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1. 发明申请

US20200041900A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PATTERN PRODUCTION METHOD, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE LAYER, AND ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20200041900A1
公开(公告)日：2020-02-06
申请号：US16487948
申请日：2018-02-22
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Nobuyuki SAITO , Yukari KOIBUCHI , Yutaka NAMATAME
IPC分类号： G03F7/037 , G03F7/038 , C08G73/10
摘要： A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).

2. 发明申请

US20180074403A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM PRODUCTION METHOD, PATTERNED CURED FILM, AND ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20180074403A1
公开(公告)日：2018-03-15
申请号：US15545751
申请日：2016-01-22
申请人： Hitachi Chemical Dupont Microsystems, Ltd.
发明人： Daisaku MATSUKAWA , Tetsuya ENOMOTO
IPC分类号： G03F7/023 , C08K5/03 , C08K5/42 , C08G73/22 , C08L75/04
CPC分类号： G03F7/023 , C08G69/32 , C08G71/04 , C08G73/22 , C08K5/03 , C08K5/42 , C08L75/04 , C09D179/04 , G03F7/0226 , G03F7/0233
摘要： A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.

3. 发明申请

US20150353685A1 POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID POLYIMIDE PRECURSOR, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION 有权
标题翻译：聚酰亚胺前体，含有聚酰亚胺前体的感光性树脂组合物，以及使用含有感光性树脂组合物的固化膜形成方法和半导体器件
公开(公告)号：US20150353685A1
公开(公告)日：2015-12-10
申请号：US14654758
申请日：2013-12-19
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Tetsuya Enomoto , Keishi Ono , Masayuki Ohe , Keiko Suzuki , Kazuya Soejima , Etsuharu Suzuki
IPC分类号： C08G73/10 , C08K5/33 , G03F7/40 , G03F7/16 , G03F7/20 , G03F7/32 , C08G73/16 , C09D179/08
CPC分类号： C08G73/1007 , C08F290/14 , C08G73/1039 , C08G73/1042 , C08G73/1053 , C08G73/1067 , C08G73/1071 , C08G73/16 , C08K5/33 , C09D179/08 , G03F7/031 , G03F7/037 , G03F7/0387 , G03F7/0388 , G03F7/168 , G03F7/20 , G03F7/32 , G03F7/40 , H01L21/02118 , H01L21/311 , C08K5/3475 , C08K5/3472
摘要： A polyimide precursor including a structural unit represented by the following general formula (1) in a ratio of 50 mol % or more based on the total structural units. In the general formula (1), A is a tetravalent organic group represented by the following general formula (2a), a tetravalent organic group represented by the following general formula (2b), or a tetravalent organic group represented by the following general formula (2c), and B is a divalent organic group represented by the following general formula (3).
摘要翻译：包含由以下通式（1）表示的结构单元的聚酰亚胺前体，相对于总结构单元为50摩尔％以上。在通式（1）中，A是由以下通式（2a）表示的四价有机基团，由以下通式（2b）表示的四价有机基团或由下列通式（4）表示的四价有机基团 2c），B是由以下通式（3）表示的二价有机基团。

4. 发明授权

US11592743B2 Positive-type photosensitive resin composition 有权
公开(公告)号：US11592743B2
公开(公告)日：2023-02-28
申请号：US16075416
申请日：2016-02-05
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Tadamitsu Nakamura
IPC分类号： G03F7/023 , G03F7/022 , G03F7/004 , G03F7/039 , G03F7/40
摘要： A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R1 is independently a hydrogen atom or a group represented by —CH2—O—R2. At least one of the plurality of R1s is a group represented by —CH2—O—R2. R2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

5. 发明授权

US11048167B2 Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component 有权
公开(公告)号：US11048167B2
公开(公告)日：2021-06-29
申请号：US15545751
申请日：2016-01-22
申请人： Hitachi Chemical Dupont Microsystems, Ltd.
发明人： Daisaku Matsukawa , Tetsuya Enomoto
IPC分类号： G03F7/023 , G03F7/40 , G03F7/022 , C09D179/04 , C08G69/32 , C08G73/22 , C08K5/03 , C08K5/42 , C08L75/04 , C08G71/04
摘要： A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.

