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1. 发明授权

US11592743B2 Positive-type photosensitive resin composition 有权
公开(公告)号：US11592743B2
公开(公告)日：2023-02-28
申请号：US16075416
申请日：2016-02-05
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Tadamitsu Nakamura
IPC分类号： G03F7/023 , G03F7/022 , G03F7/004 , G03F7/039 , G03F7/40
摘要： A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R1 is independently a hydrogen atom or a group represented by —CH2—O—R2. At least one of the plurality of R1s is a group represented by —CH2—O—R2. R2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

2. 发明授权

US11048167B2 Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component 有权
公开(公告)号：US11048167B2
公开(公告)日：2021-06-29
申请号：US15545751
申请日：2016-01-22
申请人： Hitachi Chemical Dupont Microsystems, Ltd.
发明人： Daisaku Matsukawa , Tetsuya Enomoto
IPC分类号： G03F7/023 , G03F7/40 , G03F7/022 , C09D179/04 , C08G69/32 , C08G73/22 , C08K5/03 , C08K5/42 , C08L75/04 , C08G71/04
摘要： A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.

3. 发明授权

US10725379B2 Polymide precursor resin composition 有权
公开(公告)号：US10725379B2
公开(公告)日：2020-07-28
申请号：US14654740
申请日：2013-12-13
申请人： Hitachi Chemical DuPont MicroSystems, Ltd.
发明人： Keishi Ono , Tetsuya Enomoto , Masayuki Ohe , Keiko Suzuki , Kazuya Soejima , Etsuharu Suzuki
IPC分类号： G03F7/038 , G03F7/075 , G03F7/40 , C08G73/10 , C08K5/544 , C08K5/33 , G03F7/16 , G03F7/20 , G03F7/32 , C09D179/08 , C08K5/5455 , C08F290/14
摘要： A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R5 is an alkyl group having 1 to 4 carbon atoms, R6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R8 and R9 may independently have a substituent.

4. 发明申请

US20150337116A1 POLYMIDE PRECURSOR RESIN COMPOSITION 审中-公开
标题翻译：聚酰亚胺前体树脂组合物
公开(公告)号：US20150337116A1
公开(公告)日：2015-11-26
申请号：US14654740
申请日：2013-12-13
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Keishi ONO , Tetsuya ENOMOTO , Masayuki OHE , Keiko SUZUKI , Kazuya SOEJIMA , Etsuharu SUZUKI
IPC分类号： C08K5/5455 , C08K5/544 , C08K5/33 , G03F7/40 , G03F7/16 , G03F7/20 , G03F7/32 , C08G73/10 , C09D179/08
摘要： A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R5 is an alkyl group having 1 to 4 carbon atoms, R6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R8 and R9 may independently have a substituent.
摘要翻译：一种树脂组合物，其包含以下组分（a）和（b）。（a）具有由以下通式（1）表示的结构单元的聚酰亚胺前体; 和（b）由以下通式（2）表示的化合物：其中在式中R1是四价有机基团，R2是二价有机基团，R3和R4独立地是氢原子，烷基，环烷基或具有碳 - 碳不饱和双键的一价有机基团。 R5是具有1至4个碳原子的烷基，R6独立地是羟基或具有1至4个碳原子的烷基，a是0-3的整数，n是1至6的整数，R7是由以下通式（3）或（4）表示的基团：其中在式（3）或（4）中，R 8为具有1-10个碳原子的烷基或衍生自羟烷基硅烷的一价有机基团，R 9为具有1-10个碳原子的烷基，衍生自氨基烷基硅烷或杂环基的一价有机基团，以及R 8和R 9可以独立地具有取代基。

