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1. 发明申请

US20040127669A1 Silicone resin composition 有权
标题翻译：硅树脂组合物
公开(公告)号：US20040127669A1
公开(公告)日：2004-07-01
申请号：US10656119
申请日：2003-09-08
申请人： HENKEL LOCTITE CORPORATION
发明人： Hideki Ueno , Hiroyuki Kayaki
IPC分类号： C08G077/04
CPC分类号： C08L79/00 , C08G77/12 , C08G77/16 , C08G77/24 , C08K5/29 , C08K5/54 , C08L83/04 , C08L83/00 , C08L2666/14 , C08L2666/28
摘要： This invention provides a silicone resin composition giving a silicone cured rubber exhibiting a higher elongation percentage as well as improved heat resistance, oil resistance and chemical resistance, which are particularly required for automobile applications. A silicone cured rubber meeting the above physical property requirements can be prepared by moisture-curing a silicone resin composition including 100 wt parts of (a) an OH-containing polysiloxane, 0.1 to 200 wt parts of (b) a carbodiimide and (c) an organosilicon crosslinking agent, or alternatively by thermally curing a silicone resin composition including 100 wt parts of (a) an OH-containing polysiloxane, 0.1 to 200 wt parts of (b) a carbodiimide and (d) an amino-containing silane.
摘要翻译：本发明提供一种硅酮树脂组合物，其给出了对于汽车应用特别需要的具有较高伸长率以及改善的耐热性，耐油性和耐化学性的硅酮固化橡胶。满足上述物性要求的硅氧烷固化橡胶可以通过湿固固化含有100重量份（a）含OH聚硅氧烷，0.1-200重量份（b）碳二亚胺和（c）有机硅交联剂，或者通过热固化含有100重量份（a）含OH聚硅氧烷，0.1-200重量份（b）碳二亚胺和（d）含氨基硅烷）的有机硅树脂组合物。

2. 发明申请

US20040102566A1 B-stageable die attach adhesives 有权
标题翻译： B级裸片附着胶
公开(公告)号：US20040102566A1
公开(公告)日：2004-05-27
申请号：US10459601
申请日：2003-06-12
申请人： HENKEL LOCTITE CORPORATION
发明人： Deborah Derfelt Forray , Puwei Liu , Benedicto delos Santos
IPC分类号： C08K003/00
CPC分类号： H01L24/83 , C09J5/06 , H01L24/29 , H01L24/73 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29386 , H01L2224/29393 , H01L2224/29439 , H01L2224/29455 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15787 , Y10T156/10 , Y10T428/31504 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/05032 , H01L2924/0503 , H01L2924/04642 , H01L2924/0532 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/01049 , H01L2924/01048
摘要： The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
摘要翻译：本发明涉及b级可用的芯片附着粘合剂，制备这种粘合剂的方法，将这种粘合剂施加到模具和其它基材表面的方法，以及用于连接微电子电路制备的组件。

3. 发明申请

US20040225045A1 Highly conductive resin compositions 审中-公开
标题翻译：高导电性树脂组合物
公开(公告)号：US20040225045A1
公开(公告)日：2004-11-11
申请号：US10429039
申请日：2003-05-05
申请人： HENKEL LOCTITE CORPORATION
发明人： Deborah Derfelt Forray
IPC分类号： C08K005/24
CPC分类号： C08K5/0091 , H05K3/321 , C08L45/00
摘要： The present invention relates to resin compositions, particularly those having a high degree of conductivity. In particular, the present invention relates to highly conductive die attach compositions useful for attaching semiconductor devices to carrier substrates. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.
摘要翻译：本发明涉及树脂组合物，特别是那些具有高导电性的组合物。特别地，本发明涉及用于将半导体器件附着到载体衬底上的高导电性芯片附着组合物。本发明还提供了制备这种组合物的方法，将这种组合物应用于基材表面的方法，以及用于连接微电子电路制备的包装和组件。