6. 发明授权

US10725379B2 Polymide precursor resin composition 有权
公开(公告)号：US10725379B2
公开(公告)日：2020-07-28
申请号：US14654740
申请日：2013-12-13
申请人： Hitachi Chemical DuPont MicroSystems, Ltd.
发明人： Keishi Ono , Tetsuya Enomoto , Masayuki Ohe , Keiko Suzuki , Kazuya Soejima , Etsuharu Suzuki
IPC分类号： G03F7/038 , G03F7/075 , G03F7/40 , C08G73/10 , C08K5/544 , C08K5/33 , G03F7/16 , G03F7/20 , G03F7/32 , C09D179/08 , C08K5/5455 , C08F290/14
摘要： A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R5 is an alkyl group having 1 to 4 carbon atoms, R6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R8 and R9 may independently have a substituent.

7. 发明申请

US20190049842A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION 审中-公开
公开(公告)号：US20190049842A1
公开(公告)日：2019-02-14
申请号：US16075441
申请日：2016-02-05
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Daisaku MATSUKAWA , Tadamitsu NAKAMURA
IPC分类号： G03F7/039 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , G03F7/023
摘要： A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30.

8. 发明申请

US20190041748A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION 审中-公开
公开(公告)号：US20190041748A1
公开(公告)日：2019-02-07
申请号：US16075416
申请日：2016-02-05
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Tadamitsu NAKAMURA
IPC分类号： G03F7/023 , G03F7/039 , G03F7/004
摘要： A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R1 is independently a hydrogen atom or a group represented by —CH2—O—R2. At least one of the plurality of R1s is a group represented by —CH2—O—R2. R2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

9. 发明申请

US20150337116A1 POLYMIDE PRECURSOR RESIN COMPOSITION 审中-公开
标题翻译：聚酰亚胺前体树脂组合物
公开(公告)号：US20150337116A1
公开(公告)日：2015-11-26
申请号：US14654740
申请日：2013-12-13
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Keishi ONO , Tetsuya ENOMOTO , Masayuki OHE , Keiko SUZUKI , Kazuya SOEJIMA , Etsuharu SUZUKI
IPC分类号： C08K5/5455 , C08K5/544 , C08K5/33 , G03F7/40 , G03F7/16 , G03F7/20 , G03F7/32 , C08G73/10 , C09D179/08
摘要： A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R5 is an alkyl group having 1 to 4 carbon atoms, R6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R8 and R9 may independently have a substituent.
摘要翻译：一种树脂组合物，其包含以下组分（a）和（b）。（a）具有由以下通式（1）表示的结构单元的聚酰亚胺前体; 和（b）由以下通式（2）表示的化合物：其中在式中R1是四价有机基团，R2是二价有机基团，R3和R4独立地是氢原子，烷基，环烷基或具有碳 - 碳不饱和双键的一价有机基团。 R5是具有1至4个碳原子的烷基，R6独立地是羟基或具有1至4个碳原子的烷基，a是0-3的整数，n是1至6的整数，R7是由以下通式（3）或（4）表示的基团：其中在式（3）或（4）中，R 8为具有1-10个碳原子的烷基或衍生自羟烷基硅烷的一价有机基团，R 9为具有1-10个碳原子的烷基，衍生自氨基烷基硅烷或杂环基的一价有机基团，以及R 8和R 9可以独立地具有取代基。

10. 发明授权

US11487201B2 Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component 有权
公开(公告)号：US11487201B2
公开(公告)日：2022-11-01
申请号：US16498139
申请日：2018-03-30
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Etsuharu Tsuchiya , Tetsuya Enomoto , Takashi Kawamori , Nobuyuki Saito , Yukari Koibuchi , Atsutaro Yoshizawa , Akira Asada
IPC分类号： G03F7/027 , G03F7/037 , G03F7/40 , C08G73/10 , G03F7/028 , G03F7/038 , G03F7/20
摘要： A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

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