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1. 发明申请

US20130068434A1 HEAT EXCHANGER AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：热交换器及其制造方法
公开(公告)号：US20130068434A1
公开(公告)日：2013-03-21
申请号：US13699971
申请日：2010-05-28
申请人： Yuya Takano , Yasuji Taketsuna , Eisaku Kakiuchi , Katsuhiko Tatebe , Masahiro Morino , Tomohiro Takenaga
发明人： Yuya Takano , Yasuji Taketsuna , Eisaku Kakiuchi , Katsuhiko Tatebe , Masahiro Morino , Tomohiro Takenaga
IPC分类号： F28F3/00
CPC分类号： F28F3/005 , F28F3/025 , F28F3/027 , F28F3/12 , F28F2265/32 , F28F2280/04 , H01L23/473 , H01L2924/0002 , Y10T29/494 , H01L2924/00
摘要： In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions ormed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.
摘要翻译：在热交换器中，翅片被简单且精确地定位在适当的位置，并且有效地交换热量而不增加制造成本，并且多个波纹状板状翅片沿壳体中的冷却剂的流动方向设置。热交换器具有：连接部件，其连接翅片之间的相邻翅片; 连接部件上的突起; 以及用于定位形成在壳体中的翅片的定位孔。相邻的翅片沿着冷却剂流动方向以预定的间隔设置，并且通过将突起装配在定位孔中而沿与冷却剂流动方向正交的方向上具有预定的偏移量。

2. 发明授权

US08944147B2 Heat exchanger and method for manufacturing same 有权
标题翻译：热交换器及其制造方法
公开(公告)号：US08944147B2
公开(公告)日：2015-02-03
申请号：US13699971
申请日：2010-05-28
申请人： Yuya Takano , Yasuji Taketsuna , Eisaku Kakiuchi , Katsuhiko Tatebe , Masahiro Morino , Tomohiro Takenaga
发明人： Yuya Takano , Yasuji Taketsuna , Eisaku Kakiuchi , Katsuhiko Tatebe , Masahiro Morino , Tomohiro Takenaga
IPC分类号： F28F3/02 , F28F3/12 , H01L23/473
CPC分类号： F28F3/005 , F28F3/025 , F28F3/027 , F28F3/12 , F28F2265/32 , F28F2280/04 , H01L23/473 , H01L2924/0002 , Y10T29/494 , H01L2924/00
摘要： In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions formed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.
摘要翻译：在热交换器中，翅片被简单且精确地定位在适当的位置，并且有效地交换热量而不增加制造成本，并且多个波纹状板状翅片沿壳体中的冷却剂的流动方向设置。热交换器具有：连接部件，其连接翅片之间的相邻翅片; 在连接部分上形成的突起; 以及用于定位形成在壳体中的翅片的定位孔。相邻的翅片沿着冷却剂流动方向以预定的间隔设置，并且通过将突起装配在定位孔中而沿与冷却剂流动方向正交的方向上具有预定的偏移量。

3. 发明授权

US08860210B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08860210B2
公开(公告)日：2014-10-14
申请号：US13258860
申请日：2009-06-10
申请人： Eisaku Kakiuchi , Yasuji Taketsuna , Masahiro Morino , Yuya Takano
发明人： Eisaku Kakiuchi , Yasuji Taketsuna , Masahiro Morino , Yuya Takano
IPC分类号： H01L23/34 , H01L23/473 , H01L23/13 , H01L23/367 , H01L25/07 , H01L23/373 , H01L23/433
CPC分类号： H01L23/473 , H01L23/13 , H01L23/3677 , H01L23/3735 , H01L23/433 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.
摘要翻译：公开了一种能够适当地缓和由绝缘基板和冷却器之间的线膨胀系数差产生的应力的半导体装置，能够通过半导体元件的冷却来适当地除去热量。半导体器件包括绝缘衬底，设置在绝缘衬底上的半导体元件，冷却器和设置在绝缘衬底和冷却器之间的多孔金属板。多孔金属板中的通孔至少打开面向冷却器的多孔金属板的表面。孔的截面尺寸从冷却器侧朝向绝缘基板侧逐渐减小。

