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1. 发明授权

US07813132B2 Heat dissipation assembly 失效
标题翻译：散热组件
公开(公告)号：US07813132B2
公开(公告)日：2010-10-12
申请号：US12248897
申请日：2008-10-10
申请人： Zhi-Yong Zhou , Ji-Yun Qin , Xiao-Jian He
发明人： Zhi-Yong Zhou , Ji-Yun Qin , Xiao-Jian He
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/34 , H01L23/3737 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. Two ears extend outwardly from the frame and accommodate opposite ends of an abutting body of a wire clip therein.
摘要翻译：散热组件具有容纳装置，其防止热界面材料不必要地移动到散热器的顶表面上的周围区域。容纳装置包括对应地覆盖热界面材料的帽和从帽的底端向下延伸并附接到散热器的顶部的周边的环形框架。盖包括天花板和从天花板的边缘向下和向外延伸的多个倾斜的侧壁，从而在盖子内形成保护空间，与散热片的顶表面结合以封闭热界面材料。两个耳朵从框架向外延伸并且容纳线夹的邻接体的相对端部。

2. 发明授权

US08069909B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08069909B2
公开(公告)日：2011-12-06
申请号：US12399028
申请日：2009-03-06
申请人： Ji-Yun Qin , Zhi-Yong Zhou
发明人： Ji-Yun Qin , Zhi-Yong Zhou
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.
摘要翻译：散热装置包括与电子部件热接触的第一散热器，连接到第一散热器的第二散热器和将第一散热器与第二散热器热连接的热管。第一散热器具有在其侧面限定切口的第一基座。第二个散热器有第二个基座。热管包括设置在基座上的蒸发部分，设置在第二基座上的冷凝部分和将蒸发部分与冷凝部分相互连接的连接部分。插入部从第二基部突出并且嵌合地插入到切口中。热管的连接部分延伸穿过插入部分。

3. 发明申请

US20090321054A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20090321054A1
公开(公告)日：2009-12-31
申请号：US12399028
申请日：2009-03-06
申请人： Ji-Yun Qin , Zhi-Yong Zhou
发明人： Ji-Yun Qin , Zhi-Yong Zhou
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.
摘要翻译：散热装置包括与电子部件热接触的第一散热器，连接到第一散热器的第二散热器和将第一散热器与第二散热器热连接的热管。第一散热器具有在其侧面限定切口的第一基座。第二个散热器有第二个基座。热管包括设置在基座上的蒸发部分，设置在第二基座上的冷凝部分和将蒸发部分与冷凝部分相互连接的连接部分。插入部从第二基部突出并且嵌合地插入到切口中。热管的连接部分延伸穿过插入部分。

4. 发明授权

US08381801B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08381801B2
公开(公告)日：2013-02-26
申请号：US12494342
申请日：2009-06-30
申请人： Zhi-Yong Zhou , Ji-Yun Qin , Hao-Xia Liu
发明人： Zhi-Yong Zhou , Ji-Yun Qin , Hao-Xia Liu
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/367 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink defines a receiving portion at a lateral side thereof. The heat pipe includes an evaporating section attached to the first heat sink, a condensing section attached to the second heat sink and a connecting section interconnecting the evaporating section with the condensing section. An engaging portion protrudes from a lateral side of the second heat sink and is firmly embedded in and lockable with the receiving portion of the first heat sink. The heat pipe extends through the engaging portion.
摘要翻译：散热装置包括与电子部件热接触的第一散热器，连接到第一散热器的第二散热器和将第一散热器与第二散热器热连接的热管。第一散热器在其侧面限定接收部分。热管包括附接到第一散热器的蒸发部分，连接到第二散热器的冷凝部分和将蒸发部分与冷凝部分互连的连接部分。接合部分从第二散热器的侧面突出并且牢固地嵌入第一散热器的接收部分并且可与第一散热器的接收部分锁定。热管延伸穿过接合部分。

5. 发明授权

US08267157B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08267157B2
公开(公告)日：2012-09-18
申请号：US12535672
申请日：2009-08-04
申请人： Ji-Yun Qin , Zhi-Yong Zhou
发明人： Ji-Yun Qin , Zhi-Yong Zhou
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate.
摘要翻译：散热装置包括基座和设置在基座上的翅片组，以及将基座和翅片组热连接在一起的多个热管。底座包括衬底和连接到衬底底部的导电板。热管包括蒸发部分和从蒸发部分向上延伸并通过翅片组的冷凝部分。蒸发部分完全容纳在基板中并与导电板接触。

6. 发明授权

US07950828B2 LED lamp 失效
标题翻译：点灯
公开(公告)号：US07950828B2
公开(公告)日：2011-05-31
申请号：US12024964
申请日：2008-02-01
申请人： Wen-Xiang Zhang , Guang Yu , Jin-Song Feng , Zhi-Yong Zhou
发明人： Wen-Xiang Zhang , Guang Yu , Jin-Song Feng , Zhi-Yong Zhou
IPC分类号： F21V29/00
CPC分类号： F21K9/00 , F21K9/65 , F21V14/02 , F21V19/02 , F21V29/73 , F21V29/74 , F21V29/75 , F21V29/763 , F21V29/77 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10
摘要： An LED lamp includes a first heat sink, a second heat sink and a plurality of LED modules. The second heat sink is located at a lateral side of the first heat sink and pivotally connects with the first heat sink. The LED modules are evenly attached on bottoms of the first and second heat sinks. The second heat sink can be rotated relative to the first heat sink to be fixed at a required position, whereby an illumination angle of the LED lamp can be adjusted. Heat generated by the LED modules is dissipated by the first and second heat sinks.
摘要翻译： LED灯包括第一散热器，第二散热器和多个LED模块。第二散热器位于第一散热器的侧面并与第一散热器枢转连接。 LED模块均匀地附着在第一和第二散热器的底部。第二散热器可以相对于第一散热器旋转以固定在所需位置，从而可以调节LED灯的照明角度。由LED模块产生的热量由第一和第二散热器消散。

