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    • 1. 发明授权
    • Analog signal detecting circuit, and AC side current detector of semiconductor power conversion device
    • 模拟信号检测电路和半导体功率转换装置的交流侧电流检测器
    • US06181587B2
    • 2001-01-30
    • US09572911
    • 2000-05-17
    • Yuuji KuramotoHirotoshi MaekawaKiyoharu Anzai
    • Yuuji KuramotoHirotoshi MaekawaKiyoharu Anzai
    • H02M7979
    • G01R19/2513G01R31/42H02M7/53875H02M2001/0009
    • Conventionally, there is a problem that it is impossible to provide an analog signal detecting circuit having high reliability and long lifetime under a bad environment since a photocoupler is used for electrical insulation of a digital signal. Then, an analog signal detecting circuit is provided with a carrier wave generating unit for generating a carrier wave, a pulse width modulating unit for pulse width modulating an analog signal inputted from the signal input terminal by using the carrier wave generated by the carrier wave generating unit and for outputting a digital signal, a reverse level shift HVIC for transmitting the digital signal from one power supply system to the other power supply system, and a demodulation unit for demodulating the digital signal transmitted to the other power supply system into an analog signal and for outputting it to a signal output terminal. As a result, even in the case where reference potentials are different from each other at signal input/output terminals, an analog signal can be detected.
    • 通常,由于光电耦合器用于数字信号的电绝缘,所以存在不能在不良环境下提供具有高可靠性和长寿命的模拟信号检测电路的问题。 然后,模拟信号检测电路设置有用于产生载波的载波产生单元,用于通过使用由载波生成产生的载波对从信号输入端输入的模拟信号进行脉宽调制的脉冲宽度调制单元 单元并用于输出数字信号;反相电平移位HVIC,用于将数字信号从一个电源系统发送到另一个电源系统;以及解调单元,用于将发送到另一个电源系统的数字信号解调为模拟信号 并将其输出到信号输出端子。 结果,即使在信号输入/输出端子处参考电位彼此不同的情况下,也可以检测模拟信号。
    • 4. 发明授权
    • Capacitor module and semiconductor device using the same
    • US06791819B2
    • 2004-09-14
    • US10114035
    • 2002-04-03
    • Tohru KimuraDai NakajimaYuuji Kuramoto
    • Tohru KimuraDai NakajimaYuuji Kuramoto
    • H01G4228
    • A capacitor module incorporating a ceramic capacitor having terminal members for reducing stress caused by thermal stress or electrostriction in the ceramic capacitor itself, and a semiconductor device using the capacitor module. The capacitor module and the semiconductor device are designed to have a reduced size and improved reliability. The semiconductor device has a power converter circuit constituted by switching devices and diodes, a P-polarity conductor and an N-polarity conductor for supplying electric power to the power converter circuit, a ceramic capacitor having two external electrodes, flexible terminal members connected to the external electrodes, a heat radiation plate provided at the bottom of a case, an insulating resin with which the power converter circuit is covered, a P-polarity connection conductor for connection between the terminal member on one side of the ceramic capacitor and the P-polarity conductor, an N-polarity connection conductor for connection between the terminal member on the other side of the ceramic capacitor and the N-polarity conductor, and a molded wiring plate on which a major surface of the ceramic capacitor is supported.