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    • 9. 发明授权
    • Liquid ejection head
    • 液体喷头
    • US07980656B2
    • 2011-07-19
    • US12485234
    • 2009-06-16
    • Makoto SakuraiIchiro Saito
    • Makoto SakuraiIchiro Saito
    • B41J2/165
    • B41J2/14129B41J2/1603B41J2/1628B41J2/1631B41J2/1632B41J2/1634B41J2/1645B41J2/1646B41J2202/03
    • On a liquid ejection head substrate, an upper protective layer, as well as coming into contact with a resin layer of a path forming member having an ejection opening, comes into contact with ink in a heat generating portion inside the channel formed. The upper protective layer contains iridium and silicon. The upper protective layer is configured so that, at a surface in contact with the ink and resin layer, Ir100-XSiX attains a 15 at. %≦X≦30 at. % silicon content rate, and that X approaches zero as a position in the upper protective layer approaches an adhesion layer. As a result, at the interface where the upper protective layer comes into contact with the path forming member, by the silicon attaining the heretofore described content rate, it is possible to improve the adhesion with the path forming member made of resin compared with a case of using iridium alone.
    • 在液体喷射头基板上,上保护层以及与具有喷射口的路径形成部件的树脂层接触,在形成的通道内部的发热部分与油墨接触。 上保护层含有铱和硅。 上保护层被配置为使得在与油墨和树脂层接触的表面上,Ir100-XSiX达到15at。 %≦̸ X≦̸ 30 at。 %硅含量率,并且当上保护层中的位置接近粘附层时,X接近零。 结果,在上保护层与路径形成部件接触的界面处,通过​​获得迄今为止描述的含有率的硅,可以提高与树脂制成的路径形成部件的粘合性, 单独使用铱。
    • 10. 发明申请
    • LIQUID EJECTION HEAD
    • 液体喷射头
    • US20090315954A1
    • 2009-12-24
    • US12485234
    • 2009-06-16
    • Makoto SakuraiIchiro Saito
    • Makoto SakuraiIchiro Saito
    • B41J2/05
    • B41J2/14129B41J2/1603B41J2/1628B41J2/1631B41J2/1632B41J2/1634B41J2/1645B41J2/1646B41J2202/03
    • On the liquid ejection head substrate, an upper protective layer, as well as coming into contact with the resin layer which configures a path forming member such as a ejection opening, comes into contact with ink in an heat generating portion inside the channel formed. The upper protective layer contains iridium and silicon. The upper protective layer is configured so that, at a surface in contact with the ink and resin layer, Ir100-xSix attains a 15 at. %≦X≦30 at. % silicon content rate, and that X more becomes zero as a position in the upper protective layer more approaches an adhesion layer. As a result, at the interface where the upper protective layer comes into contact with the path forming member, by the silicon attaining the heretofore described content rate, it is possible to improve the adhesion with the path forming member made of resin compared with a case of using iridium alone.
    • 在液体喷射头基板上,上部保护层以及与构成路径形成部件(诸如喷射口)的树脂层接触,在形成的通道内部的发热部分与油墨接触。 上保护层含有铱和硅。 上保护层被配置为使得在与油墨和树脂层接触的表面上,Ir100-xSix达到15at。 %<= X <= 30 at。 %硅含量率,并且随着上保护层中的位置更接近粘附层,X更多变为零。 结果,在上保护层与路径形成部件接触的界面处,通过​​获得迄今为止描述的含有率的硅,可以提高与树脂制成的路径形成部件的粘合性, 单独使用铱。