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1. 发明授权

US06620215B2 Abrasive composition containing organic particles for chemical mechanical planarization 失效
公开(公告)号：US06620215B2
公开(公告)日：2003-09-16
申请号：US10023827
申请日：2001-12-21
申请人： Yuzhuo Li , Guomin Bian , Kwok Tang , Joe Zunzi Zhao , John Westbrook , Yong Lin , Leina Chan
发明人： Yuzhuo Li , Guomin Bian , Kwok Tang , Joe Zunzi Zhao , John Westbrook , Yong Lin , Leina Chan
IPC分类号： C09K314
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1436 , C09K3/1463
摘要： The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.

2. 发明授权

US07419519B2 Engineered non-polymeric organic particles for chemical mechanical planarization 失效
标题翻译：用于化学机械平面化的工程非聚合有机颗粒
公开(公告)号：US07419519B2
公开(公告)日：2008-09-02
申请号：US11325450
申请日：2006-01-05
申请人： Yuzhuo Li , Kwok Tang , Wu Li , Guomin Bian , Krishnayya Cheemalapati , Vivek Duvvuru , Deenesh Bundi , Henry Bian
发明人： Yuzhuo Li , Kwok Tang , Wu Li , Guomin Bian , Krishnayya Cheemalapati , Vivek Duvvuru , Deenesh Bundi , Henry Bian
IPC分类号： B24D3/02 , C09C1/68 , C09K3/14
CPC分类号： C09K3/1409 , C09G1/02 , C09K3/1436 , C09K3/1463 , H01L21/3212
摘要： An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
摘要翻译：包含可用于化学机械平面化（CMP）的复合非聚合有机颗粒并且可广泛用于半导体工业的研磨组合物。复合颗粒分别含有至少一种非聚合物有机组分和至少一种不同于至少一种非聚合有机组分的其它化学组分。如果将一种或多种组分掺入磨料颗粒中，则浆料组合物可以大大简化。当用作CMP应用中的新磨料组合物时，磨料组合物提供了有效的抛光速率，优异的选择性和良好的表面质量。

3. 发明授权

US07037351B2 Non-polymeric organic particles for chemical mechanical planarization 失效
标题翻译：用于化学机械平面化的非聚合有机颗粒
公开(公告)号：US07037351B2
公开(公告)日：2006-05-02
申请号：US10734232
申请日：2003-12-15
申请人： Yuzhuo Li , Atanu Roy Chowdhury , Kwok Tang , Guomin Bian , Krishnayya Cheemalapati
发明人： Yuzhuo Li , Atanu Roy Chowdhury , Kwok Tang , Guomin Bian , Krishnayya Cheemalapati
IPC分类号： C09G1/02 , H01L21/321 , H01L21/306
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1409 , C09K3/1463
摘要： An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001–20 w/w % of non-polymeric organic particles, 0.1–10 w/w % of an oxidizing agent, 0.05–10 w/w % of a chelating agent, 0.01–10 w/w % of a surfactant, and 0–10 w/w % of a passivation agent at a pH in the range of 2–12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
摘要翻译：包含可用于化学机械平面化（CMP）的非聚合有机颗粒并且可广泛用于半导体工业中的磨料组合物。本发明的组合物优选包含与0.001-20w / w％的非聚合有机颗粒，0.1-10w / w％的氧化剂，0.05-10w / w％的螯合剂，0.01- 10w / w％的表面活性剂和0-10w / w％的钝化剂，其pH为2-12，其中所述百分比是w / w（重量/重量）百分比，基于总计所述组合物的重量。当用作CMP应用中的新磨料组合物时，磨料组合物提供了有效的抛光速率，优异的选择性和良好的表面质量。

