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    • 3. 发明授权
    • Nanoelectric devices
    • 纳米器件
    • US5581091A
    • 1996-12-03
    • US352151
    • 1994-12-01
    • Martin MoskovitsJing M. Xu
    • Martin MoskovitsJing M. Xu
    • H01L45/00H01L29/06H01L21/302
    • H01L49/006B82Y10/00B82Y30/00Y10S438/962Y10S977/937Y10T29/413
    • Single-electron devices useful as diodes, transistors or other electronic components are prepared by anodizing a metal substrate in sheet or foil form electrolytically in an acid bath, to deposit thereon an oxide film having axially disposed micropores of substantially uniform diameter in the range of from about 1 to about 500 nanometers and substantially uniform depth less than the thickness of the oxide film, leaving an ultra thin oxide layer between the bottom of each pore in the metal substrate. The conductive material is deposited in the pores to form nanowires contacting the oxide layer at the bottom of the pores. Macro metal is deposited over the ends of the nanowires for external electrical contact purposes. Devices can be made according to the present invention which are suitable to exhibit single-electron tunnelling effects and arrays of tunnel junction devices can be prepared having a density up to the order of 10.sup.10 per square cm.
    • 用作二极管,晶体管或其他电子部件的单电子器件通过在酸浴中电解将片状或箔片形式的金属衬底阳极化,在其上沉积具有基本上均匀直径的轴向设置的微孔的氧化膜,其范围为 约1至约500纳米,并且深度小于氧化物膜的厚度,在金属基底中的每个孔的底部之间留下超薄氧化物层。 导电材料沉积在孔中以形成接触孔底部的氧化物层的纳米线。 宏金属沉积在纳米线的末端以用于外部电接触目的。 可以根据适合于显示单电子隧道效应的本发明制造器件,并且可以制备密度高达每平方厘米1010的隧道结器件阵列。