专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07781885B2 Optoelectronic semiconductor package and method for attaching heat dissipation element thereto 有权
标题翻译：光电子半导体封装及其散热元件的安装方法
公开(公告)号：US07781885B2
公开(公告)日：2010-08-24
申请号：US12114623
申请日：2008-05-02
申请人： Tai-Wei Lin , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
发明人： Tai-Wei Lin , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
IPC分类号： H01L23/10 , H01L21/00
CPC分类号： H01S5/02469 , H01L33/648 , H01L2224/48091 , H01S5/02208 , H01S5/02236 , H01S5/02288 , H01L2924/00014
摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.
摘要翻译：用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。

2. 发明授权

US08482215B2 Light emitting apparatus and control method thereof 有权
标题翻译：发光装置及其控制方法
公开(公告)号：US08482215B2
公开(公告)日：2013-07-09
申请号：US12662905
申请日：2010-05-11
申请人： Zeu-Chia Tan , Chi-Chui Yun , Jia-Bin Huang
发明人： Zeu-Chia Tan , Chi-Chui Yun , Jia-Bin Huang
IPC分类号： H05B37/02
CPC分类号： H05B33/0854
摘要： A light emitting apparatus and a control method thereof are provided. The light emitting apparatus has a semiconductor device capable of emitting light, and the control method includes the following descriptions. A driving power of the semiconductor device is reduced to an ideal power stepwise and gradually. After every time the driving power of the semiconductor device is reduced, the semiconductor device continually emits the light by the reduced driving power within a predetermined time.
摘要翻译：提供一种发光装置及其控制方法。发光装置具有能够发光的半导体器件，并且该控制方法包括以下描述。半导体器件的驱动功率逐渐降低到理想的功率。在每次半导体器件的驱动功率减小之后，半导体器件在预定时间内通过降低的驱动功率连续地发光。

3. 发明申请

US20090052483A1 OPTOELECTRONIC SEMICONDUCTOR PACKAGE AND METHOD FOR ATTACHING HEAT DISSIPATION ELEMENT THERETO 有权
标题翻译：光电半导体封装及其连接热释放元件的方法
公开(公告)号：US20090052483A1
公开(公告)日：2009-02-26
申请号：US12114623
申请日：2008-05-02
申请人： Tai-Wei LIN , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
发明人： Tai-Wei LIN , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
IPC分类号： H01S5/024 , H01L33/00
CPC分类号： H01S5/02469 , H01L33/648 , H01L2224/48091 , H01S5/02208 , H01S5/02236 , H01S5/02288 , H01L2924/00014
摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.
摘要翻译：用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。

4. 发明申请

US20080225239A1 PROJECTION APPARATUS AND ILLUMINATION SYSTEM THEREOF 审中-公开
标题翻译：投影设备及其照明系统
公开(公告)号：US20080225239A1
公开(公告)日：2008-09-18
申请号：US11950701
申请日：2007-12-05
申请人： Zeu-Chia Tan , Jia-Bin Huang , Chi-Chui Yun
发明人： Zeu-Chia Tan , Jia-Bin Huang , Chi-Chui Yun
IPC分类号： G03B21/16
CPC分类号： G03B21/16
摘要： An illumination system includes a lamp, an optical element, a fan and a wind-guiding device. The extended direction of the central axis of the fan is slanted to the optic axis of an illumination beam from the lamp with an angle. The wind-guiding device includes a wind-guiding portion and a frame having a first carrying surface for carrying the fan. A second carrying surface of the frame is opposite to the first carrying surface and faces towards the lamp and the optical element. A wind-guiding plate of the wind-guiding portion is extended from a side of the frame towards the optical element and has a bending corner. A part of a cooling airflow from the fan passes through an opening of the frame and is blown to the lamp directly, and another part thereof is guided by the bending corner and is blown directly to the optical element.
摘要翻译：照明系统包括灯，光学元件，风扇和导风装置。风扇的中心轴线的延伸方向以一角度从灯具倾斜到照明光束的光轴。导风装置包括导风部分和具有用于承载风扇的第一承载表面的框架。框架的第二承载表面与第一承载表面相对，并面向灯和光学元件。风导向部分的导风板从框架的一侧朝向光学元件延伸并且具有弯曲角。来自风扇的冷却气流的一部分通过框架的开口，并被直接吹到灯中，另一部分被弯曲角引导并被直接吹到光学元件。

5. 发明申请

US20100289432A1 Light emitting apparatus and control method thereof 有权
标题翻译：发光装置及其控制方法
公开(公告)号：US20100289432A1
公开(公告)日：2010-11-18
申请号：US12662905
申请日：2010-05-11
申请人： Zeu-Chia Tan , Chi-Chui Yun , Jia-Bin Huang
发明人： Zeu-Chia Tan , Chi-Chui Yun , Jia-Bin Huang
IPC分类号： H05B37/02
CPC分类号： H05B33/0854
摘要： A light emitting apparatus and a control method thereof are provided. The light emitting apparatus has a semiconductor device capable of emitting light, and the control method includes the following descriptions. A driving power of the semiconductor device is reduced to an ideal power stepwise and gradually. After every time the driving power of the semiconductor device is reduced, the semiconductor device continually emits the light by the reduced driving power within a predetermined time.
摘要翻译：提供一种发光装置及其控制方法。发光装置具有能够发光的半导体器件，并且该控制方法包括以下描述。半导体器件的驱动功率逐渐降低到理想的功率。在每次半导体器件的驱动功率减小之后，半导体器件在预定时间内通过降低的驱动功率连续地发光。

