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1. 再颁专利

USRE39615E1 Adhesive compositions and copper foils and copper clad laminates using same 失效
标题翻译：粘合剂组合物和使用其的铜箔和铜包层压板
公开(公告)号：USRE39615E1
公开(公告)日：2007-05-08
申请号：US10617653
申请日：2002-10-17
申请人： Charles A. Poutasse
发明人： Charles A. Poutasse
IPC分类号： B23B3/00
CPC分类号： H05K3/386 , C08G59/02 , C08G59/06 , C08G59/40 , C08L61/04 , C09J163/00 , H05K3/022 , H05K3/384 , H05K3/385 , H05K3/389 , H05K2201/0239 , H05K2201/0355 , H05K2201/0358 , H05K2203/0315 , H05K2203/0723 , Y10S428/901 , Y10T428/24917 , Y10T428/30 , Y10T428/31511 , Y10T428/31525 , Y10T428/31529 , Y10T428/31678
摘要： The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH2, NHR1, (NHC(═NH))mNH2, R2COOH, NR12, C(O)NHR1, R2NR12, R2OH, R2SH, R2NH2 and R2NHR1, wherein R1 is a hydrocarbon group, R2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R1, OR1 or SO2C6H4—NH2; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.
摘要翻译：本发明涉及粘合剂组合物，其包含：（A）至少一种酚醛树脂树脂; 和（B）通过使（B-1）至少一种双官能环氧树脂与（B-2）至少一种由下式表示的化合物反应制备的产物：其中在式（I）和（II）中：G，T和 Q独立地为选自COOH，OH，SH，NH 2，NHR 1，（NHC（-NH））m的官能团。 NH 2，NR 2 COOH，NR 1，SO 2，C（O）NHR 2， 1，R 2，R 2，R 2，R 2，OH，R 2，其中R 1，R 2，R 2，R 2，R 2， / SUP>是烃基，R 2是亚烷基或亚烷基，m是1至约4的数; T也可以是R 1，或者1或2或更高的C 1 H 4 > -NH 2 2; 并且Q也可以是H.本发明还涉及具有粘附到其至少一个侧面的上述粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘附。本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

2. 发明授权

US06860481B2 Sheet stacking device 失效
标题翻译：纸张堆垛装置
公开(公告)号：US06860481B2
公开(公告)日：2005-03-01
申请号：US10294292
申请日：2002-11-14
申请人： Maurice Chiasson , Stephen Copley , Albert Burgun
发明人： Maurice Chiasson , Stephen Copley , Albert Burgun
IPC分类号： B65G57/03 , B65H29/36 , B65H29/34
CPC分类号： B65H29/36
摘要： A sheet stacking device for stacking sheets of generally rigid material, comprised of at least one gripper device operable to releasably grip an edge of a sheet material and gripper drive means operable to move the gripper device from a first location to a second location. A support device supports the sheet as the sheet moves from the first location to the second location. The support device has a supporting position, wherein the support device supports the sheet and a non-supporting position wherein support for the sheet is removed. A stacking platform is provided below the second location. Control means control the gripper device, the gripper drive means and the support device. The control means causes the gripper device to grip an edge of the sheet at the first location, the drive means to move the gripper device from the first location to the second location, the gripper device to release the sheet at the second location, and the support device to move from the supporting position to the non-supporting position, dropping the sheet onto the stacking platform.
摘要翻译：一种用于堆叠大致刚性材料的片材堆叠装置，其包括至少一个可操作地可释放地夹持片材边缘的夹持装置和夹持器驱动装置，该装置可操作以将夹持装置从第一位置移动到第二位置。当纸张从第一位置移动到第二位置时，支撑装置支撑纸张。支撑装置具有支撑位置，其中支撑装置支撑片材和不支撑位置，其中去除了片材的支撑。在第二位置下方提供一个堆叠平台。控制装置控制夹持装置，夹持器驱动装置和支撑装置。所述控制装置使得所述夹持装置在所述第一位置处夹持所述片材的边缘，所述驱动装置将所述夹持装置从所述第一位置移动到所述第二位置，所述夹持装置在所述第二位置释放所述片材，支撑装置从支撑位置移动到非支撑位置，将纸张落到堆叠平台上。

3. 发明授权

US06841084B2 Etching solution for forming an embedded resistor 失效
标题翻译：用于形成嵌入式电阻器的蚀刻溶液
公开(公告)号：US06841084B2
公开(公告)日：2005-01-11
申请号：US10073503
申请日：2002-02-11
申请人： Dan Lillie , Jiangtao Wang
发明人： Dan Lillie , Jiangtao Wang
IPC分类号： H05K1/16 , C23F1/02 , C23F1/28 , C23G1/02 , C23G1/06 , H01C17/24 , H01L21/02 , H01L21/3213 , H05K3/06 , B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00 , C23F3/00
CPC分类号： H05K3/067 , C23F1/28 , H01C17/2416 , H01L21/32135 , H01L28/24 , H05K1/167
摘要： A resistive etching solution containing thiourea, which is particularly suitable for etching an electrically resistive material comprised of a nickel-chromium alloy. The resistive etching solution allows for fast and effective etching of a nickel-chromium alloy in cases where the ratio of (a) copper surface area to (b) nickel/chromium surface area, is relatively large, and where fine feature etching is desired.
摘要翻译：含有硫脲的电阻蚀刻溶液，其特别适用于蚀刻由镍 - 铬合金构成的电阻材料。在（a）铜表面积与（b）镍/铬表面积的比例相对较大的情况下，以及需要精细特征蚀刻的情况下，电阻蚀刻溶液可以快速有效地蚀刻镍 - 铬合金。

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