4. 发明申请

US20120012996A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120012996A1
公开(公告)日：2012-01-19
申请号：US13258860
申请日：2009-06-10
申请人： Eisaku Kakiuchi , Yasuji Taketsuna , Masahiro Morino , Yuya Takano
发明人： Eisaku Kakiuchi , Yasuji Taketsuna , Masahiro Morino , Yuya Takano
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/13 , H01L23/3677 , H01L23/3735 , H01L23/433 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.
摘要翻译：公开了一种能够适当地缓和由绝缘基板和冷却器之间的线膨胀系数差产生的应力的半导体装置，能够通过半导体元件的冷却来适当地除去热量。半导体器件包括绝缘衬底，设置在绝缘衬底上的半导体元件，冷却器和设置在绝缘衬底和冷却器之间的多孔金属板。多孔金属板中的通孔至少打开面向冷却器的多孔金属板的表面。孔的截面尺寸从冷却器侧朝向绝缘基板侧逐渐减小。

5. 发明授权

US08365409B2 Heat exchanger and method of manufacturing the same 失效
标题翻译：换热器及其制造方法
公开(公告)号：US08365409B2
公开(公告)日：2013-02-05
申请号：US13258602
申请日：2009-05-22
申请人： Eisaku Kakiuchi , Yasuji Taketsuna , Masahiro Morino , Yuya Takano
发明人： Eisaku Kakiuchi , Yasuji Taketsuna , Masahiro Morino , Yuya Takano
IPC分类号： B21D11/10 , B21D13/02
CPC分类号： H01L23/473 , B23P15/26 , B23P2700/10 , F28F3/046 , F28F3/048 , F28F3/12 , F28F13/06 , F28F2215/10 , H01L21/4878 , H01L2924/0002 , Y10T29/4935 , Y10T29/49391 , H01L2924/00
摘要： A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.
摘要翻译：热交换器设置有包括多个翅片部分的冷却翅片和支撑翅片部分的基部，以及压配合到翅片部分中的多个销。在热交换器中，各自具有比预先形成为平行的直线形状的翅片部分之间的每个空间宽的销的销在从每个翅片部分的顶端朝向基部的方向上压配合到空间中。因此，通过塑性变形，翅片部分形成为波纹形状，从而将销钉固定在翅片部分之间与基部分开的位置。在每个空间中，销在每个空间的纵向方向上间隔布置。布置在相邻空间中的销以交替模式放置。

6. 发明申请

US20120012295A1 HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：热交换器及其制造方法
公开(公告)号：US20120012295A1
公开(公告)日：2012-01-19
申请号：US13258602
申请日：2009-05-22
申请人： Eisaku Kakiuchi , Yasuji Taketsuna , Masahiro Morino , Yuya Takano
发明人： Eisaku Kakiuchi , Yasuji Taketsuna , Masahiro Morino , Yuya Takano
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： H01L23/473 , B23P15/26 , B23P2700/10 , F28F3/046 , F28F3/048 , F28F3/12 , F28F13/06 , F28F2215/10 , H01L21/4878 , H01L2924/0002 , Y10T29/4935 , Y10T29/49391 , H01L2924/00
摘要： A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger, the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space, the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.
摘要翻译：热交换器设置有包括多个翅片部分的冷却翅片和支撑翅片部分的基部，以及压配合到翅片部分中的多个销。在热交换器中，各自具有比预先形成为平行的直线形状的翅片部之间的每个空间宽的宽度的销在从每个翅片部分的顶端朝向基部的方向上压配合到空间中。因此，通过塑性变形，翅片部分形成为波纹形状，从而将销钉固定在翅片部分之间与基部分开的位置。在每个空间中，销在每个空间的纵向方向上间隔布置。布置在相邻空间中的销以交替模式放置。