4. 发明申请

US20040077783A1 Non-flammable and non-combustible adhesive bonding systems having adherence to low energy surfaces 有权
标题翻译：具有粘附于低能量表面的不可燃和不可燃的粘合剂粘合系统
公开(公告)号：US20040077783A1
公开(公告)日：2004-04-22
申请号：US10419250
申请日：2003-04-21
申请人： HENKEL LOCTITE CORPORATION , LOCTITE ( R&D) LIMITED
发明人： Eerik Maandi , Brendan J. Kneafsey
IPC分类号： C08K003/00
CPC分类号： C09J4/00 , C08K5/29 , C08L2666/04 , C09J133/02 , Y10T428/31935 , C08F220/10
摘要： This invention relates to (meth)acrylate based polymerizable compositions and adhesive systems prepared therefrom, which include an initiator system comprising a complex of an organoborane with a complexing agent, an aziridine-containing compound, and a carrier material with which the initiator system is unreactive and which renders the composition having a flash point above 140null F. The inventive compositions desirably have a flash point above 200null F., for each of the parts of the adhesive system. To achieve the physical properties of the inventive compositions and adhesive systems, it is desirable for the carrier material to have such flash points; however, provided that in their entirety the inventive compositions and adhesive systems have such flash points, it is not necessary for the carrier material itself to have such flash points. The inventive compositions and adhesive systems also include a package for controlling the rate of cure and indicating the extent of cure. The inventive compositions and adhesive systems are particularly well suited to bonding applications which involve at least one low energy bonding surface, for example, polyolefin, polyethylene, and polypropylene surfaces.
摘要翻译：本发明涉及基于（甲基）丙烯酸酯的可聚合组合物及其制备的粘合剂体系，其包括引发剂体系，其包括有机硼烷与络合剂的络合物，含氮丙啶的化合物和引发剂体系不反应的载体材料并且使组合物的闪点高于140°F。本发明的组合物理想地具有高于200°F的闪点，用于粘合剂体系的每个部分。为了达到本发明组合物和粘合剂体系的物理性能，载体材料最好具有这样的闪点; 然而，只要本发明的组合物和粘合剂体系全部具有这样的闪点，载体材料本身就不必具有这样的闪点。本发明的组合物和粘合剂体系还包括用于控制固化速率并指示固化程度的包装。本发明的组合物和粘合剂体系特别适用于涉及至少一个低能量结合表面的粘合应用，例如聚烯烃，聚乙烯和聚丙烯表面。

5. 发明申请

US20030119681A1 Anti-seize composition in solid form 有权
标题翻译：防结块固体形式的组合物
公开(公告)号：US20030119681A1
公开(公告)日：2003-06-26
申请号：US10282424
申请日：2002-10-29
申请人： HENKEL LOCTITE CORPORATION
发明人： Prakash S. Patel , Shabbir Attarwala
IPC分类号： C10M169/06 , C10M125/02 , C10M125/04 , C10M125/10
CPC分类号： C10M169/044 , C10M169/00 , C10M169/04 , C10M2201/041 , C10M2201/05 , C10M2201/061 , C10M2201/062 , C10M2201/065 , C10M2201/066 , C10M2201/081 , C10M2201/084 , C10M2201/087 , C10M2201/103 , C10M2203/106 , C10M2203/1065 , C10M2205/143 , C10M2205/163 , C10M2205/183 , C10M2207/0215 , C10M2207/1256 , C10M2207/126 , C10M2209/0845 , C10M2209/1023 , C10M2213/062 , C10M2215/041 , C10M2217/0443 , C10M2217/045 , C10M2217/0453 , C10M2217/065 , C10N2210/01 , C10N2210/02 , C10N2210/03 , C10N2210/04 , C10N2210/08 , C10N2220/022 , C10N2220/032 , C10N2220/082 , C10N2230/06 , C10N2250/08 , C10N2250/10
摘要： An anti-seize composition which is non-flowable and dimensionally stable at temperatures greater than about 120null F. and dispensable at room temperature without the application of heat is provided. The composition includes a solid anti-seize lubricant, such as of metallic copper, metallic nickel, metallic aluminum, metallic lead, metallic zinc, graphite, calcium oxide, calcium carbonate, calcium fluoride, calcium stearate, lithium, molybdenum disulfide, boron nitride, barium sulfate, or combinations thereof. The anti-seize lubricant is dispersed in a carrier which is a solid at about room temperature. The carrier includes a grease with an ASTM D 217 penetration at 25null C. from about 200 to about 400 mm, a matrix material, and a naphthenic petroleum oil having a viscosity of less than about 300 SUS at 100null F. and having an API gravity at 60null F. from about 23 to about 25. The matrix material is a polymeric material. Optionally, a refined petroleum wax may also be included.
摘要翻译：提供了一种在大于约120°F的温度下不可流动和尺寸稳定的防卡塞组合物，并且在室温下无需施加热量即可。该组合物包括固体防卡塞润滑剂，例如金属铜，金属镍，金属铝，金属铅，金属锌，石墨，氧化钙，碳酸钙，氟化钙，硬脂酸钙，锂，二硫化钼，氮化硼，硫酸钡或其组合。防卡死润滑剂分散在大约室温下为固体的载体中。载体包括在25°C下具有约200至约400mm的ASTM D 217渗透性的润滑脂，基质材料和在100°F下粘度小于约300SUS的环烷石油，并具有 API重力在60°F，从约23至约25.基质材料是聚合材料。任选地，还可以包括精制石油蜡。

