of greater than ten frames per second to over 100 frames per second. The image processor can provide normalized image frames in real-time or can accumulate static frame data for substantially very long periods of time without the typical concomitant degradation of the signal-to-noise ratio.
    • 公开了一种校准的实时高能X射线成像系统,其包括直接辐射转换,X射线成像相机和高速图像处理模块。 高能摄像机采用Cd-Te或Cd-Zn-Te直接转换检测器基板。 图像处理器包括软件驱动的校准模块,其使用算法来分析与时间相关的原始数字像素数据,以为图像帧中的每个像素提供与时间相关的一系列校正因子。 此外,图像处理器包括能够以大于十帧/秒至超过100帧/秒的帧读出速率生成图像帧的高速图像帧处理模块。 图像处理器可以实时地提供归一化的图像帧,或者可以在非常长的时间段内累积静态帧数据,而不会典型地伴随着信噪比的降低。
    • 5. 发明授权
    • Radiation imaging device and system
    • 辐射成像装置和系统
    • US07189971B2
    • 2007-03-13
    • US10154264
    • 2002-05-23
    • Konstantinos SpartiotisKimmo Petteri Puhakka
    • Konstantinos SpartiotisKimmo Petteri Puhakka
    • G01T1/24
    • G01T1/2928H01L27/14658H01L27/14661
    • An x-ray and gamma-ray radiation energy imaging device has its semiconductor detector substrate and semiconductor readout/processing substrate both mounted on opposite sides of, and electrically communicating through, an intermediate substrate. The substrates are all substantially planar with the top plan perimeter of the semiconductor readout/processing substrate falling within the top plan shadow perimeter of the corresponding semiconductor detector substrate with which it electrically communicates. Additionally, all of the readout/processing circuitry contacts of the semiconductor readout/processing substrate are disposed on the surface of the semiconductor readout/processing substrate that electrically communicates with the intermediate substrate. Substantially all electrical communication to and from the semiconductor readout/processing substrate is routed through the intermediate substrate. The intermediate substrate is a printed circuit board or similar construct. The electrical contacts between the semiconductor substrates and the intermediate substrate are accomplished using bump-bonds, conductive adhesive bonds, conductive adhesive films or a combination thereof. One or two dimensional planar arrays of semiconductor readout/processing substrates and corresponding semiconductor detector substrates can be mounted on a single intermediate substrate using “tiling” techniques known in the art to form a mosaic radiation imaging device of increased active imaging area and reduced/minimized imaging dead area.
    • X射线和γ射线能量成像装置具有其半导体检测器基板和半导体读出/处理基板,两者均安装在中间基板的相对侧并且电连通中间基板。 衬底都基本上是平面的,半导体读出/处理衬底的顶部平面周边落在与其电连通的相应的半导体检测器衬底的顶部平面阴影周边内。 此外,半导体读出/处理基板的所有读出/处理电路触点设置在与中间基板电连通的半导体读出/处理基板的表面上。 基本上所有与半导体读出/处理衬底的电连通通过中间衬底。 中间基板是印刷电路板或类似的构造。 半导体基板和中间基板之间的电接触使用凸块接合,导电粘合剂粘结,导电粘合剂膜或其组合来实现。 半导体读出/处理基板和对应的半导体检测器基板的一维或二维平面阵列可以使用本领域已知的“平铺”技术安装在单个中间基板上,以形成增加的主动成像区域并减小/最小化的马赛克辐射成像装置 成像死区。
    • 9. 发明授权
    • Multi-functional radiation/photon identifying and processing application specific integrated circuit and device
    • 多功能辐射/光子识别和处理应用专用集成电路和器件
    • US07605375B2
    • 2009-10-20
    • US11790542
    • 2007-04-26
    • Konstantinos SpartiotisTom SchulmanAnssi Leppanen
    • Konstantinos SpartiotisTom SchulmanAnssi Leppanen
    • G01T1/24
    • G01T1/17G01T1/2928
    • A radiation device includes a detector connected to a multi-functional radiation identifying and processing application specific integrated circuit. The detector includes a plurality of individual imaging cells, each imaging cell generating a charge in response to incident radiation events and outputting the generated charge at an imaging cell output. The application specific integrated circuit includes a different circuit connected respectively to a corresponding one of the imaging cell outputs, each circuit receiving and processing the generated charge received from the corresponding one imaging cell output. Each circuit includes a preamplifier for generating a voltage or current amplitude in response to the received charge, a counter, and a mode logic configured for setting the counter to perform, selectively, at least two of a) photon counting, b) analog to digital conversion of the one of the voltage amplitude and the current amplitude, and c) timing measurement of incident radiation events.
    • 辐射装置包括连接到识别和处理专用集成电路的多功能辐射的检测器。 检测器包括多个单独的成像单元,每个成像单元响应于入射的辐射事件产生电荷并在成像单元输出端输出产生的电荷。 应用专用集成电路包括分别连接到相应的一个成像单元输出的不同电路,每个电路接收并处理从相应的一个成像单元输出接收的生成的电荷。 每个电路包括用于响应于所接收的电荷产生电压或电流幅度的前置放大器,计数器和配置用于设置计数器的模式逻辑,以选择性地执行a)光子计数中的至少两个,b)模拟数字 电压幅度和电流幅度之一的转换,以及c)入射辐射事件的定时测量。