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1. 发明申请

US20080251288A1 MULTILAYER HIGH-FREQUENCY CIRCUIT BOARD 有权
标题翻译：多层高频电路板
公开(公告)号：US20080251288A1
公开(公告)日：2008-10-16
申请号：US12099875
申请日：2008-04-09
申请人： Yuusuke YAMASHITA , Ryota Suzuki , Masahiro Tanabe , Taihei Nakada , Tsuyoshi Kumamoto
发明人： Yuusuke YAMASHITA , Ryota Suzuki , Masahiro Tanabe , Taihei Nakada , Tsuyoshi Kumamoto
IPC分类号： H01R12/04
CPC分类号： H05K1/0251 , H05K1/0222 , H05K1/116 , H05K3/429 , H05K2201/09454 , H05K2201/09618 , H05K2201/09718 , H05K2201/09809
摘要： A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer circuit is provided in the signal line layer and includes a ground connecting portion connected to the ground layers and a signal line connecting portion connected to the signal line. One of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other of the signal line connecting portion and the ground connecting portion concentrically with the one being separated from the outer periphery of the other along the signal line layer. An inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.
摘要翻译：多层高频电路板包括信号线，接地层和层间电路。在信号线层中形成高频信号流动的信号线。接地层层叠在信号线层的两侧，每一个都接地。层间电路设置在信号线层中，并且包括连接到接地层的接地连接部分和连接到信号线的信号线连接部分。信号线连接部分和接地连接部分之一围绕信号线连接部分和接地连接部分的另一个的外周围同步地沿着信号线层与另一个的外周分离。另一个的一个和外周的内周具有除完整圆之外的类似形状。

2. 发明授权

US08164005B2 Multilayer high-frequency circuit board 有权
标题翻译：多层高频电路板
公开(公告)号：US08164005B2
公开(公告)日：2012-04-24
申请号：US12099875
申请日：2008-04-09
申请人： Yuusuke Yamashita , Ryota Suzuki , Masahiro Tanabe , Taihei Nakada , Tsuyoshi Kumamoto
发明人： Yuusuke Yamashita , Ryota Suzuki , Masahiro Tanabe , Taihei Nakada , Tsuyoshi Kumamoto
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K1/0222 , H05K1/116 , H05K3/429 , H05K2201/09454 , H05K2201/09618 , H05K2201/09718 , H05K2201/09809
摘要： A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer circuit is provided in the signal line layer and includes a ground connecting portion connected to the ground layers and a signal line connecting portion connected to the signal line. One of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other of the signal line connecting portion and the ground connecting portion concentrically with the one being separated from the outer periphery of the other along the signal line layer. An inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.
摘要翻译：多层高频电路板包括信号线，接地层和层间电路。在信号线层中形成高频信号流动的信号线。接地层层叠在信号线层的两侧，每一个都接地。层间电路设置在信号线层中，并且包括连接到接地层的接地连接部分和连接到信号线的信号线连接部分。信号线连接部分和接地连接部分之一围绕信号线连接部分和接地连接部分的另一个的外周围同步地沿着信号线层与另一个的外周分离。另一个的一个和外周的内周具有除完整圆之外的类似形状。