6. 发明申请

US20050131188A1 Moisture curable high strength, flexible RTV organic copolymer compositions and methods of preparation 失效
标题翻译：水分固化型高强度，柔性RTV有机共聚物组合物及其制备方法
公开(公告)号：US20050131188A1
公开(公告)日：2005-06-16
申请号：US10736177
申请日：2003-12-15
申请人： Debora Duch , Steven Nakos , Thomas Lim
发明人： Debora Duch , Steven Nakos , Thomas Lim
IPC分类号： C08G18/10 , C08G18/28 , C08G18/71 , C08G18/76 , C08G63/672 , C08G63/695 , C08G63/88 , C08G63/91 , C08L83/00 , C08G77/00
CPC分类号： C08G18/718 , C08G18/10 , C08G18/289 , C08G18/765 , C08G63/672 , C08G63/6956 , C08G63/916 , C08G2261/126 , C08G18/307 , C08G18/42
摘要： Flexible, moisture curing ABA triblock copolymers are prepared from poly(alkylene oxide) diols as the B segment and polyester diols as the A block. This backbone is end-capped with siloxy end groups to obtain RTV moisture curing triblocks having high strength and flexibility.
摘要翻译：作为B链段的聚（环氧烷）二醇和作为A嵌段的聚酯二醇制备柔软的湿润固化ABA三嵌段共聚物。该骨架用甲硅烷端基封端，以获得具有高强度和柔韧性的RTV湿度固化三嵌段。

7. 发明申请

US20040166241A1 Molding compositions containing quaternary organophosphonium salts 审中-公开
标题翻译：含有季有机鏻盐的成型组合物
公开(公告)号：US20040166241A1
公开(公告)日：2004-08-26
申请号：US10369916
申请日：2003-02-20
申请人： Henkel Loctite Corporation
发明人： Anthony A Gallo , Mark T. Dimke
IPC分类号： B05D003/02
CPC分类号： H01L23/293 , C08G59/08 , C08G59/3218 , C08G59/688 , C08K5/34928 , C08K5/50 , C08L63/00 , C08L71/12 , C08L91/06 , H01L2924/0002 , H01L2924/3011 , Y10T428/31511 , C08L2666/02 , H01L2924/00
摘要： Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, a flame retardant compound such as melamine cyanurate, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions exhibit improved flame retardancy. Also, when multifunctional epoxy resins and multifunctional phenolic hardeners such as those derived from phenol with a degree of branching of at least three are used, the molding compounds including the quaternary organophosphonium salt as a catalyst exhibit long flow and low shrinkage and warpage.
摘要翻译：公开了在诸如集成电路的涂覆电子器件中特别有用的成型组合物。成型组合物包括环氧树脂; 环氧树脂用固化剂，氰尿酸三聚氰胺等阻燃化合物和用于催化环氧树脂和硬化剂如乙基三苯基鏻酸乙酸酯之间的反应的季有机鏻盐。模塑组合物显示出改进的阻燃性。此外，当使用多官能环氧树脂和多官能酚类固化剂，例如来自苯酚的支链度至少为3的多官能酚醛固化剂时，包含作为催化剂的季有机鏻盐的成型化合物表现出长的流动性和低的收缩率和翘曲。

