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1. 发明申请

US20150200344A1 THERMAL GROUND PLANES AND LIGHT-EMITTING DIODES 有权
标题翻译：热地板和发光二极管
公开(公告)号：US20150200344A1
公开(公告)日：2015-07-16
申请号：US14185669
申请日：2014-02-20
申请人： i2C Solutions, LLC
发明人： William Francis , Michael Hulse
IPC分类号： H01L33/64 , H01L33/62 , H01L33/00
CPC分类号： H01L33/648 , F21V29/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2933/0066 , H01L2933/0075 , H05K3/0058 , H05K3/0061 , H05K2201/10106 , H01L2924/00014
摘要： Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.
摘要翻译：公开了一种或多种LED的热管理方法和系统。根据本文所述的一些实施例，一个或多个LED可以与热接地平面的外部层耦合。例如，一个或多个LED可以在与热接地平面耦合之前与其中蚀刻有一个或多个导电迹线的电路载体电耦合。热接地平面可以与工作流体一起充电和/或在与LED耦合之后被气密密封。

2. 发明授权

US10458716B2 Conformal thermal ground planes 有权
公开(公告)号：US10458716B2
公开(公告)日：2019-10-29
申请号：US14532650
申请日：2014-11-04
申请人： i2C Solutions, LLC
发明人： Michael Hulse , William Francis , Yung Cheng Lee
IPC分类号： F28D15/02 , F28D15/04 , H01L23/367 , B23P15/26 , H01L23/427
摘要： A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.

3. 发明授权

US09374904B2 Thermal ground planes and light-emitting diodes 有权
标题翻译：热接地层和发光二极管
公开(公告)号：US09374904B2
公开(公告)日：2016-06-21
申请号：US14185669
申请日：2014-02-20
申请人： i2C Solutions, LLC
发明人： William Francis , Michael Hulse
IPC分类号： H01L31/02 , H05K1/00 , H05K3/00 , F21V29/00
CPC分类号： H01L33/648 , F21V29/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2933/0066 , H01L2933/0075 , H05K3/0058 , H05K3/0061 , H05K2201/10106 , H01L2924/00014
摘要： Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.
摘要翻译：公开了一种或多种LED的热管理方法和系统。根据本文所述的一些实施例，一个或多个LED可以与热接地平面的外部层耦合。例如，一个或多个LED可以在与热接地平面耦合之前与其中蚀刻有一个或多个导电迹线的电路载体电耦合。热接地平面可以与工作流体一起充电和/或在与LED耦合之后被气密密封。

4. 发明申请

US20160123678A1 CONFORMAL THERMAL GROUND PLANES 审中-公开
标题翻译：一致的热地球公园
公开(公告)号：US20160123678A1
公开(公告)日：2016-05-05
申请号：US14532650
申请日：2014-11-04
申请人： i2C Solutions, LLC
发明人： Michael Hulse , William Francis
IPC分类号： F28D15/02 , B23P15/26
CPC分类号： F28D15/02 , B23P15/26 , B23P2700/09 , F28D15/0233 , F28D15/04 , H01L23/3675 , H01L23/427
摘要： A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.
摘要翻译：根据一些实施例公开了保形热接地平面，以及根据其他实施例的制造保形热接地平面的方法。该方法可以包括将第一平面容纳层形成为具有第一非平面形状的第一非平面容纳层; 将第二平面容纳层形成为具有第二非平面形状的第二非平面容纳层; 在所述第一非平面容纳层和所述第二非平面容纳层之间设置液体腔和蒸气腔; 密封所述第一非平面容纳层的至少一部分和所述第二非平面容纳层的至少一部分; 并用工作流体至少充入液体腔。

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