4. 发明申请

US20060261306A1 Engineered non-polymeric organic particles for chemical mechanical planarization 失效
标题翻译：用于化学机械平面化的工程非聚合有机颗粒
公开(公告)号：US20060261306A1
公开(公告)日：2006-11-23
申请号：US11325450
申请日：2006-01-05
申请人： Yuzhuo Li , Kwok Tang , Wu Li , Guomin Bian , Krishnayya Cheemalapati , Vivek Duvvuru , Deenesh Bundi , Henry Bian
发明人： Yuzhuo Li , Kwok Tang , Wu Li , Guomin Bian , Krishnayya Cheemalapati , Vivek Duvvuru , Deenesh Bundi , Henry Bian
IPC分类号： C09K13/00 , H01L21/461 , C09K13/06
CPC分类号： C09K3/1409 , C09G1/02 , C09K3/1436 , C09K3/1463 , H01L21/3212
摘要： An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
摘要翻译：包含可用于化学机械平面化（CMP）的复合非聚合有机颗粒并且可广泛用于半导体工业的研磨组合物。复合颗粒分别含有至少一种非聚合物有机组分和至少一种不同于至少一种非聚合有机组分的其它化学组分。如果将一种或多种组分掺入磨料颗粒中，则浆料组合物可以大大简化。当用作CMP应用中的新磨料组合物时，磨料组合物提供了有效的抛光速率，优异的选择性和良好的表面质量。

5. 发明申请

US20050005525A1 Non-polymeric organic particles for chemical mechanical planarization 失效
标题翻译：用于化学机械平面化的非聚合有机颗粒
公开(公告)号：US20050005525A1
公开(公告)日：2005-01-13
申请号：US10734232
申请日：2003-12-15
申请人： Yuzhuo Li , Atanu Chowdhury , Kwok Tang , Guomin Bian , Krishnayya Cheemalapati
发明人： Yuzhuo Li , Atanu Chowdhury , Kwok Tang , Guomin Bian , Krishnayya Cheemalapati
IPC分类号： C09G1/02 , C09K3/14 , H01L21/306 , H01L21/321
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1409 , C09K3/1463
摘要： An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001-20 w/w % of non-polymeric organic particles, 0.1-10 w/w % of an oxidizing agent, 0.05-10 w/w % of a chelating agent, 0.01-10 w/w % of a surfactant, and 0-10 w/w % of a passivation agent at a pH in the range of 2-12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
摘要翻译：包含可用于化学机械平面化（CMP）的非聚合有机颗粒并且可广泛用于半导体工业中的磨料组合物。本发明的组合物优选包含与0.001-20w / w％的非聚合有机颗粒，0.1-10w / w％的氧化剂，0.05-10w / w％的螯合剂，0.01- 10w / w％的表面活性剂和0-10w / w％的钝化剂，其pH为2-12，其中所述百分比是w / w（重量/重量）百分比，基于总计所述组合物的重量。当用作CMP应用中的新磨料组合物时，磨料组合物提供了有效的抛光速率，优异的选择性和良好的表面质量。

6. 发明授权

US06245882B1 Method for the preparation of polymers 有权
标题翻译：制备聚合物的方法
公开(公告)号：US06245882B1
公开(公告)日：2001-06-12
申请号：US09388383
申请日：1999-09-01
申请人： Leena Matilainen , Guomin Bian , Claude Ostiguy , Rick Cheng , Matti Satuli , Kari Leskinen , Kwok Tang
发明人： Leena Matilainen , Guomin Bian , Claude Ostiguy , Rick Cheng , Matti Satuli , Kari Leskinen , Kwok Tang
IPC分类号： C08F614
CPC分类号： C08L61/06 , C08G8/10 , C08L2666/26 , C08L2666/04
摘要： Method for the manufacture of a phenolic resin emulsion and/or dispersion, wherein an aldehyde, a phenolic compound and an alkaline catalyst are allowed to react at a temperature of 40-100° C. until a desired degree of condensation is achieved, and the pH of the resin is adjusted to a value below 9 using an acid in the presence of a surface active agent or a mixture thereof at a temperature below 100° C. and a phenolic resin emulsion and/or dispersion is obtained providing a colorless or light-colored glue line or surface when cured.
摘要翻译：制备酚醛树脂乳液和/或分散体的方法，其中醛，酚类化合物和碱性催化剂在40-100℃的温度下反应，直到达到所需的冷凝程度，并且使用酸在表面活性剂或其混合物的存在下，在低于100℃的温度下将树脂的pH调节至低于9的值，得到酚醛树脂乳液和/或分散体，提供无色或浅色固化后的彩色胶线或表面。