8. 发明申请

US20040082724A1 Novel heterobifunctional monomers and uses therefor 失效
标题翻译：新型异双功能单体及其用途
公开(公告)号：US20040082724A1
公开(公告)日：2004-04-29
申请号：US10612545
申请日：2003-07-01
申请人： Henkel Loctite Corporation
发明人： Stephen M. Dershem , Kevin J. Forrestal , Puwei Liu
IPC分类号： C08G073/00 , C07D265/36 , C07C069/52
CPC分类号： C07D207/448 , C08F32/08 , C08F232/08 , C08G61/02 , C08G61/08 , H05K1/0313 , H05K1/032
摘要： In accordance with the present invention, there are provided novel heterobifunctional monomers and users for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.
摘要翻译：根据本发明，提供了新颖的异双功能单体及其用途。本发明化合物具有许多微电子工业所需的性质，例如疏水性，高Tg值，低介电常数，离子纯度，低热膨胀系数（CTE）等。这些特性导致热固性材料特别适用于其中典型工作温度通常明显高于现有技术材料适合的高性能应用。本发明化合物特别适用于制造电子元件，例如印刷电路板等。

9. 发明申请

US20040063800A1 Foamable compositions 失效
标题翻译：可发泡组合物
公开(公告)号：US20040063800A1
公开(公告)日：2004-04-01
申请号：US10243853
申请日：2002-09-16
申请人： HENKEL LOCTITE CORPORATION
发明人： Karen R. Brantl , Philp T. Klemarczyk
IPC分类号： C08J009/00
CPC分类号： C08J9/06
摘要： This invention relates to latent foamable compositions for use in or as adhesives, sealants and/or coatings. The compositions include a curable component or a thermoplastic component, together with a latent foaming agent. In curable versions of the inventive compositions, a cure initiator or catalyst may also be included.
摘要翻译：本发明涉及用于或作为粘合剂，密封剂和/或涂料的潜在可发泡组合物。组合物包括可固化组分或热塑性组分以及潜在发泡剂。在本发明组合物的可固化形式中，还可以包括固化引发剂或催化剂。

10. 发明申请

US20040006150A1 Photocurable adhesive compositions, reaction products of which have low halide ion content 失效
标题翻译：光固化粘合剂组合物，其反应产物具有低的卤离子含量
公开(公告)号：US20040006150A1
公开(公告)日：2004-01-08
申请号：US10176648
申请日：2002-06-24
申请人： HENKEL LOCTITE CORPORATION
发明人： Helen M. Murray , Jonathan P. Wigham , John E. Cahill , Aisling Lakes , Matthew J. Holloway , Eadaoin D. Ledwidge , Mary B. Ward
IPC分类号： C08F002/46
CPC分类号： G06K19/07747 , C08G59/24 , C08G59/68 , G06K19/02 , G06K19/077 , G06K19/07745 , H01L21/563 , H01L23/293 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01037 , H01L2924/01057 , H01L2924/01068 , H01L2924/01079 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.
摘要翻译：本发明涉及一种用作密封剂的可光固化组合物，用于底部填充或附着粘合剂，其能够在大于290nm的波长下固化。这些可光固化组合物的反应产物具有低水平的可提取的卤离子，例如小于100ppm。在使用中，可光固化组合物可以例如用于将半导体器件电连接到衬底的线接合件，以保持固定的位置关系，并且保护电连接的完整性免受振动和冲击扰动，以及从来自环境污染物的干扰。

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