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    • 2. 发明授权
    • Forming patterned thin film metal layers
    • 形成图案化的薄膜金属层
    • US06770549B2
    • 2004-08-03
    • US10141362
    • 2002-05-08
    • Zhenan BaoPeter Kian-Hoon HoTakao Someya
    • Zhenan BaoPeter Kian-Hoon HoTakao Someya
    • H01L2120
    • H01L21/76838H01L21/288H01L51/0021H01L51/0024H01L51/0097H01L51/0512
    • The specification describes a pattern transfer technique for forming patterns of thin films of high resolution over large areas. It involves forming a pattern layer on a transfer substrate, patterning the pattern layer while on the transfer substrate, then contacting the transfer substrate with the receiving substrate. The surface of the receiving substrate is treated to activate the surface thereby improving adhesion of the transfer pattern to the receiving substrate. The activation treatment involves forming a layer of metal particles on the surface of the receiving substrate. The pattern layer is preferably of the same metal, or a similar metal or alloy, and is transferred from the transfer substrate to the receiving substrate by metallurgical bonding. The method of the invention is particularly useful for printing metal conductor patterns (metalization), and device features, on flexible polymer substrates in, for example, thin film transistor (TFT) technology.
    • 本说明书描述了用于在大面积上形成高分辨率薄膜图案的图案转印技术。 它涉及在转移基板上形成图案层,在转印衬底上图案化图案层,然后使转印衬底与接收衬底接触。 处理接收基板的表面以激活表面,从而改善转印图案对接收基板的粘附。 活化处理包括在接收基材的表面上形成一层金属颗粒。 图案层优选为相同的金属或类似的金属或合金,并且通过冶金结合从转印基板转移到接收基板。本发明的方法特别适用于印刷金属导体图案(金属化)和 在诸如薄膜晶体管(TFT)技术的柔性聚合物基板上的器件特征。
    • 9. 发明授权
    • Patterning crystalline compounds on surfaces
    • 在表面上形成结晶化合物
    • US07795145B2
    • 2010-09-14
    • US11353934
    • 2006-02-15
    • Marcos GomezPeter ErkFrauke RichterZhenan BaoShuhong Liu
    • Marcos GomezPeter ErkFrauke RichterZhenan BaoShuhong Liu
    • H01L21/44
    • H01L51/0003B82Y10/00B82Y30/00B82Y40/00G03F7/0002H01L51/0019H01L51/0068H01L51/0533H01L51/0545
    • A method of patterning the surface of a substrate with at least one organic semiconducting compound including: (a) providing a stamp having a surface including a plurality of indentations formed therein defining an indentation pattern contiguous with a stamping surface and defining a stamping pattern, (b) coating the stamping surface with at least one compound (C1) capable of binding to the surface of the substrate and at least one organic semiconducting compound (S), (c) contacting at least a portion of the surface of a substrate with the stamping surface to allow deposition of the compound (C1) on the substrate, (d) removing the stamping surface to provide a pattern of binding sites on the surface of the substrate, (e) applying a plurality of crystallites of the organic semiconducting compound (S) to the surface of the substrate to bind at least a portion of the applied crystallites to the binding sites on the surface of the substrate.
    • 一种利用至少一种有机半导体化合物对衬底的表面进行图案化的方法,包括:(a)提供具有表面的印模,所述表面包括形成在其中的多个凹口,所述压痕限定与冲压表面邻接的压痕图案并限定冲压图案( b)用至少一种能够结合到基底表面的化合物(C1)和至少一种有机半导体化合物(S)涂覆冲压表面,(c)将基底表面的至少一部分与 冲压表面以允许化合物(C1)沉积在基底上,(d)去除冲压表面以在基底表面上提供结合位点的图案,(e)施加多个有机半导体化合物的微晶( S)到基底的表面以将至少一部分施加的微晶结合到基底表面上的结合位点。