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1. 发明授权

US08575645B2 Thin multi-layer LED array engine 有权
标题翻译：薄多层LED阵列引擎
公开(公告)号：US08575645B2
公开(公告)日：2013-11-05
申请号：US13301782
申请日：2011-11-22
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A thin multi-layer LED array engine is provided, which includes a substrate having a phosphor layer and a silica gel protection layer formed thereon. The phosphor layer is disposed on LED dices and makes direct contact with the substrate, and the silica gel protection layer is disposed on the phosphor layer. The LED dices are covered with the phosphor layer, and thereby the phosphor particles in the phosphor layer can be uniformly dispersed around the LED dices, so that the narrow color temperature distribution can be achieved. Furthermore, the phosphor layer makes direct contacts with the substrate, and thereby heat generated in the phosphor layer can be effectively dissipated through the substrate, and thereby the reliability of the optical components can be increased.
摘要翻译：提供了一种薄的多层LED阵列引擎，其包括在其上形成有荧光体层和硅胶保护层的基板。磷光体层设置在LED芯片上，与基板直接接触，硅胶保护层设置在荧光体层上。 LED芯片被荧光体层覆盖，从而荧光体层中的荧光体颗粒能够均匀地分散在LED芯片周围，从而可以实现窄的色温分布。此外，荧光体层与衬底直接接触，从而可以通过衬底有效地消散荧光体层中产生的热，从而可以提高光学部件的可靠性。

2. 发明授权

US08253330B2 Airtight multi-layer array type LED 有权
标题翻译：气密多层阵列式LED
公开(公告)号：US08253330B2
公开(公告)日：2012-08-28
申请号：US12957378
申请日：2010-11-30
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01J1/62
CPC分类号： F21V31/00 , F21K9/64 , F21V29/507 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/507 , H01L33/56 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： An airtight multi-layer array type LED is disclosed, which comprises a metal substrate with an airtight metal frame formed thereon, and the metal substrate is integrally formed with the airtight metal frame, and an airtight sealing frame slot is formed around the upper surface of the airtight metal frame, the airtight metal frame is installed with two sets of sealing through hole pairs accommodating the lead frames. The interior of the airtight metal frame can be installed with packaging materials or optical components. The sealing holes are sealed with a glass or ceramic material. A fluorescent layer is formed on a silica gel layer, wherein the fluorescent layer can also be installed inside a silica glass package cover. The silica glass package cover is installed on the top surface of the airtight metal frame, and the silica glass package cover is engaged and sealed to a sealing rack. Nitrogen is filled in a space defined between the silica glass package cover and the fluorescent layer, so that moisture is prevented from permeating through the airtight metal frame and a dice protection layer. As such, a sealed-type LED packaging structure is formed and is suitable to be used in extreme or severe environments.
摘要翻译：公开了一种气密的多层阵列型LED，其包括形成有气密金属框架的金属基板，并且金属基板与气密金属框架一体形成，并且气密密封框槽形成在气密金属框架，气密金属框架安装有两组容纳引线框架的密封通孔对。气密金属框架的内部可以安装包装材料或光学元件。密封孔用玻璃或陶瓷材料密封。在硅胶层上形成荧光层，其中荧光层也可以安装在石英玻璃封装盖的内部。石英玻璃封装盖安装在气密金属框架的顶表面上，石英玻璃封装盖接合并密封到密封架上。氮气填充在石英玻璃封装盖和荧光层之间的空间中，防止水分渗入气密金属框架和骰子保护层。因此，形成密封型LED封装结构，适用于极端或恶劣环境。

3. 外观设计

USD685115S1 LED bulb 有权
公开(公告)号：USD685115S1
公开(公告)日：2013-06-25
申请号：US29433097
申请日：2012-09-26
申请人： Gem Weltronics TWN Corporation
设计人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu

4. 发明授权

US08338923B1 Package structure of multi-layer array type LED device 有权
标题翻译：多层阵列式LED器件的封装结构
公开(公告)号：US08338923B1
公开(公告)日：2012-12-25
申请号：US13224330
申请日：2011-09-02
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01L23/495
CPC分类号： H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： A package structure of multi-layer array type LED device is disclosed, wherein a peripheral area of a substrate and a surface of lead frame are respectively installed with a convex/concave surface structure. The convex/concave surface structure increases the surface roughness of the peripheral area of the substrate and the surface of the lead frame, so a liquid package material can be filled in cavities and concave parts; thus a package member formed through the package material being solidified can be firmly combined with the substrate and the lead frame as one piece. In addition, the bottom of a lens is provided with a binder for increasing the sealing level of the lens. Moreover, the present invention adopted a soldering paste added with material having good heat conductivity, so heat generated by LED dices can be rapidly dissipated to the exterior.
摘要翻译：公开了一种多层阵列型LED器件的封装结构，其中基片的周边区域和引线框架的表面分别安装有凸/凹表面结构。凸/凹表面结构增加了基板周边区域和引线框架表面的表面粗糙度，因此液体封装材料可以填充在空腔和凹部中; 因此通过固化的封装材料形成的封装构件可以与衬底和引线框架一体地牢固地组合。此外，透镜的底部设置有用于增加透镜的密封水平的粘合剂。此外，本发明采用添加了具有良好导热性的材料的焊膏，因此可以将由LED芯片产生的热迅速地散发到外部。