5. 发明授权

US08975192B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08975192B2
公开(公告)日：2015-03-10
申请号：US12064511
申请日：2006-08-22
申请人： Yasunori Kojima , Toshiaki Itabashi
发明人： Yasunori Kojima , Toshiaki Itabashi
IPC分类号： C03C15/00 , C03C25/68 , C23F1/00 , B44C1/22 , H01L21/302 , H01L21/461 , H01L21/56 , H01L23/31
CPC分类号： H01L23/3171 , H01L21/563 , H01L23/3128 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method is provided for manufacturing a semiconductor device having a heat-resistant resin film with flip-chip connection structure using a solder bump or a gold bump and an epoxy resin compound laminated thereon, in which adhesiveness is improved particularly after exposure to high temperature and high humidity environments for a long period of time, thereby enhancing the reliability of the semiconductor device. The method, in accordance with the present invention, for manufacturing a semiconductor device having a heat-resistant resin film formed on a semiconductor element and an epoxy resin compound layer laminated thereon, comprises the steps of carrying out a plasma treatment on a surface of the heat-resistant resin film on which the epoxy resin compound layer is laminated using a nitrogen atom-containing gas containing at least one of nitrogen, ammonia, and hydrazine.
摘要翻译：提供了一种制造半导体器件的方法，该半导体器件具有使用焊料凸块或金凸块的倒装芯片连接结构的耐热树脂膜和层压在其上的环氧树脂化合物，其中特别是在暴露于高温之后粘合性得到改善，高湿度环境长时间，从而提高半导体器件的可靠性。根据本发明的用于制造在半导体元件上形成的耐热树脂膜和层压在其上的环氧树脂化合物层的半导体器件的方法包括以下步骤：在所述半导体元件的表面上进行等离子体处理使用包含氮，氨和肼中的至少一种的含氮原子的气体层压环氧树脂化合物层的耐热性树脂膜。

6. 发明授权

US08852726B2 Photosensitive polymer composition, method of producing pattern and electronic parts 有权
标题翻译：光敏聚合物组合物，图案和电子部件的制造方法
公开(公告)号：US08852726B2
公开(公告)日：2014-10-07
申请号：US13528989
申请日：2012-06-21
申请人： Masayuki Ooe , Hiroshi Komatsu , Yoshiko Tsumaru , Dai Kawasaki , Kouji Katou , Takumi Ueno
发明人： Masayuki Ooe , Hiroshi Komatsu , Yoshiko Tsumaru , Dai Kawasaki , Kouji Katou , Takumi Ueno
IPC分类号： B32B3/00 , G03F7/00 , C08K5/13 , C08K5/138 , G03F7/039 , G03F7/40 , C08L77/10 , G03F7/022 , G03F7/023 , G03F7/004 , C08K5/03 , C08L77/06
CPC分类号： G03F7/0226 , C08K5/03 , C08K5/13 , C08K5/138 , C08L77/06 , C08L77/10 , G03F7/0045 , G03F7/0046 , G03F7/0233 , G03F7/039 , G03F7/40 , Y10T428/24521 , Y10T428/24612 , Y10T428/24802 , C08L77/00
摘要： A photosensitive polymer composition includes (a) a polyamide having a repeating unit represented by the following general formula (I): wherein U represents a tetravalent organic group, V represents a bivalent organic group and p is an integer representing a number of the repeating unit; (b) a compound which generates an acid upon receiving light; and (c) a compound represented by the following general formula (II): wherein m and n are each independently integer of 1 or 2, Rs are each independently hydrogen, alkyl group or acyl group, and R1 and R2 each independently represents fluoroalkyl group having 1 to 3 carbon atoms.
摘要翻译：光敏聚合物组合物包括（a）具有由以下通式（I）表示的重复单元的聚酰胺：其中U表示四价有机基团，V表示二价有机基团，p表示重复单元数目的整数 ; （b）在接收光时产生酸的化合物; 和（c）由以下通式（II）表示的化合物：其中m和n各自独立地为1或2的整数，R 5各自独立地为氢，烷基或酰基，并且R 1和R 2各自独立地表示氟代烷基具有1至3个碳原子。

