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    • 10. 发明授权
    • Process for fabricating organic semiconductor device involving selective patterning
    • 用于制造涉及选择性图案化的有机半导体器件的工艺
    • US06403397B1
    • 2002-06-11
    • US09605507
    • 2000-06-28
    • Howard Edan Katz
    • Howard Edan Katz
    • H01L5140
    • H01L51/0004H01L51/0014H01L51/0545
    • An improved process for forming devices utilizing patterned organic semiconductor films is provided. The process involves treating a surface to selectively provide regions of greater affinity and lesser affinity for an organic semiconductor or an organic semiconductor solution. When the organic semiconductor, or solution comprising the semiconductor, is deposited on the treated surface, either the organic semiconductor or the organic semiconductor solution dewets from the lesser affinity regions or the resultant film adheres only weakly to the lesser affinity regions such that selective removal is readily performed. And even where such removal is not performed, the portions of the organic semiconductor film overlying the greater affinity regions exhibit higher mobility and better film continuity relative to the other portions of the film.
    • 提供了利用图案化有机半导体膜形成器件的改进方法。 该方法包括处理表面以选择性地提供对有机半导体或有机半导体溶液具有更高亲和力和较小亲和力的区域。 当有机半导体或包含半导体的溶液沉积在经处理的表面上时,有机半导体或有机半导体溶液从较小亲合性区域或所得膜露出仅对较小亲合性区域弱,使得选择性除去 很容易执行。 并且即使在不进行这种去除的情况下,覆盖较大亲合性区域的有机半导体膜的部分相对于膜的其它部分表现出更高的迁移率和更好的膜连续性。