6. 发明申请

US20100091501A1 Light emitting diode apparatus and optical engine using the same 审中-公开
标题翻译：发光二极管装置和使用其的光学引擎
公开(公告)号：US20100091501A1
公开(公告)日：2010-04-15
申请号：US12588189
申请日：2009-10-07
申请人： Zeu-Chia Tan , Chi-Chui Yun , Wan-Chen Lai
发明人： Zeu-Chia Tan , Chi-Chui Yun , Wan-Chen Lai
IPC分类号： F21V29/00 , H01J61/52
CPC分类号： H01L33/486 , H01L2924/0002 , H05K1/0204 , H05K1/189 , H05K3/0061 , H05K2201/10106 , H05K2201/10287 , H05K2201/10416 , H01L2924/00
摘要： A light emitting diode (LED) apparatus includes a heat dissipating component, a flexible circuit board, a slug, a light emitting diode die, and a package material. The flexible circuit board has a hollow-out portion disposed on the heat dissipating component. The slug is thermal conductively connected to the heat dissipating component through the hollow-out portion of the flexible circuit board. The light emitting diode die is disposed on the slug, and electrically connected to the flexible circuit board. The package material covers the light emitting diode die and the slug, and the bottom thereof is connected to the flexible circuit board. The light emitting diode apparatus is applied to an optical engine having a chassis and a top cover. The flexible circuit board of the light emitting diode apparatus is assembled on the chassis, and the heat dissipating component thereof is assembled on the top cover.
摘要翻译：发光二极管（LED）装置包括散热部件，柔性电路板，芯棒，发光二极管管芯和封装材料。柔性电路板具有设置在散热部件上的中空部分。芯块通过柔性电路板的中空部分与散热部件导热连接。发光二极管裸片设置在芯片上，并电连接到柔性电路板。封装材料覆盖发光二极管裸片和芯块，其底部连接到柔性电路板。发光二极管装置应用于具有底架和顶盖的光学引擎。发光二极管装置的柔性电路板组装在底盘上，其散热部件组装在顶盖上。

7. 发明授权

US08363398B2 Electronic device with heat dissipation casing 失效
标题翻译：带散热外壳的电子设备
公开(公告)号：US08363398B2
公开(公告)日：2013-01-29
申请号：US12910852
申请日：2010-10-24
申请人： Zeu-Chia Tan
发明人： Zeu-Chia Tan
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： An electronic device includes a casing, an electronic component accommodated in the casing; and a composite heat conductive layer between the casing and the electronic component. The composite heat conductive layer includes a graphite layer and a thermal pad layer between the electronic component and the graphite layer. The thermal pad layer is attached to the electronic component. The graphite layer is attached to an inner surface of the casing. The graphite layer is located between the casing and the thermal pad layer. Heat conductive efficiency of the graphite layer along a horizontal spreading direction thereof exceeds that along a vertical thickness direction thereof. A surface area of the graphite layer is not less than that of the electronic component. Heat generated by the electronic component is evenly transferred and is spread to the casing via the graphite layer of the composite heat conductive layer.
摘要翻译：一种电子设备，包括壳体，容纳在壳体中的电子部件; 以及在壳体和电子部件之间的复合导热层。复合导热层包括在电子部件和石墨层之间的石墨层和散热垫层。散热垫层附着在电子部件上。石墨层附着在壳体的内表面上。石墨层位于壳体和热垫层之间。石墨层沿着水平方向的导热效率超过其垂直厚度方向的导热效率。石墨层的表面积不小于电子部件的表面积。由电子部件产生的热量被均匀地转移，并通过复合导热层的石墨层扩散到壳体。

8. 发明授权

US08238105B2 Heat sink and electronic device using the same 失效
标题翻译：散热器和电子设备使用相同
公开(公告)号：US08238105B2
公开(公告)日：2012-08-07
申请号：US12849936
申请日：2010-08-04
申请人： Zhi-Bin Guan , Yao-Ting Chang , Zeu-Chia Tan
发明人： Zhi-Bin Guan , Yao-Ting Chang , Zeu-Chia Tan
IPC分类号： H05K7/20
CPC分类号： H05K7/20509
摘要： An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides of the first cooling plate and the second cooling plate. A conducting member extends from the connection member, and contacts the chassis.
摘要翻译：电子设备包括底盘，安装在底盘中的电路板，耦合到电路板的存储卡和用于冷却存储卡的散热器。散热器包括第一冷却板，第二冷却板和连接在第一冷却板和第二冷却板的相应侧之间的连接件。导电构件从连接构件延伸并接触底盘。

9. 发明授权

US08760869B2 Electronic device using heat dissipation assembly 失效
标题翻译：使用散热组件的电子设备
公开(公告)号：US08760869B2
公开(公告)日：2014-06-24
申请号：US13329927
申请日：2011-12-19
申请人： Zeu-Chia Tan
发明人： Zeu-Chia Tan
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D2021/0029 , G06F1/20 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink.
摘要翻译：电子设备包括具有基板，固定到基板的中央处理单元和固定到基板的散热组件的中央处理模块。散热组件具有第一散热器，第二散热器和空气导流板。导风板阻挡通道的开口，以偏转和引导通过第一散热器和第二散热器的气流。

10. 发明授权

US08208251B2 Electronic device and heat dissipation apparatus of the same 失效
标题翻译：电子装置和散热装置相同
公开(公告)号：US08208251B2
公开(公告)日：2012-06-26
申请号：US12871856
申请日：2010-08-30
申请人： Zeu-Chia Tan
发明人： Zeu-Chia Tan
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a heat sink, a number of pipes connecting the heat sink to the heat dissipation block, and a plate plugged in a socket of the motherboard. The heat sink is mounted to the plate.
摘要翻译：散热装置设置在电子设备的外壳中。电子设备包括安装在壳体中的主板。散热装置包括安装在母板的电子元件上的散热块，散热片，将散热片连接到散热块的多个管以及插在主板的插座中的板。散热片安装在板上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式