3. 发明申请

US20050275078A1 High frequency multilayer integrated circuit 有权
标题翻译：高频多层集成电路
公开(公告)号：US20050275078A1
公开(公告)日：2005-12-15
申请号：US11147332
申请日：2005-06-08
申请人： Ryota Suzuki , Taihei Nakada , Tsuyoshi Kumamoto , Yuusuke Yamashita
发明人： Ryota Suzuki , Taihei Nakada , Tsuyoshi Kumamoto , Yuusuke Yamashita
IPC分类号： H01L23/12 , H01L23/02 , H01L23/50 , H01L23/552 , H01L23/66 , H05K1/00 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/46
CPC分类号： H01L23/50 , H01L23/552 , H01L2924/0002 , H01L2924/15153 , H01L2924/1517 , H05K1/0218 , H05K1/0243 , H05K1/0298 , H05K1/113 , H05K1/115 , H05K1/182 , H05K2201/0715 , H05K2201/0723 , H05K2201/09336 , H05K2201/10545 , H01L2924/00
摘要： A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circuit disposed in one of the most outside earth conductor layers of the multilayer board; a first power-supply/control circuit disposed in this most outside earth conductor layer; a second high frequency circuit disposed in at least one of the dielectric layers and connected to the first high frequency circuit in the multilayer board; a second power-supply/control circuit disposed in another one of the most outside earth conductor layers of the multilayer board; and a third power-supply/control circuit disposed in at least one of the dielectric layers at a portion at which the second high frequency circuit does not exist, the third power-supply/control circuit being connected to the first and second power-supply/control circuits.
摘要翻译：高频多层集成电路具备：分别配置在相邻的接地导体层之间的n个接地导体层（n为2以上的整数）和（n-1）个电介质层的多层基板; 设置在所述多层板的最外侧的接地导体层之一中的第一高频电路; 设置在该最外部接地导体层中的第一电源/控制电路; 设置在所述电介质层中的至少一个并连接到所述多层板中的所述第一高频电路的第二高频电路; 第二电源/控制电路，设置在所述多层板的最外部的接地导体层中的另一个中; 以及第三电源/控制电路，设置在所述第二高频电路不存在的部分的所述电介质层中的至少一个中，所述第三电源/控制电路连接到所述第一和第二电源 /控制电路。

4. 发明授权

US07355863B2 High frequency multilayer integrated circuit 有权
标题翻译：高频多层集成电路
公开(公告)号：US07355863B2
公开(公告)日：2008-04-08
申请号：US11147332
申请日：2005-06-08
申请人： Ryota Suzuki , Taihei Nakada , Tsuyoshi Kumamoto , Yuusuke Yamashita
发明人： Ryota Suzuki , Taihei Nakada , Tsuyoshi Kumamoto , Yuusuke Yamashita
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H01L23/50 , H01L23/552 , H01L2924/0002 , H01L2924/15153 , H01L2924/1517 , H05K1/0218 , H05K1/0243 , H05K1/0298 , H05K1/113 , H05K1/115 , H05K1/182 , H05K2201/0715 , H05K2201/0723 , H05K2201/09336 , H05K2201/10545 , H01L2924/00
摘要： A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circuit disposed in one of the most outside earth conductor layers of the multilayer board; a first power-supply/control circuit disposed in this most outside earth conductor layer; a second high frequency circuit disposed in at least one of the dielectric layers and connected to the first high frequency circuit in the multilayer board; a second power-supply/control circuit disposed in another one of the most outside earth conductor layers of the multilayer board; and a third power-supply/control circuit disposed in at least one of the dielectric layers at a portion at which the second high frequency circuit does not exist, the third power-supply/control circuit being connected to the first and second power-supply/control circuits.
摘要翻译：高频多层集成电路具备：分别配置在相邻的接地导体层之间的n个接地导体层（n为2以上的整数）和（n-1）个电介质层的多层基板; 设置在所述多层板的最外侧的接地导体层之一中的第一高频电路; 设置在该最外部接地导体层中的第一电源/控制电路; 设置在所述电介质层中的至少一个并连接到所述多层板中的所述第一高频电路的第二高频电路; 第二电源/控制电路，设置在所述多层板的最外部的接地导体层中的另一个中; 以及第三电源/控制电路，设置在所述第二高频电路不存在的部分的所述电介质层中的至少一个中，所述第三电源/控制电路连接到所述第一和第二电源 /控制电路。

