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    • 8. 发明授权
    • Emissive device with chiplets
    • 带小灯的发射装置
    • US08796700B2
    • 2014-08-05
    • US12271952
    • 2008-11-17
    • Ronald S. CokJohn W. Hamer
    • Ronald S. CokJohn W. Hamer
    • H01L29/88
    • H01L27/3276H01L27/3255H01L51/524
    • An emissive device includes a substrate having a substrate surface; a chiplet adhered to the substrate surface, the chiplet having one or more connection pads; a bottom electrode formed on the substrate surface, one or more organic or inorganic light-emitting layers formed over the bottom electrode, and a top electrode formed over the one or more organic or inorganic light-emitting layers; an electrical conductor including a transition layer formed over only a portion of the chiplet and only a portion of the substrate surface, the transition layer exposing at least one connection pad, the electrical conductor formed in electrical contact with the exposed connection pad and the bottom electrode; and an LED spaced from the chiplet and including a layer of light-emissive material formed over the bottom electrode and a top electrode formed over the light-emissive layer.
    • 发射装置包括具有基板表面的基板; 小瞳附着在基底表面上,小瞳具有一个或多个连接垫; 形成在所述基板表面上的底部电极,形成在所述底部电极上方的一个或多个有机或无机发光层,以及形成在所述一个或多个有机或无机发光层上的顶部电极; 包括仅在所述小芯片的一部分上形成的过渡层和所述衬底表面的一部分的电导体,所述过渡层暴露至少一个连接焊盘,所述电导体与所暴露的连接焊盘和所述底部电极形成电接触 ; 以及与小灯间隔开的LED并且包括在底部电极上形成的发光材料层和形成在发光层上的顶部电极。