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    • 4. 发明授权
    • Method and apparatus for creating, using, and dispensing tubes
    • 用于制造,使用和分配管子的方法和装置
    • US07472724B2
    • 2009-01-06
    • US10864990
    • 2004-06-10
    • Michael E. LesterJoseph Williams, IV
    • Michael E. LesterJoseph Williams, IV
    • F16L11/00
    • H02K15/10H02K3/345Y10T29/49073
    • The present invention includes a method of lining a core slot that includes the steps of unwinding a tube, separating a portion of the tube, inserting the tube into a core slot, and expanding the tube to line the core slot. The present invention also includes a continuous piece of helically-wound tubing that is wound on a spool along with an apparatus and method used for creating the spool of tubing. The method includes the steps of helically wrapping a web of material in an overlapping relationship to form a helically-wound tube, advancing the tube in a longitudinal direction of the tube and winding the tube onto a spool while at least a portion of the tube is being formed by the step of helically-wrapping. Method variations in which one or more of the aforementioned steps may be eliminated as appropriate, can be used for many other uses.
    • 本发明包括一种衬套芯槽的方法,该方法包括以下步骤:展开管,分离管的一部分,将管插入到芯槽中,以及使管膨胀以对准芯槽。 本发明还包括连续的螺旋缠绕的管道,其连同用于产生管线阀的装置和方法一起卷绕在阀芯上。 该方法包括以重叠的关系螺旋地缠绕材料纤维网以形成螺旋缠绕的管的步骤,使管沿着管的纵向方向推进,并将管缠绕在卷轴上,而管的至少一部分是 由螺旋缠绕的步骤形成。 其中可以适当地消除一个或多个上述步骤的方法变化可用于许多其它用途。
    • 6. 发明申请
    • Circuit board carrier/solder pallet
    • 电路板载体/焊盘
    • US20060226201A1
    • 2006-10-12
    • US11400866
    • 2006-04-10
    • Rich Reed
    • Rich Reed
    • A47J36/02
    • B23K3/0607H05K3/3452H05K3/3468H05K2203/0156H05K2203/0165H05K2203/0557
    • Provided is a plaque and its method of manufacture, the plaque including a cured thermoset phenolic resin and a reinforcing material that is molded into a controlled thickness. Also provided is a solder pallet utilizing the plaque in its manufacture. The plaque can be manufactured by forming a preform of the raw materials, preheating the preform, molding the preform into a plaque of the desired thickness, and then cooling the plaque at an elevated temperature to maintain the flatness of the plaque. The plaque can then be formed into the desired solder pallet by cutting the plaque to an appropriate size, if necessary, adding holes an clips for use in a soldering process for soldering circuit boards, for example.
    • 提供了一种斑块及其制造方法,该斑块包括固化的热固性酚醛树脂和模制成受控厚度的增强材料。 还提供了在其制造中利用斑块的焊料托盘。 斑块可以通过形成原料的预成型件,预热预成型件,将预成型件成型为所需厚度的板,然后在升高的温度下冷却板以保持板的平坦度来制造。 然后,如果需要,可以将斑块形成为期望的焊料托盘,如果需要,可以将孔插入用于焊接电路板的焊接工艺中的夹子。
    • 7. 发明申请
    • Method and apparatus for creating, using, and dispensing tubes
    • 用于制造,使用和分配管子的方法和装置
    • US20050040277A1
    • 2005-02-24
    • US10864990
    • 2004-06-10
    • Michael LesterJoseph Williams
    • Michael LesterJoseph Williams
    • H02K3/34H02K15/10H02K15/09
    • H02K15/10H02K3/345Y10T29/49073
    • The present invention includes a method of lining a core slot that includes the steps of unwinding a tube, separating a portion of the tube, inserting the tube into a core slot, and expanding the tube to line the core slot. The present invention also includes a continuous piece of helically-wound tubing that is wound on a spool along with an apparatus and method used for creating the spool of tubing. The method includes the steps of helically wrapping a web of material in an overlapping relationship to form a helically-wound tube, advancing the tube in a longitudinal direction of the tube and winding the tube onto a spool while at least a portion of the tube is being formed by the step of helically-wrapping. Method variations in which one or more of the aforementioned steps may be eliminated as appropriate, can be used for many other uses.
    • 本发明包括一种衬套芯槽的方法,该方法包括以下步骤:展开管,分离管的一部分,将管插入到芯槽中,以及使管膨胀以对准芯槽。 本发明还包括连续的螺旋缠绕的管道,其连同用于产生管线阀的装置和方法一起卷绕在阀芯上。 该方法包括以重叠的关系螺旋地缠绕材料纤维网以形成螺旋缠绕的管的步骤,使管沿着管的纵向方向推进,并将管缠绕在卷轴上,而管的至少一部分是 由螺旋缠绕的步骤形成。 其中可以适当地消除一个或多个上述步骤的方法变化可用于许多其它用途。
    • 10. 发明申请
    • CIRCUIT BOARD CARRIER/SOLDER PALLET
    • 电路板载体/焊盘
    • US20100038824A1
    • 2010-02-18
    • US12603746
    • 2009-10-22
    • Richard A. Reed
    • Richard A. Reed
    • C08J5/00
    • B23K3/0607B23K1/0016B23K1/085B23K3/087B23K2101/42H05K3/3452H05K3/3468H05K2203/0156H05K2203/0165H05K2203/0557
    • Provided is a plaque and its method of manufacture, the plaque including a binding material and a reinforcing material that is molded into a controlled thickness. Also provided is a solder pallet utilizing the plaque in its manufacture. The plaque can be manufactured by forming a preform of the raw materials, optionally preheating the preform, molding the preform into a plaque of the desired thickness, and then cooling the plaque at an elevated temperature to maintain the flatness of the plaque without the need for sanding or otherwise machining the plaque to the desired size. The plaque can then be formed into the desired solder pallet by cutting the plaque to appropriate dimensions, if necessary, and adding holes and/or clips for use in a soldering process for soldering circuit boards, for example.
    • 提供了一种斑块及其制造方法,该斑块包括粘合材料和模制成受控厚度的增强材料。 还提供了在其制造中利用斑块的焊料托盘。 可以通过形成原料的预成型件,任选地预热预成型件,将预成型件成型为所需厚度的板,然后在升高的温度下冷却该板,以保持板的平坦度,而不需要 打磨或以其他方式加工斑块至所需尺寸。 然后,如果需要,通过将斑块切割成适当的尺寸,并且例如添加用于焊接电路板的焊接工艺中的孔和/或夹子,然后可以将斑块形成为期望的焊料托盘。