5. 发明申请

US20100090897A1 RADAR APPARATUS AND METHOD FOR FORMING RECEPTION BEAM OF THE SAME 有权
标题翻译：雷达装置和形成其接收光束的方法
公开(公告)号：US20100090897A1
公开(公告)日：2010-04-15
申请号：US12471027
申请日：2009-05-22
申请人： Taihei Nakada , Junichiro Suzuki , Yoshiaki Satake
发明人： Taihei Nakada , Junichiro Suzuki , Yoshiaki Satake
IPC分类号： H01Q3/00
CPC分类号： G01S7/2813 , G01S3/74 , G01S2013/0254 , H01Q1/288 , H01Q3/26 , H01Q3/30 , H01Q21/0025
摘要： When an excitation signal is generated from an exciter due to an activation signal generated from a radar control device and is distributed to supply to each antenna sub-module, a combination reception signal is transmitted to a receiver from each antenna sub-module. The receiver takes in the combination reception signal obtained by each sub-module in response to an instruction from the radar control device, a frequency converter converts the combination reception signal into a prescribed frequency band, and a distributed aperture combination circuit performs a beam combination in accordance with a distributed aperture combination algorithm. In this way, a radar apparatus, which is equivalent to an active phased array radar of a large aperture and with high performance, is achieved.
摘要翻译：当由于从雷达控制装置产生的激活信号从激励器产生激励信号并被分配供应到每个天线子模块时，组合接收信号从每个天线子模块发送到接收机。接收机响应于来自雷达控制装置的指示，接收由每个子模块获得的组合接收信号，频率转换器将组合接收信号转换成规定频带，并且分布式孔径组合电路执行波束组合根据分布式孔径组合算法。以这种方式，实现了相当于大孔径并具有高性能的有源相控阵雷达的雷达装置。

6. 发明授权

US5876789A Method and apparatus for manufacturing radio frequency board with curved surface 失效
标题翻译：用于制造具有曲面的射频板的方法和装置
公开(公告)号：US5876789A
公开(公告)日：1999-03-02
申请号：US747930
申请日：1996-11-12
申请人： Taihei Nakada
发明人： Taihei Nakada
IPC分类号： B29C69/00 , B29C45/14 , H01Q3/26 , H01Q15/14 , H05K3/00 , H05K3/02 , H05K3/40 , H05K3/46 , B05D5/12 , B28B7/22
CPC分类号： B29C45/14778 , H01Q15/141 , H05K3/0014 , H05K3/4046 , B29C2045/14237 , B29L2031/3456 , H05K2201/09018 , H05K2201/09118 , H05K2201/10416 , H05K2203/0228 , H05K3/0044 , H05K3/025 , H05K3/4644 , H05K3/4647
摘要： In a first step, a conductive layer a1 is formed on a three-dimensionally curved upper surface of a main mold. In a second step, a peripheral surface mold is attached to the outer peripheral surface of the main mold, and a liquid dielectric of an age hardening type is cast onto the conductor layer, and hardened. In a third step, the peripheral surface mold is detached from the main mold, and an unnecessary portion of the hardened dielectric is cut to thereby form a dielectric layer. In a fourth step, another conductor layer is formed on the dielectric layer. A method comprising these steps enables a dielectric board with a voluntary three-dimensionally curved surface to be manufactured with high accuracy.
摘要翻译：在第一步骤中，在主模具的三维弯曲的上表面上形成导电层a1。在第二步骤中，将外周表面模具附接到主模具的外周表面，并将时效硬化型液体电介质浇铸到导体层上并硬化。在第三步骤中，将外周表面模具与主模具分离，并且切割硬化电介质的不需要部分从而形成电介质层。在第四步骤中，在电介质层上形成另一导体层。包括这些步骤的方法使得能够以高精度制造具有自愿的三维曲面的电介质板。

