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    • 2. 发明授权
    • Mobile communication apparatus having capability of housing temperature control
    • 具有容纳温度控制能力的移动通信装置
    • US07606566B2
    • 2009-10-20
    • US11384901
    • 2006-03-20
    • Isao Ogoshi
    • Isao Ogoshi
    • H04W24/00H04N5/232
    • H04M1/72519H04M1/66H04M2250/12
    • A mobile communication apparatus capable of controlling housing temperature is provided. The mobile communication apparatus includes a first and a second modules, an operating mode manager for managing a plurality of modes based on a combination of whether the first and the second modules each are supplied with power, and a memory for storing a plurality of data relating a period of operating time to a value of housing temperature for each of the modes. The communication apparatus includes a temperature estimator configured to measure the operating time, and if the mode is changed, to estimate a first and a second values of housing temperature corresponding to the operating time of the mode before the change and of the mode after the change respectively, and to have the operating mode manager stop the operation if an estimation based on the first and the second values reaches a predetermined threshold.
    • 提供了能够控制壳体温度的移动通信装置。 移动通信装置包括第一模块和第二模块,用于根据第一模块和第二模块是否被提供电力的组合来管理多种模式的操作模式管理器,以及用于存储多个数据相关的存储器 每个模式的运行时间为住房温度值。 通信装置包括温度估计器,其被配置为测量操作时间,并且如果模式被改变,则估计与改变之前的模式的操作时间相对应的壳体温度的第一和第二值,以及改变之后的模式的操作时间 并且如果基于第一和第二值的估计达到预定阈值,则使操作模式管理器停止操作。
    • 3. 发明授权
    • Electrically rewritable non-volatile semiconductor memory device
    • 电可重写非易失性半导体存储器件
    • US07382653B2
    • 2008-06-03
    • US11566283
    • 2006-12-04
    • Fumitaka AraiMasayuki Ichige
    • Fumitaka AraiMasayuki Ichige
    • G11C11/34
    • G11C16/0483G11C16/12H01L27/115H01L27/11521H01L27/11524
    • A first selection transistor is connected between one end of a memory cell group and a bit line. A second selection transistor which has a gate length shorter than a gate length of the first transistor is connected between the other end of the memory cell group and a source line. In a write, a control gate driver applies a write voltage to the control gate of the memory cell as a write target, and applies an intermediate voltage to the control gates of the other memory cells. A selection gate driver supplies a first voltage lower than the intermediate voltage to the first transistor, and supplies a second voltage lower than the first voltage to the second transistor. A bit line controller supplies the first voltage to the bit line which is not selected for writing, and a source line driver supplies the first voltage to the source line.
    • 第一选择晶体管连接在存储单元组的一端和位线之间。 具有比第一晶体管的栅极长度短的栅极长度的第二选择晶体管连接在存储单元组的另一端和源极线之间。 在写入时,控制栅极驱动器将写入电压作为写入目标器施加到存储器单元的控制栅极,并将中间电压施加到其它存储器单元的控制栅极。 选择栅极驱动器将低于中间电压的第一电压提供给第一晶体管,并将低于第一电压的第二电压提供给第二晶体管。 位线控制器将第一电压提供给未被选择用于写入的位线,并且源极线驱动器将第一电压提供给源极线。
    • 4. 发明授权
    • Semiconductor device having non-silicide region in which no silicide is formed on diffusion layer
    • 具有在扩散层上不形成硅化物的非硅化物区域的半导体器件
    • US07994584B2
    • 2011-08-09
    • US12277456
    • 2008-11-25
    • Takayuki HiraokaKuniaki UtsumiTsutomu KojimaKenji Honda
    • Takayuki HiraokaKuniaki UtsumiTsutomu KojimaKenji Honda
    • H01L21/331
    • H01L29/0847H01L21/823418H01L27/0266H01L27/088H01L29/105H01L29/1083H01L29/665H01L29/66659H01L29/7835
    • A semiconductor device includes first and second MOSFETs corresponding to at least first power source voltage and second power source voltage lower than the first power source voltage, and non-silicide regions formed in drain portions of the first and second MOSFETs and having no silicide formed therein. The first MOSFET includes first diffusion layers formed in source/drain portions, a second diffusion layer formed below a gate portion and formed shallower than the first diffusion layer and a third diffusion layer formed with the same depth as the second diffusion layer in the non-silicide region, and the second MOSFET includes fourth diffusion layers formed in source/drain portions, a fifth diffusion layer formed below a gate portion and formed shallower than the fourth diffusion layer and a sixth diffusion layer formed shallower than the fourth diffusion layer and deeper than the fifth diffusion layer in the non-silicide region.
    • 半导体器件包括对应于至少第一电源电压和低于第一电源电压的第二电源电压的第一和第二MOSFET,以及形成在第一和第二MOSFET的漏极部分中并且不形成在其中的硅化物的非硅化物区域 。 第一MOSFET包括形成在源极/漏极部分的第一扩散层,形成在栅极部分下方并形成为比第一扩散层浅的第二扩散层,以及形成在第一扩散层中的与第二扩散层相同深度的第三扩散层, 硅化物区域,第二MOSFET包括形成在源极/漏极部分的第四扩散层,形成在栅极部分下方并形成为比第四扩散层浅的第五扩散层和形成为比第四扩散层浅的第六扩散层, 非硅化物区域中的第五扩散层。