7. 发明授权

US08614051B2 Photosensitive resin composition and circuit formation substrate using the same 有权
标题翻译：感光树脂组合物和使用其的电路形成基材
公开(公告)号：US08614051B2
公开(公告)日：2013-12-24
申请号：US13535552
申请日：2012-06-28
申请人： Tomonori Minegishi , Rika Nogita , Dai Kawasaki , Keiko Suzuki , Taku Konno
发明人： Tomonori Minegishi , Rika Nogita , Dai Kawasaki , Keiko Suzuki , Taku Konno
IPC分类号： G03F7/00 , G03F7/004 , G03F7/26 , G03F7/40
CPC分类号： G03F7/0387 , G03F7/0388 , G03F7/11 , H05K1/05 , H05K3/287
摘要： A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
摘要翻译：一种用于层间绝缘膜或电路形成用基板的保护膜的感光性树脂组合物，其包含具有式（A）所示的结构单元的聚合物（a）和在照射时产生自由基的化合物（b）具有活性射线并具有下式（B）所示的结构。

8. 发明申请

US20120328856A1 PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME 有权
标题翻译：使用相同的光敏树脂组合物和电路形成基板
公开(公告)号：US20120328856A1
公开(公告)日：2012-12-27
申请号：US13535552
申请日：2012-06-28
申请人： Tomonori MINEGISHI , Rika NOGITA , Dai KAWASAKI , Keiko SUZUKI , Taku KONNO
发明人： Tomonori MINEGISHI , Rika NOGITA , Dai KAWASAKI , Keiko SUZUKI , Taku KONNO
IPC分类号： H05K1/05 , G03F7/20 , B32B3/10 , G03F7/004
CPC分类号： G03F7/0387 , G03F7/0388 , G03F7/11 , H05K1/05 , H05K3/287
摘要： A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
摘要翻译：一种用于层间绝缘膜或电路形成用基板的保护膜的感光性树脂组合物，其包含具有式（A）所示的结构单元的聚合物（a）和在照射时产生自由基的化合物（b）具有活性射线并具有下式（B）所示的结构。

9. 发明授权

US08298747B2 Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part 有权
标题翻译：感光树脂组合物，用于制造图案化硬化膜的方法和电子部件
公开(公告)号：US08298747B2
公开(公告)日：2012-10-30
申请号：US12531055
申请日：2008-03-06
申请人： Tomonori Minegishi , Rika Nogita , Kenichi Iwashita
发明人： Tomonori Minegishi , Rika Nogita , Kenichi Iwashita
IPC分类号： G03F7/00 , G03F7/004 , G03F7/027 , G03F7/028 , G03F7/40
CPC分类号： H01L21/02118 , C08G69/26 , C08G69/28 , C08G73/22 , C08L77/06 , C08L79/04 , G03F7/0233 , H01L21/02282 , H01L21/312
摘要： To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I): wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.
摘要翻译：为了提供一种感光树脂组合物，其中由感光性树脂组合物获得的硬化膜具有与在高温下硬化的膜相当的性能，使用该感光性树脂组合物制造图案化硬化膜的方法和电子部件。感光性树脂组合物包含（a）具有由通式（I）表示的重复单元的聚苯并恶唑前体：其中U和V表示二价有机基团，U和V中的至少一个是含有脂族链结构的基团具有1至30个碳原子; （b）光敏剂; （c）溶剂; 和（d）能够通过加热引起交联或聚合的交联剂。

10. 发明授权

US07851128B2 Photosensitive polymer composition, method of forming relief patterns, and electronic equipment 有权
标题翻译：光敏聚合物组合物，形成浮雕图案的方法和电子设备
公开(公告)号：US07851128B2
公开(公告)日：2010-12-14
申请号：US11605262
申请日：2006-11-29
申请人： Masataka Nunomura , Masayuki Ooe , Hajime Nakano , Yoshiko Tsumaru , Takumi Ueno
发明人： Masataka Nunomura , Masayuki Ooe , Hajime Nakano , Yoshiko Tsumaru , Takumi Ueno
IPC分类号： G03F7/004 , G03F7/30
CPC分类号： G03F7/0233 , G03F7/0392 , H05K3/4676 , Y10S430/107 , Y10T428/24612
摘要： A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (—NH2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.
摘要翻译：一种光敏聚合物组合物，其具有（a）选自聚酰亚胺前体和具有被保护基保护的酸基并且在末端不具有氨基（-NH 2）的聚酰亚胺）的聚合物; 和（b）当暴露于光并且能够使保护基从酸基脱保护时产生酸的化合物被用于形成半导体器件的层。

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