7. 发明授权

US08593812B2 Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device 失效
标题翻译：热交换器，半导体装置，热交换器的制造方法以及半导体装置的制造方法
公开(公告)号：US08593812B2
公开(公告)日：2013-11-26
申请号：US13259370
申请日：2009-05-11
申请人： Masahiro Morino , Yasuji Taketsuna , Eisaku Kakiuchi , Yuya Takano
发明人： Masahiro Morino , Yasuji Taketsuna , Eisaku Kakiuchi , Yuya Takano
IPC分类号： H01L23/34 , H05K7/20
CPC分类号： H01L23/473 , H01L21/4882 , H01L2924/0002 , H05K7/20509 , H05K7/20918 , Y10T29/4935 , Y10T29/49375 , Y10T29/49384 , Y10T29/49393 , H01L2924/00
摘要： Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame. The first frame member is provided with elastically deformable projections (elastically deformable portions) along an arrangement surface of the outer surface on which the insulating plates (intervening members) are arranged.
摘要翻译：公开了一种热交换器，其中当具有不同线性膨胀系数的框架构件的中间构件和壁部彼此焊接时，抑制了中间构件和框架的翘曲（弯曲）。制造热交换器的方法，其中抑制了中间构件和框架的翘曲（弯曲）的半导体装置以及半导体装置的制造方法。具体公开了一种热交换器，其中在形成外壳的框架内布置有形成有用于制冷剂的流动通道的多个翅片的翅片构件。框架具有第一框架部件（第一壁部分），绝缘板（介入部件）介于框架和发热体之间（半导体元件被焊接），绝缘板（介入部件）的线膨胀系数不同于第一框架构件沿着布置有绝缘板（中间构件）的外表面的布置表面设置有可弹性变形的突起（可弹性变形的部分）。

8. 发明申请

US20120006523A1 HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：热交换器及其制造方法
公开(公告)号：US20120006523A1
公开(公告)日：2012-01-12
申请号：US13258204
申请日：2009-05-19
申请人： Morino Masahiro , Yasuji Taketsuna , Eisaku Kakiuchi , Yuya Takano , Yoshinori Shibata
发明人： Morino Masahiro , Yasuji Taketsuna , Eisaku Kakiuchi , Yuya Takano , Yoshinori Shibata
IPC分类号： F28F7/00 , B23K1/00 , B23K37/00 , B23K31/02
CPC分类号： H01L23/473 , B21C23/14 , B21C37/225 , F28F3/02 , F28F3/12 , F28F2255/16 , H01L21/4878 , H01L2924/0002 , H05K7/20918 , H01L2924/00
摘要： A heat exchanger having a fin member which can be easily formed by extrusion molding and warps (bends) less and configured such that an occurrence of voids at a weld portion between the fin member and a frame is suppressed. A method of manufacturing the heat exchanger is also provided. A heat exchanger has, mounted inside a frame forming an outer frame, a fin member having fins for forming flow channels for a refrigerant. The fin member is an integrally formed fin member formed by extrusion molding and is provided with a base formed in a rectangular flat plate-like shape, front side fins projecting from the front side of the base, and back side fins projecting from the back side of the base. In the fin member, the front side and the back side are not welded to the frame but the front ends of at least either the front side fins or the back side fins are welded to the frame.
摘要翻译：一种具有翅片构件的热交换器，其能够通过挤出成型容易地形成并且经纱（弯曲）较少并且构造成使得在翅片构件和框架之间的焊接部分处发生空隙被抑制。还提供了制造热交换器的方法。热交换器安装在形成外框架的框架内，具有用于形成用于制冷剂的流动通道的翅片的翅片构件。翅片构件是通过挤出成型形成的一体形成的翅片构件，并且设置有形成为矩形的平板状的基部，从基座的前侧突出的前侧翼片和从后侧突出的后侧翼片的基地。在翅片构件中，前侧和后侧没有焊接到框架，而是将前侧翼片或后侧翼片中的至少一个的前端焊接到框架。