7. 发明授权

US08509335B2 Array antenna apparatus and micro wave transceiver module 有权
标题翻译：阵列天线装置和微波收发模块
公开(公告)号：US08509335B2
公开(公告)日：2013-08-13
申请号：US12720157
申请日：2010-03-09
申请人： Taihei Nakada , Junichiro Suzuki , Yoshiaki Satake , Madoka Uwamichi
发明人： Taihei Nakada , Junichiro Suzuki , Yoshiaki Satake , Hiroyuki Uwamichi
IPC分类号： H04B7/02
CPC分类号： H01Q21/0025 , G01S7/03 , G01S13/4463 , H01Q23/00
摘要： In a transceiver module, a micro wave analog signal interface is provided between the transceiver module and an antenna element, and all the signal interfaces except a power supply are digital signal interfaces, and the interfaces are configured as one chip on a semiconductor. An internal reference signal generates a local signal serving as a reference by multiplying a high frequency digital clock signal supplied from the outside, and simultaneously generates a reference signal capable of synchronous operation by a lower frequency digital clock signal supplied from the outside, in the clock generator. The frequency of the generated reference local signal can be varied by controlling the inner multiplication number or the frequency of the higher frequency digital clock signal supplied from the outside. In addition, both transmission and reception can be executed with an arbitrary frequency by varying the frequency of the transmission waveform generator.
摘要翻译：在收发模块中，在收发模块和天线元件之间提供微波模拟信号接口，除电源外的所有信号接口均为数字信号接口，并将接口配置为半导体上的一个芯片。内部参考信号通过乘以从外部提供的高频数字时钟信号产生作为参考的本地信号，并且同时产生能够通过从外部提供的较低频数字时钟信号在时钟中同步操作的参考信号发电机。可以通过控制从外部提供的较高频数字时钟信号的内乘数或频率来改变所产生的参考本地信号的频率。此外，通过改变发送波形发生器的频率，可以以任意频率执行发送和接收。

8. 发明授权

US08068052B2 Radar apparatus and method for forming reception beam of the same 有权
标题翻译：雷达装置及其形成方法
公开(公告)号：US08068052B2
公开(公告)日：2011-11-29
申请号：US12471027
申请日：2009-05-22
申请人： Taihei Nakada , Junichiro Suzuki , Yoshiaki Satake
发明人： Taihei Nakada , Junichiro Suzuki , Yoshiaki Satake
IPC分类号： G01S13/00 , G01S13/74 , G01S13/08 , H01Q1/28
CPC分类号： G01S7/2813 , G01S3/74 , G01S2013/0254 , H01Q1/288 , H01Q3/26 , H01Q3/30 , H01Q21/0025
摘要： When an excitation signal is generated from an exciter due to an activation signal generated from a radar control device and is distributed to supply to each antenna sub-module, a combination reception signal is transmitted to a receiver from each antenna sub-module. The receiver takes in the combination reception signal obtained by each sub-module in response to an instruction from the radar control device, a frequency converter converts the combination reception signal into a prescribed frequency band, and a distributed aperture combination circuit performs a beam combination in accordance with a distributed aperture combination algorithm. In this way, a radar apparatus, which is equivalent to an active phased array radar of a large aperture and with high performance, is achieved.
摘要翻译：当由于从雷达控制装置产生的激活信号从激励器产生激励信号并被分配供应到每个天线子模块时，组合接收信号从每个天线子模块发送到接收机。接收机响应于来自雷达控制装置的指示，接收由每个子模块获得的组合接收信号，频率转换器将组合接收信号转换成规定频带，并且分布式孔径组合电路执行波束组合根据分布式孔径组合算法。以这种方式，实现了相当于大孔径并具有高性能的有源相控阵雷达的雷达装置。

