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1. 发明授权

US11592743B2 Positive-type photosensitive resin composition 有权
公开(公告)号：US11592743B2
公开(公告)日：2023-02-28
申请号：US16075416
申请日：2016-02-05
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Tadamitsu Nakamura
IPC分类号： G03F7/023 , G03F7/022 , G03F7/004 , G03F7/039 , G03F7/40
摘要： A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R1 is independently a hydrogen atom or a group represented by —CH2—O—R2. At least one of the plurality of R1s is a group represented by —CH2—O—R2. R2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

2. 发明授权

US11048167B2 Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component 有权
公开(公告)号：US11048167B2
公开(公告)日：2021-06-29
申请号：US15545751
申请日：2016-01-22
申请人： Hitachi Chemical Dupont Microsystems, Ltd.
发明人： Daisaku Matsukawa , Tetsuya Enomoto
IPC分类号： G03F7/023 , G03F7/40 , G03F7/022 , C09D179/04 , C08G69/32 , C08G73/22 , C08K5/03 , C08K5/42 , C08L75/04 , C08G71/04
摘要： A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.

3. 发明授权

US10725379B2 Polymide precursor resin composition 有权
公开(公告)号：US10725379B2
公开(公告)日：2020-07-28
申请号：US14654740
申请日：2013-12-13
申请人： Hitachi Chemical DuPont MicroSystems, Ltd.
发明人： Keishi Ono , Tetsuya Enomoto , Masayuki Ohe , Keiko Suzuki , Kazuya Soejima , Etsuharu Suzuki
IPC分类号： G03F7/038 , G03F7/075 , G03F7/40 , C08G73/10 , C08K5/544 , C08K5/33 , G03F7/16 , G03F7/20 , G03F7/32 , C09D179/08 , C08K5/5455 , C08F290/14
摘要： A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R5 is an alkyl group having 1 to 4 carbon atoms, R6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R8 and R9 may independently have a substituent.

4. 发明申请

US20190049842A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION 审中-公开
公开(公告)号：US20190049842A1
公开(公告)日：2019-02-14
申请号：US16075441
申请日：2016-02-05
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Daisaku MATSUKAWA , Tadamitsu NAKAMURA
IPC分类号： G03F7/039 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , G03F7/023
摘要： A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30.

5. 发明申请

US20190041748A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION 审中-公开
公开(公告)号：US20190041748A1
公开(公告)日：2019-02-07
申请号：US16075416
申请日：2016-02-05
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Tadamitsu NAKAMURA
IPC分类号： G03F7/023 , G03F7/039 , G03F7/004
摘要： A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R1 is independently a hydrogen atom or a group represented by —CH2—O—R2. At least one of the plurality of R1s is a group represented by —CH2—O—R2. R2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

6. 发明申请

US20150337116A1 POLYMIDE PRECURSOR RESIN COMPOSITION 审中-公开
标题翻译：聚酰亚胺前体树脂组合物
公开(公告)号：US20150337116A1
公开(公告)日：2015-11-26
申请号：US14654740
申请日：2013-12-13
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Keishi ONO , Tetsuya ENOMOTO , Masayuki OHE , Keiko SUZUKI , Kazuya SOEJIMA , Etsuharu SUZUKI
IPC分类号： C08K5/5455 , C08K5/544 , C08K5/33 , G03F7/40 , G03F7/16 , G03F7/20 , G03F7/32 , C08G73/10 , C09D179/08
摘要： A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R5 is an alkyl group having 1 to 4 carbon atoms, R6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R8 and R9 may independently have a substituent.
摘要翻译：一种树脂组合物，其包含以下组分（a）和（b）。（a）具有由以下通式（1）表示的结构单元的聚酰亚胺前体; 和（b）由以下通式（2）表示的化合物：其中在式中R1是四价有机基团，R2是二价有机基团，R3和R4独立地是氢原子，烷基，环烷基或具有碳 - 碳不饱和双键的一价有机基团。 R5是具有1至4个碳原子的烷基，R6独立地是羟基或具有1至4个碳原子的烷基，a是0-3的整数，n是1至6的整数，R7是由以下通式（3）或（4）表示的基团：其中在式（3）或（4）中，R 8为具有1-10个碳原子的烷基或衍生自羟烷基硅烷的一价有机基团，R 9为具有1-10个碳原子的烷基，衍生自氨基烷基硅烷或杂环基的一价有机基团，以及R 8和R 9可以独立地具有取代基。

7. 发明授权

US11487201B2 Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component 有权
公开(公告)号：US11487201B2
公开(公告)日：2022-11-01
申请号：US16498139
申请日：2018-03-30
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Etsuharu Tsuchiya , Tetsuya Enomoto , Takashi Kawamori , Nobuyuki Saito , Yukari Koibuchi , Atsutaro Yoshizawa , Akira Asada
IPC分类号： G03F7/027 , G03F7/037 , G03F7/40 , C08G73/10 , G03F7/028 , G03F7/038 , G03F7/20
摘要： A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

8. 发明申请

US20210116809A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING PATTERN CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER-COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT 有权
公开(公告)号：US20210116809A1
公开(公告)日：2021-04-22
申请号：US16498139
申请日：2018-03-30
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Etsuharu TSUCHIYA , Tetsuya ENOMOTO , Takashi KAWAMORI , Nobuyuki SAITO , Yukari KOIBUCHI , Atsutaro YOSHIZAWA , Akira ASADA
IPC分类号： G03F7/038 , G03F7/037 , G03F7/028 , G03F7/20 , C08G73/10
摘要： A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

9. 发明申请

US20130143011A1 PHOTOSENSITIVE RESIN COMPOSITION 审中-公开
标题翻译：感光树脂组合物
公开(公告)号：US20130143011A1
公开(公告)日：2013-06-06
申请号：US13670817
申请日：2012-11-07
申请人： Hitachi Chemical DuPont MicroSystems, Ltd.
发明人： Keiko Suzuki , Noriyuki Yamazaki , Mamoru Sasaki , Tomonori Minegishi
IPC分类号： G03F7/004
CPC分类号： G03F7/0045 , G03F7/027 , G03F7/037 , Y10T428/24802 , Y10T428/24851
摘要： A photosensitive resin composition including: (a) a polyamide acid; (b) a compound (b1) having 4 or more of a methylol group, a methoxymethyl group and the both thereof, or a compound (b2) represented by the following formula (2); and (c) a photopolymerization initiator.
摘要翻译：一种感光性树脂组合物，其包含：（a）聚酰胺酸; （b）具有羟甲基，甲氧基甲基及其二者中的4个以上的化合物（b1）或下述式（2）表示的化合物（b2）。和（c）光聚合引发剂。

10. 发明授权

US11021572B2 Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component 有权
公开(公告)号：US11021572B2
公开(公告)日：2021-06-01
申请号：US16320889
申请日：2017-07-25
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Ayaka Azuma , Satoshi Abe , Kazuya Soejima , Masato Nishimura , Tadamitsu Nakamura
IPC分类号： C08G73/10 , C08G73/22 , G03F7/023 , G03F7/022 , G03F7/085 , G03F7/038
摘要： Provided is a photosensitive resin composition containing; (A) a polymer having an acidic functional group or a substituent derived therefrom; (B) a photoreactive compound; (C) a solvent; and (D) a nitrogen-containing aromatic compound represented by the following general formula (1).

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