5. 发明授权

US08247969B2 Optical lens having fluorescent layer adapted for LED packaging structure 有权
标题翻译：具有适用于LED封装结构的荧光层的光学透镜
公开(公告)号：US08247969B2
公开(公告)日：2012-08-21
申请号：US12892893
申请日：2010-09-28
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H05B33/04 , H01L33/10
CPC分类号： G02B27/0955 , G02B19/0028 , G02B19/0066 , H01L33/507 , H01L33/58 , H01L2224/48137 , H01L2224/48247
摘要： An optical lens having a fluorescent layer is provided. The optical lens is adapted for being employed in an LED packaging structure. The optical lens includes a substrate, at least one lens body, a lens shade, and a packaging member. The substrate is positioned at a bottommost side of the packaging structure, and the lens shade is positioned at a topmost side of the packaging structure. The lens body is positioned over the substrate and beneath the lens shade. A plurality of light emitting units are disposed on the substrate. The packaging member is adapted for packaging the substrate and the lens shade. The lens body is secured by the packing member so as to be positioned over the light emitting units. The lens body includes a fluorescent layer buried inside the lens body, and the lens body is positioned apart from the light emitting units for a certain distance.
摘要翻译：提供具有荧光层的光学透镜。光学透镜适用于LED封装结构。光学透镜包括基板，至少一个透镜体，透镜遮光板和包装部件。基板位于包装结构的最底侧，透镜遮光板位于包装结构的最上侧。透镜主体位于基板上方，并位于透镜遮光板下方。多个发光单元设置在基板上。包装构件适于包装基底和透镜遮蔽物。透镜体由密封构件固定，以便定位在发光单元之上。透镜体包括埋在透镜体内的荧光层，并且透镜体与发光单元隔开一定距离。

6. 发明申请

US20140301069A1 LIGHT EMITTING DIODE LIGHT TUBE 审中-公开
标题翻译：发光二极管灯管
公开(公告)号：US20140301069A1
公开(公告)日：2014-10-09
申请号：US13858212
申请日：2013-04-08
申请人： GEM WELTRONICS TWN CORPORATION
发明人： JON-FWU HWU , YUNG-FU WU , KUI-CHIANG LIU
IPC分类号： F21V3/04 , F21K99/00
CPC分类号： F21K9/27 , F21V3/02 , F21V29/89 , F21Y2103/10 , F21Y2115/10
摘要： A Light Emitting Diode (LED) light tube includes a substrate having a light emitting side formed with a recess and at least one communication hole extending therethrough and at least one illumination unit disposed at a bottom of the recess. The illumination unit is constituted by a plurality of dies wire-bond together in series connection, thereby forming LED units. An optical layer and a protection layer are disposed to cover the relatively small width of the recess, thereby shielding the illumination unit.
摘要翻译：发光二极管（LED）光管包括具有形成有凹部的发光侧的基板和延伸穿过其的至少一个连通孔以及设置在凹部的底部的至少一个照明单元。照明单元由串联连接在一起的多个模具构成，从而形成LED单元。光学层和保护层被设置成覆盖凹槽的相对小的宽度，从而遮蔽照明单元。

7. 发明授权

US08496771B2 Method of filling and sealing a fluorescent layer in a slot space defined by two optical lenses and a partition ring 有权
标题翻译：在由两个光学透镜和分隔环限定的狭槽空间中填充和密封荧光层的方法
公开(公告)号：US08496771B2
公开(公告)日：2013-07-30
申请号：US13014708
申请日：2011-01-26
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： B32B17/00
CPC分类号： H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A method of filling and sealing a fluorescent layer in a slot space defined by two optical lenses and a partition ring is disclosed, in which a slot space is defined by two optical glasses and a partition frame having a partition ring on the inner wall surface. The partition frame is installed with two slots diametrically opposite to each other, and the slot space is evacuated to allow filling of a fluorescent material, and then the two slots are sealed so that the moisture is prevented from permeating into the fluorescent layer, and thus the optical performance can be maintained over a long period.
摘要翻译：公开了一种在由两个光学透镜和分隔环限定的狭槽空间中填充和密封荧光层的方法，其中槽空间由两个光学眼镜和在内壁表面上具有分隔环的分隔框架限定。分隔框架安装有两个彼此径向相对的槽，并且槽空间被抽真空以允许填充荧光材料，然后将两个槽密封，使得防止水分渗入荧光层，因此可以长时间保持光学性能。

