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1. 发明申请

US20130263667A1 SYSTEM AND METHOD FOR PERFORMING ULTRASONIC PIPELINE WALL PROPERTY MEASUREMENTS 有权
标题翻译：用于执行超声管道墙体属性测量的系统和方法
公开(公告)号：US20130263667A1
公开(公告)日：2013-10-10
申请号：US13877934
申请日：2011-10-07
申请人： Arno Willem Frederik Volker , Joost Gerardus Petrus Bloom
发明人： Arno Willem Frederik Volker , Joost Gerardus Petrus Bloom
IPC分类号： G01N29/07
CPC分类号： G01N29/07 , G01B17/02 , G01N29/04 , G01N29/4418 , G01N2291/105 , G01N2291/2634
摘要： Pipeline wall thickness is measured as a function of position using ultrasound propagation. A series of predictive models is used, which define predictions of the ultrasound response signals as a function of different sets of parameters. The different sets that are determine of position dependent ultrasound speed at different sound frequencies and different spatial resolution. Successive iterative fitting process are executed, each fitting a combination of values of a successive set of parameters to the detected ultrasound response signals according to a respective model, using the values fitted values from the previous fitting process to initialize the next set of parameters for iterative fitting. At least the first model defines predictions of wave vector values as a function of circumferential position in successive rings around the pipe as sums of wave vector value for a plurality of circumferential positions in a preceding one of the rings multiplied by propagation coefficients, using propagation coefficients that depend on a first set of parameters.
摘要翻译：使用超声波传播测量管道壁厚度作为位置的函数。使用一系列预测模型，其定义了作为不同参数集合的函数的超声响应信号的预测。确定不同声音频率和不同空间分辨率下位置相关超声速度的不同集合。执行连续迭代拟合过程，其中使用来自先前拟合过程的值拟合值来初始化用于迭代的下一组参数，根据相应模型，将连续的参数集合的值的组合拟合到检测到的超声响应信号配件。至少第一模型将波导矢量值的预测定义为围绕管道的连续环中的圆周位置的函数，作为在先前一个环中的多个圆周位置乘以传播系数的波矢量值的和，使用传播系数这取决于第一组参数。

2. 发明申请

US20130303002A1 INTERCONNECT STRUCTURE AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：互连结构及其生产方法
公开(公告)号：US20130303002A1
公开(公告)日：2013-11-14
申请号：US13989245
申请日：2011-11-24
申请人： Gerrit Oosterhuis , Herman Hendrikus Maalderink , Andries Rijfers , René Jos Houben , Clemens Maria Bernardus van der Zon , Leonardus Antonius Maria Brouwers
发明人： Gerrit Oosterhuis , Herman Hendrikus Maalderink , Andries Rijfers , René Jos Houben , Clemens Maria Bernardus van der Zon , Leonardus Antonius Maria Brouwers
IPC分类号： H01R12/71 , H01R43/26
CPC分类号： H01R12/71 , B29C64/124 , B29L2031/3061 , B29L2031/3425 , B33Y80/00 , H01L23/538 , H01L2924/0002 , H01R43/26 , H05K1/0284 , H05K3/0014 , H05K3/10 , H05K2203/072 , Y10T29/49208 , H01L2924/00
摘要： There is provided a three-dimensional interconnect structure for micro-electronic devices and a method for producing such an interconnect structure. The method comprises a step wherein a backbone structure is manufactured using an additive layer-wise manufacturing process. The backbone structure comprises a three-dimensional cladding skeleton and a support structure. The cladding skeleton comprises layered freeform skeleton parts that will form the electric interconnections between the electric contacts of the interconnect structure after a conductive material is applied on the backbone structure. The support structure supports the layered freeform skeleton parts. Parts of the support structure may be removed to isolate and/or expose the electric interconnections. The cladding skeleton can be embedded by an insulating material for providing a further support.
摘要翻译：提供了用于微电子器件的三维互连结构以及用于制造这种互连结构的方法。该方法包括其中骨架结构使用添加剂层制造方法制造的步骤。骨架结构包括三维包覆骨架和支撑结构。包层骨架包括层叠的自由形骨架部件，其在导电材料施加在骨架结构上之后将形成互连结构的电触点之间的电互连。支撑结构支持分层的自由形骨架部件。可以去除支撑结构的部分以隔离和/或暴露电互连。包层骨架可以被绝缘材料嵌入以提供进一步的支撑。

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