7. 发明授权

US06528582B2 Method of preparing co-polymer particles 有权
公开(公告)号：US06528582B2
公开(公告)日：2003-03-04
申请号：US09821034
申请日：2001-03-30
申请人： Kwok Tang , Guomin Bian , Leena Matilainen , Sinikka Ingelin
发明人： Kwok Tang , Guomin Bian , Leena Matilainen , Sinikka Ingelin
IPC分类号： C08L6124
CPC分类号： C08G12/32 , C08G12/36 , C08G12/40 , C08J3/12 , C08J2361/20
摘要： A one-step, in-situ, process for producing a high solids content emulsion or dispersion of partially or totally crosslinked urea formaldehyde (UF), melamine formaldehyde (MF), or melamine urea formaldehyde (MUF) resin droplets or particles, by forming a reaction mixture of (i) aqueous formaldehyde (formalin), (ii) at least one water-soluble protective colloid, (iii) water and (iv) optionally a surfactant, and mixing the reaction mixture in a reaction vessel; optionally adjusting the initial pH of the reaction mixture according to a desired value as needed; adding (i) urea or substituted urea, (ii) melamine or substituted melamine, or (iii) a mixture thereof, to the reaction mixture; and heating the reaction mixture to a temperature at which condensation takes place between the (i) urea or substituted urea, (ii) the melamine or substituted melamine, or (iii) the mixture thereof, and the formaldehyde to form a urea formaldehyde, melamine formaldehyde or melamine urea formaldehyde resin, and holding the reaction mixture at that temperature or a higher temperature, under mixing, for a period of time sufficient to achieve a desired degree of crosslinking in said urea formaldehyde, melamine formaldehyde or melamine urea formaldehyde resin; and cooling the reaction mixture. The droplet or particle size of the resulting resin dispersion can be controlled and adjusted by way of the present technique to the application requirements.

8. 发明授权

US06245853B1 Method of preparing co-polymer particles 失效
标题翻译：制备共聚物颗粒的方法
公开(公告)号：US06245853B1
公开(公告)日：2001-06-12
申请号：US09571845
申请日：2000-05-16
申请人： Kwok Tang , Guomin Bian , Leena Matilainen , Sinikka Ingelin
发明人： Kwok Tang , Guomin Bian , Leena Matilainen , Sinikka Ingelin
IPC分类号： C08L6124
CPC分类号： C08J3/12 , C08G12/32 , C08G12/36 , C08G12/40 , C08J2361/20
摘要： A one-step, in-situ, process for producing a high solids content emulsion or dispersion of partially or totally crosslinked urea formaldehyde or melamine formaldehyde resin droplets or particles, by forming a reaction mixture of (i) aqueous formaldehyde (formalin), (ii) at least one water-soluble protective colloid, (iii) water and (iv) optionally a surfactant, and mixing the reaction mixture in a reaction vessel; optionally adjusting the initial pH of the reaction mixture according to a desired value as needed; adding (a) urea, substituted urea, or a mixture thereof, or (b) melamine, substituted melamine, or a mixture thereof, to the reaction mixture; and heating the reaction mixture to a temperature at which condensation takes place between the (a) urea, substituted urea, or the mixture thereof, or (b) melamine substituted melamine, or the mixture thereof, and the formaldehyde to form a urea formaldehyde or melamine formaldehyde resin, and holding the reaction mixture at that temperature or a higher temperature, under mixing, for a period of time sufficient to achieve a desired degree of crosslinking in said urea formaldehyde or melamine formaldehyde resin; and cooling the reaction mixture. The droplet or particle size of the resulting resin dispersion can be controlled and adjusted by way of the present technique to the application requirements.
摘要翻译：通过形成（i）甲醛水溶液（福尔马林）（（甲醛）），（甲醛）水溶液的反应混合物，生产高固体含量乳液或部分或全部交联的脲甲醛或三聚氰胺甲醛树脂液滴或颗粒的分散体的一步原位方法， ii）至少一种水溶性保护胶体，（iii）水和（iv）任选的表面活性剂，并将反应混合物混合在反应容器中; 任选地根据需要根据期望的值调节反应混合物的初始pH; 将（a）脲，取代的脲或其混合物，或（b）三聚氰胺，取代的三聚氰胺或其混合物加入到反应混合物中; 将反应混合物加热至（a）尿素，取代的脲或其混合物之间发生冷凝的温度，或（b）三聚氰胺取代的三聚氰胺或其混合物和甲醛形成脲甲醛或三聚氰胺甲醛树脂，并将该反应混合物在该温度或更高温度下混合，在足以在所述脲甲醛或三聚氰胺甲醛树脂中达到所需程度的交联的时间; 并冷却反应混合物。所得到的树脂分散体的液滴或颗粒尺寸可以通过本技术对应用要求进行控制和调节。

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