8. 发明授权

US08316534B2 Method for packaging airtight multi-layer array type LED 有权
标题翻译：封装密封多层阵列型LED的方法
公开(公告)号：US08316534B2
公开(公告)日：2012-11-27
申请号：US13014706
申请日：2011-01-26
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H05K3/30
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48137 , H01L2924/09701 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： A method for packaging an airtight multi-layer array type LED is disclosed. The method includes: integrally forming a metal substrate with an airtight metal frame surrounding an accommodating space; forming a light outlet platform surrounding a light outlet opening on a bottom of the accommodating space; forming two horizontal sealing through holes in the airtight metal frame, wherein each sealing through hole has one lead frame inserted therethrough, and all interstitial space in the two horizontal sealing through holes is completely sealed with a sealing material; disposing the optical units and optical components in the accommodating space; sequentially forming a dice protection layer, a fluorescent layer, and a silicone layer on the LED dices; and installing an optical glass cover on the top surface of the airtight metal frame to seal the packaging structure of the present invention.
摘要翻译：公开了一种用于封装气密多层阵列型LED的方法。该方法包括：用围绕容纳空间的气密金属框架一体地形成金属基板; 形成围绕容纳空间的底部上的出光口的光出口平台; 在气密金属框架中形成两个水平密封通孔，其中每个密封通孔具有插入其中的一个引线框架，两个水平密封通孔中的所有间隙空间用密封材料完全密封; 将光学单元和光学部件布置在容纳空间中; 在LED芯片上依次形成芯片保护层，荧光层和硅树脂层; 以及在气密金属框架的顶面安装光学玻璃盖以密封本发明的包装结构。

9. 发明申请

US20140321109A1 LIGHT EMITTING DIODE (LED) LIGHT TUBE 审中-公开
标题翻译：发光二极管（LED）灯管
公开(公告)号：US20140321109A1
公开(公告)日：2014-10-30
申请号：US13872090
申请日：2013-04-27
申请人： GEM WELTRONICS TWN CORPORATION
发明人： JON-FWU HWU , YUNG-FU WU , KUI-CHIANG LIU
IPC分类号： F21K99/00 , F21V29/00
CPC分类号： F21K9/27 , F21K9/275 , F21V29/70 , F21Y2115/10
摘要： A light emitting diode (LED) light tube includes a heat dissipation base having a light emitting side formed with a recess and at least one illumination unit and a bridging unit disposed on a bottom surface of the recess. The illumination unit and the bridging unit are connected electrically relative to each other via wire-bond technique.
摘要翻译：发光二极管（LED）灯管包括具有形成有凹部的发光侧的散热基底和设置在凹部的底面上的至少一个照明单元和桥接单元。照明单元和桥接单元通过引线键合技术彼此电连接。

10. 发明申请

US20140313711A1 LIGHT EMITTING DIODE (LED) LIGHT TUBE 审中-公开
标题翻译：发光二极管（LED）灯管
公开(公告)号：US20140313711A1
公开(公告)日：2014-10-23
申请号：US13864496
申请日：2013-04-17
申请人： GEM WELTRONICS TWN CORPORATION
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： F21V29/00
CPC分类号： F21V23/003 , F21S4/28 , F21V23/00 , F21V29/70 , F21Y2103/10 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014 , H01L2924/00
摘要： A Light Emitting Diode (LED) light tube includes a heat dissipation base having a light emitting side formed with a recess and at least one illumination unit and a bridging unit disposed on a bottom surface of the recess. The illumination unit and the bridging unit are connected electrically relative to each other via wire-bond technique. Two circuit units are disposed on the light emitting side of the heat dissipation base respectively located at two opposite sides of the recess.
摘要翻译：发光二极管（LED）灯管包括具有形成有凹部的发光侧的散热基底和设置在凹部的底表面上的至少一个照明单元和桥接单元。照明单元和桥接单元通过引线键合技术彼此电连接。两个电路单元设置在分别位于凹部的两个相对侧的散热基底的发光侧。

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