7. 发明授权

US07810950B2 LED lamp having a vapor chamber for dissipating heat generated by LEDS of the LED lamp 失效
标题翻译： LED灯具有用于散发LED灯的LEDS产生的热量的蒸气室
公开(公告)号：US07810950B2
公开(公告)日：2010-10-12
申请号：US12131111
申请日：2008-06-01
申请人： Zhi-Yong Zhou , Qiao-Li Ding
发明人： Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： F21S4/00 , F21V21/00
CPC分类号： F21V29/004 , F21K9/00 , F21V29/51 , F21V29/763 , F21Y2115/10
摘要： A heat dissipation device includes a heat conductive member, a fin unit coupled to a bottom surface of the heat conductive member and a plurality of LED modules attached to a top surface of the heat conductive member. The heat conductive member consists of a first plate, a second plate parallel to the first plate and a plurality of posts sandwiched between the first and second plates. Peripheries of the first and second plate are in a hermetical conjunction with each other to form a chamber containing a phase-changeable working fluid therein. The first and second plates therein define a plurality of through orifices. The posts each define therein a screwed orifice which is in alignment with corresponding through orifices of the first and second plates respectively and threadedly receives a screw extending through the LED module.
摘要翻译：散热装置包括导热构件，耦合到导热构件的底表面的翅片单元和附接到导热构件的顶表面的多个LED模块。导热构件包括第一板，平行于第一板的第二板和夹在第一板和第二板之间的多个柱。第一和第二板的周边彼此密封结合以形成其中包含相变工作流体的室。其中的第一和第二板限定多个通孔。所述柱分别在其中限定有螺纹孔口，所述螺纹孔口分别对应于所述第一和第二板的对应的通孔，并且螺纹地容纳延伸穿过所述LED模块的螺钉。

8. 发明授权

US07694721B2 Miniature liquid cooling device having an integral pump 失效
标题翻译：具有整体泵的微型液体冷却装置
公开(公告)号：US07694721B2
公开(公告)日：2010-04-13
申请号：US11309612
申请日：2006-08-31
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/473 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).
摘要翻译：微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。收容空间由外壳封闭。吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

9. 发明授权

US07679912B1 Heat sink assembly having heat pipe 有权
标题翻译：具有热管的散热器组件
公开(公告)号：US07679912B1
公开(公告)日：2010-03-16
申请号：US12329611
申请日：2008-12-07
申请人： Hai-Gang Xiong , Zhi-Yong Zhou
发明人： Hai-Gang Xiong , Zhi-Yong Zhou
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： F28D15/0275
摘要： A heat sink assembly includes a first heat dissipating plate, a second heat dissipating plate, at least one flat heat pipe horizontally positioned between the first heat dissipating plate and the second heat dissipating plate. The at least one flat heat pipe surrounds or defines an enclosed-space. The enclosed-space is closed by the first heat dissipating plate and the second heat dissipating plate. At least one through hole communicates with the enclosed-space and is defined in the second heat dissipating plate.
摘要翻译：散热器组件包括第一散热板，第二散热板，水平放置在第一散热板和第二散热板之间的至少一个扁平热管。至少一个扁平热管围绕或限定封闭空间。封闭空间由第一散热板和第二散热板封闭。至少一个通孔与封闭空间连通并限定在第二散热板中。

10. 发明申请

US20100014966A1 FASTENING DEVICE FOR FANS 失效
标题翻译：风扇装置
公开(公告)号：US20100014966A1
公开(公告)日：2010-01-21
申请号：US12241066
申请日：2008-09-30
申请人： Zhi-Yong Zhou , Qiao-Li Ding , Hai-Bing Cao
发明人： Zhi-Yong Zhou , Qiao-Li Ding , Hai-Bing Cao
IPC分类号： F04D29/64 , F16B21/08
CPC分类号： F04D29/64 , Y10T24/42
摘要： A fastening device is used for connecting a first and a second fan together. The two fans each have an upper flange and a lower flange and a cylindrical body interconnecting the upper flange and the lower flange. The fastening device includes a plate-shaped pad and two resilient portions respectively extending perpendicularly from two opposite sides of the pad. The two resilient portions respectively extend through the lower flange of the first fan and the upper flange of the second fan, pressing against the first fan and the second fan toward each other. The pad is sandwiched between the lower flange of the first fan and the upper flange of the second fan.
摘要翻译：紧固装置用于将第一和第二风扇连接在一起。两个风扇各自具有上凸缘和下凸缘以及连接上凸缘和下凸缘的圆柱体。紧固装置包括板形垫和分别从垫的两个相对侧垂直延伸的两个弹性部分。两个弹性部分分别延伸穿过第一风扇的下凸缘和第二风扇的上凸缘，将第一风扇和第二风扇朝向彼此压靠。垫片夹在第一风扇的下凸缘和第二风扇的上凸缘之间。

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