9. 发明授权

US09041182B2 Semiconductor package and method of manufacturing the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US09041182B2
公开(公告)日：2015-05-26
申请号：US13688823
申请日：2012-11-29
申请人： Toshihiko Nagano , Kazuhide Abe , Hiroshi Yamada , Kazuhiko Itaya , Taihei Nakada
发明人： Toshihiko Nagano , Kazuhide Abe , Hiroshi Yamada , Kazuhiko Itaya , Taihei Nakada
IPC分类号： H01L23/48 , H01L21/78 , H01L23/055 , H01L23/10 , H01L23/00 , H01L23/66
CPC分类号： H01L23/48 , H01L21/78 , H01L23/055 , H01L23/10 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/97 , H01L2224/0401 , H01L2224/05568 , H01L2224/05644 , H01L2224/0603 , H01L2224/06181 , H01L2224/12105 , H01L2224/13007 , H01L2224/13111 , H01L2224/1329 , H01L2224/133 , H01L2224/14181 , H01L2224/16235 , H01L2224/73253 , H01L2224/81191 , H01L2224/81192 , H01L2224/81205 , H01L2224/814 , H01L2224/81411 , H01L2224/81444 , H01L2224/81447 , H01L2224/81805 , H01L2224/81815 , H01L2224/81895 , H01L2224/81986 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/1461 , H01L2924/1515 , H01L2924/15788 , H01L2924/16153 , H01L2224/81 , H01L2924/01079 , H01L2924/01014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00 , H01L2224/05552
摘要： A semiconductor package according to embodiments includes: a semiconductor chip including a front electrode on a front surface thereof and a back electrode on a back surface thereof; a front-side cap portion including an air gap in a portion between the semiconductor chip and the front-side cap portion and a front-side penetrating electrode, and is positioned to face the front surface of the semiconductor chip; a back-side cap portion bonded with a first cap portion to hermetically seal the semiconductor chip, includes an air gap at least in a portion between the semiconductor chip and the back-side cap portion and a back-side penetrating electrode, and is positioned to face the back surface of the semiconductor chip; a front-side connecting portion which electrically connects the front electrode and the front-side penetrating electrode; and a back-side connecting portion which electrically connects the back electrode and the back-side penetrating electrode.
摘要翻译：根据实施例的半导体封装包括：半导体芯片，其前表面包括前电极，背面具有背电极; 在半导体芯片和前侧盖部分之间的部分中包括气隙的前侧盖部分和前侧穿透电极，并且被定位成面向半导体芯片的前表面; 与第一帽部接合以密封半导体芯片的背面盖部分至少在半导体芯片和背面侧帽部分之间的部分和背面贯通电极之间包括气隙，并且位于面对半导体芯片的背面; 电连接前电极和前侧穿透电极的前侧连接部; 以及将背面电极和背面贯通电极电连接的背面侧连接部。

10. 发明申请

US20120228755A1 SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体模块及其制造方法
公开(公告)号：US20120228755A1
公开(公告)日：2012-09-13
申请号：US13235386
申请日：2011-09-18
申请人： Toshihiko NAGANO , Hiroshi Yamada , Kazuhide Abe , Kazuhiko Itaya , Taihei Nakada
发明人： Toshihiko NAGANO , Hiroshi Yamada , Kazuhide Abe , Kazuhiko Itaya , Taihei Nakada
IPC分类号： H01L23/053 , H01L21/56
CPC分类号： H01L23/04 , H01L23/13 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01074 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/1461 , H01L2924/15788 , H01L2924/00
摘要： A semiconductor module includes a high frequency chip, an insulating cap, a through electrode, interconnections, and an insulating layer. The insulating cap forms a hollow with the chip to cover the chip. The through electrode passes through a first plane of the cap and a second plane of the cap, the first plane facing the chip, the second plane being on a side opposite to the first plane. The interconnections are provided on the cap and connected to the through electrode. The insulating layer is provided on the cap and fills a portion between the interconnections therewith.
摘要翻译：半导体模块包括高频芯片，绝缘帽，通孔，互连和绝缘层。绝缘盖形成具有芯片的中空以覆盖芯片。所述贯通电极通过所述盖的第一平面和所述盖的第二平面，所述第一平面面向所述芯片，所述第二平面位于与所述第一平面相对的一侧。互连设置在盖上并连接到通孔。绝缘层设置在盖上并填充与其互连之间的部分。

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