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1. 发明授权

US4595186A Rotating welding fixture 失效
标题翻译：旋转焊接夹具
公开(公告)号：US4595186A
公开(公告)日：1986-06-17
申请号：US683924
申请日：1984-12-20
申请人： Richard A. Reed , William J. Kidd
发明人： Richard A. Reed , William J. Kidd
IPC分类号： B23K37/04 , B23Q1/04
CPC分类号： B23K37/0461
摘要： A rotating welding fixture for holding a pipe fitting against a welding table so that socket welds can be fabricated in one continuous operation. A locking dowel is passed into an opening in the fitting and the fitting locked between the table top and the dowel so that the entire weld region is fully exposed to the welding rod. The table is rotatably supported in a base so that the work can be turned past the welding rod to complete the weld without having to break the weld bead.
摘要翻译：用于将管配件保持抵靠焊台的旋转焊接夹具，使得插座焊缝可以在一个连续的操作中制造。锁定销被插入配件的开口中，并且配件锁定在台面和销钉之间，使得整个焊接区域完全暴露于焊条。工作台可旋转地支撑在基座中，使得工件可以转过焊条，完成焊接，而不必破坏焊道。

2. 发明申请

US20080142568A1 CIRCUIT CARRIER BOARD/SOLDER PALLETT 审中-公开
标题翻译：电路板/焊盘
公开(公告)号：US20080142568A1
公开(公告)日：2008-06-19
申请号：US11948418
申请日：2007-11-30
申请人： Richard A. Reed
发明人： Richard A. Reed
IPC分类号： B23K3/08 , B29C67/24
CPC分类号： B23K3/0607 , B23K1/0016 , B23K1/085 , B23K3/087 , B23K2101/42 , H05K3/3452 , H05K3/3468 , H05K2203/0156 , H05K2203/0165 , H05K2203/0557
摘要： Provided is a plaque and its method of manufacture, the plaque including a binding material and a reinforcing material that is molded into a controlled thickness. Also provided is a solder pallet utilizing the plaque in its manufacture. The plaque can be manufactured by forming a preform of the raw materials, optionally preheating the preform, molding the preform into a plaque of the desired thickness, and then cooling the plaque at an elevated temperature to maintain the flatness of the plaque without the need for sanding or otherwise machining the plaque to the desired size. The plaque can then be formed into the desired solder pallet by cutting the plaque to appropriate dimensions, if necessary, and adding holes and/or clips for use in a soldering process for soldering circuit boards, for example.
摘要翻译：提供了一种斑块及其制造方法，该斑块包括粘合材料和模制成受控厚度的增强材料。还提供了在其制造中利用斑块的焊料托盘。可以通过形成原料的预成型件，任选地预热预成型件，将预成型件成型为所需厚度的板，然后在升高的温度下冷却该板，以保持板的平坦度，而不需要打磨或以其他方式加工斑块至所需尺寸。然后，如果需要，通过将斑块切割成适当的尺寸，并且例如添加用于焊接电路板的焊接工艺中的孔和/或夹子，然后可以将斑块形成为期望的焊料托盘。

3. 发明授权

US5655981A Metalized hockey stick 失效
标题翻译：金属曲棍球棒
公开(公告)号：US5655981A
公开(公告)日：1997-08-12
申请号：US601252
申请日：1996-02-14
申请人： Richard A. Reed
发明人： Richard A. Reed
IPC分类号： A63B59/14 , A63B59/12
CPC分类号： A63B59/70 , A63B2102/24 , A63B2209/02
摘要： A shaft for a hockey stick comprised of a non-metallic elongated member having a generally rectangular cross-section; a first layer comprised of a resilient yet tough material bonded to the member; a second layer comprised of metal applied to the first layer by a metal deposition process; and a third layer comprised of a clear resilient, tough material encasing said second layer of metal.
摘要翻译：一种用于曲棍球杆的轴，由具有大致矩形横截面的非金属细长构件组成; 第一层由结合到构件的弹性而坚韧的材料组成; 由通过金属沉积工艺施加到第一层的金属构成的第二层; 以及由包围所述第二金属层的透明弹性的韧性材料构成的第三层。

4. 发明申请

US20100038824A1 CIRCUIT BOARD CARRIER/SOLDER PALLET 审中-公开
标题翻译：电路板载体/焊盘
公开(公告)号：US20100038824A1
公开(公告)日：2010-02-18
申请号：US12603746
申请日：2009-10-22
申请人： Richard A. Reed
发明人： Richard A. Reed
IPC分类号： C08J5/00
CPC分类号： B23K3/0607 , B23K1/0016 , B23K1/085 , B23K3/087 , B23K2101/42 , H05K3/3452 , H05K3/3468 , H05K2203/0156 , H05K2203/0165 , H05K2203/0557
摘要： Provided is a plaque and its method of manufacture, the plaque including a binding material and a reinforcing material that is molded into a controlled thickness. Also provided is a solder pallet utilizing the plaque in its manufacture. The plaque can be manufactured by forming a preform of the raw materials, optionally preheating the preform, molding the preform into a plaque of the desired thickness, and then cooling the plaque at an elevated temperature to maintain the flatness of the plaque without the need for sanding or otherwise machining the plaque to the desired size. The plaque can then be formed into the desired solder pallet by cutting the plaque to appropriate dimensions, if necessary, and adding holes and/or clips for use in a soldering process for soldering circuit boards, for example.
摘要翻译：提供了一种斑块及其制造方法，该斑块包括粘合材料和模制成受控厚度的增强材料。还提供了在其制造中利用斑块的焊料托盘。可以通过形成原料的预成型件，任选地预热预成型件，将预成型件成型为所需厚度的板，然后在升高的温度下冷却该板，以保持板的平坦度，而不需要打磨或以其他方式加工斑块至所需尺寸。然后，如果需要，通过将斑块切割成适当的尺寸，并且例如添加用于焊接电路板的焊接工艺中的孔和/或夹子，然后可以将斑块形成为期望的焊料托盘。

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