9. 发明申请

US20100276135A1 COOLING FIN AND MANUFACTURING METHOD OF THE COOLING FIN 审中-公开
标题翻译：冷却FIN的冷却和制造方法
公开(公告)号：US20100276135A1
公开(公告)日：2010-11-04
申请号：US12747777
申请日：2008-11-28
申请人： Masahiro Morino , Yasuji Taketsuna , Yuya Takano , Hirofumi Inoshita
发明人： Masahiro Morino , Yasuji Taketsuna , Yuya Takano , Hirofumi Inoshita
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： H01L23/3672 , B23P15/26 , B23P2700/10 , H01L21/4871 , H01L21/4878 , H01L23/467 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A cooling fin includes fin parts integrally extending from a base part. Each fin part is partially formed at a slant so that a proximal end portion is straight and a distal end portion is wavy (corrugated). Each fin part is partially slanted to make each fin part wavier as coming closer to the distal end portion from the proximal end portion. In a manufacturing process of the cooling fin, firstly, a straight cooling fin is produced by extrusion molding (an extruding step). Subsequently, the distal end portion of each fin is partially bent in a direction intersecting an extruding direction into a wave shape (a bending step).
摘要翻译：冷却翅片包括从基部一体地延伸的翅片部件。每个翅片部分以倾斜部分地形成，使得近端部分是直的，并且远端部分是波浪形（波纹状）。每个翅片部分部分地倾斜以使得每个翼片部分从近端部分越靠近远端部分变得越来越小。在冷却翅片的制造过程中，首先，通过挤出成型（挤出工序）制造直冷却翅片。随后，每个翅片的远端部分在与挤出方向交叉的方向上部分弯曲成波形（弯曲步骤）。

10. 发明申请

US20120014066A1 HEAT EXCHANGER, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE HEAT EXCHANGER, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE 失效
标题翻译：热交换器，半导体器件，制造热交换器的方法和制造半导体器件的方法
公开(公告)号：US20120014066A1
公开(公告)日：2012-01-19
申请号：US13259370
申请日：2009-05-11
申请人： Masahiro Morino , Yasuji Takesuna , Eisaku Kakiuchi , Yuya Takano
发明人： Masahiro Morino , Yasuji Takesuna , Eisaku Kakiuchi , Yuya Takano
IPC分类号： H01L23/34 , B21D53/02 , H01L21/50 , F28F7/00
CPC分类号： H01L23/473 , H01L21/4882 , H01L2924/0002 , H05K7/20509 , H05K7/20918 , Y10T29/4935 , Y10T29/49375 , Y10T29/49384 , Y10T29/49393 , H01L2924/00
摘要： Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements) are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame. The first frame member is provided with elastically deformable projections (elastically deformable portions) along an arrangement surface of the outer surface on which the insulating plates (intervening members) are arranged.
摘要翻译：公开了一种热交换器，其中当具有不同线性膨胀系数的框架构件的中间构件和壁部彼此焊接时，抑制了中间构件和框架的翘曲（弯曲）。制造热交换器的方法，其中抑制了中间构件和框架的翘曲（弯曲）的半导体装置以及半导体装置的制造方法。具体公开了一种热交换器，其中在形成外壳的框架内布置有形成有用于制冷剂的流动通道的多个翅片的翅片构件。框架具有第一框架构件（第一壁部分），其间插入在框架和发热体（半导体元件）之间的绝缘板（中间构件）。绝缘板（中间构件）具有与框架不同的线膨胀系数。第一框架构件沿着布置有绝缘板（中间构件）的外表面的布置表面设置有可弹性变形的突起（可弹性变形的部分）。

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