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1. 发明申请

US20110259628A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED WIRING BOARD, EPOXY RESIN, AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：可固化树脂组合物，其固化产品，印刷线路板，环氧树脂及其生产方法
公开(公告)号：US20110259628A1
公开(公告)日：2011-10-27
申请号：US13124694
申请日：2009-08-07
申请人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
发明人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
IPC分类号： H05K1/09 , C08G59/02 , B32B37/00 , C08G59/14
CPC分类号： C08G59/08 , C08G59/3218 , H05K1/03 , H05K1/0326 , Y10T156/10 , Y10T428/249951
摘要： Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).
摘要翻译：本发明提供一种固化性树脂组合物，它具有良好的耐热性和低热膨胀性，并且在溶剂中具有良好的溶解性，其固化产物，包含该组合物的印刷线路板，赋予这些性能的新型环氧树脂，和生产相同。固化性树脂组合物含有作为必要成分的环氧树脂（A），其分子结构中含有萘结构和环己二烯酮结构通过亚甲基彼此键合的缩水甘油氧基和骨架; 和固化剂（B）。

2. 发明授权

US08394911B2 Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board 有权
标题翻译：酚醛树脂组合物，其制备方法，固化树脂组合物，其固化产物和印刷电路板
公开(公告)号：US08394911B2
公开(公告)日：2013-03-12
申请号：US13577235
申请日：2011-01-19
申请人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
发明人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
IPC分类号： C08G8/04 , C08G14/04 , H01R12/00 , H05K1/00
CPC分类号： H05K1/0326 , C08G8/08 , C08G8/12 , C08K5/13 , H05K2201/012 , Y10T428/31515 , C08L61/06
摘要： A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.
摘要翻译：用作环氧树脂固化剂的酚醛树脂组合物包括由通式（1）表示的萘酚酚醛清漆树脂（a1）（其中R1和R2各自独立地表示氢原子，烷基或烷氧基，和 n为重复单元，1以上的整数）和通式（2）表示的化合物（a2）（式中，R 1和R 2各自独立地表示氢原子，烷基或烷氧基），式存在于组合物中的通式（1）中n = 1且n = 2的化合物的总比例在10〜35％的范围内，通式（1）中n的平均值在 3.0〜7.0，组合物中化合物（a2）的含量为1〜6％。

3. 发明申请

US20120308832A1 PHENOL RESIN COMPOSITION, PRODUCTION METHOD THEREFOR, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD 有权
标题翻译：酚醛树脂组合物，其生产方法，可固化树脂组合物，固化产品和印刷电路板
公开(公告)号：US20120308832A1
公开(公告)日：2012-12-06
申请号：US13577235
申请日：2011-01-19
申请人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
发明人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
IPC分类号： C08G8/28 , B32B27/38 , C08G59/14
CPC分类号： H05K1/0326 , C08G8/08 , C08G8/12 , C08K5/13 , H05K2201/012 , Y10T428/31515 , C08L61/06
摘要： A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.
摘要翻译：用作环氧树脂固化剂的酚醛树脂组合物包括由通式（1）表示的萘酚酚醛清漆树脂（a1）（其中R1和R2各自独立地表示氢原子，烷基或烷氧基，和 n为重复单元，1以上的整数）和通式（2）表示的化合物（a2）（式中，R 1和R 2各自独立地表示氢原子，烷基或烷氧基），式存在于组合物中的通式（1）中n = 1且n = 2的化合物的总比例在10〜35％的范围内，通式（1）中n的平均值在 3.0〜7.0，组合物中化合物（a2）的含量为1〜6％。

4. 发明授权

US08168731B2 Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same 有权
标题翻译：可固化树脂组合物，其固化产物，印刷线路板，环氧树脂及其制备方法
公开(公告)号：US08168731B2
公开(公告)日：2012-05-01
申请号：US13124694
申请日：2009-08-07
申请人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
发明人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
IPC分类号： B32B27/04 , C08L63/00 , H05K1/03
CPC分类号： C08G59/08 , C08G59/3218 , H05K1/03 , H05K1/0326 , Y10T156/10 , Y10T428/249951
摘要： Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).
摘要翻译：本发明提供一种固化性树脂组合物，它具有良好的耐热性和低热膨胀性，并且在溶剂中具有良好的溶解性，其固化产物，包含该组合物的印刷线路板，赋予这些性能的新型环氧树脂，和生产相同。固化性树脂组合物含有作为必要成分的环氧树脂（A），其分子结构中含有萘结构和环己二烯酮结构通过亚甲基彼此键合的缩水甘油氧基和骨架; 和固化剂（B）。

5. 发明申请

US20110275739A1 EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN 有权
标题翻译：环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，生产新型酚醛树脂的方法和生产新型环氧树脂的方法
公开(公告)号：US20110275739A1
公开(公告)日：2011-11-10
申请号：US13157926
申请日：2011-06-10
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08L63/00 , C08G65/40 , C08G59/04 , C08G59/62
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

6. 发明授权

US08263714B2 Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin 有权
标题翻译：环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，新型酚醛树脂的制造方法以及新型环氧树脂的制造方法
公开(公告)号：US08263714B2
公开(公告)日：2012-09-11
申请号：US13157926
申请日：2011-06-10
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08L63/00 , C08L61/06 , C08G59/00 , C08G8/04 , C08G14/02 , C08G65/38
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

7. 发明授权

US07985822B2 Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin 有权
标题翻译：环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，新型酚醛树脂的制造方法以及新型环氧树脂的制造方法
公开(公告)号：US07985822B2
公开(公告)日：2011-07-26
申请号：US11661095
申请日：2005-08-31
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08G59/00
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

8. 发明申请

US20080255315A1 Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin 有权
标题翻译：环氧树脂组合物，其固化物，半导体封装材料，新型酚醛树脂，新型环氧树脂，新型苯酚树脂生产方法，以及新型环氧树脂生产方法
公开(公告)号：US20080255315A1
公开(公告)日：2008-10-16
申请号：US11661095
申请日：2005-08-31
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08G59/00 , C08G65/38
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

9. 发明申请

US20130144030A1 EPOXY COMPOUND, CURABLE COMPOSITION, AND CURED PRODUCT THEREOF 有权
标题翻译：环氧化合物，可固化组合物及其固化产品
公开(公告)号：US20130144030A1
公开(公告)日：2013-06-06
申请号：US13816084
申请日：2011-08-03
申请人： Yutaka Satou
发明人： Yutaka Satou
IPC分类号： C07D303/30
CPC分类号： C07D303/30 , C08G59/245 , C08G59/3218 , C08G59/621 , C08L63/00
摘要： A problem to be solved by the invention is to provide a novel epoxy resin exhibiting excellent performance with respect to heat resistance and low thermal expansibility of a cured product, a curable composition using the same, and a cured product having excellent heat resistance and low thermal expansibility. The curable composition contains an epoxy compound and a curing agent as essential components, a calixarene-type novel epoxy compound being used as the epoxy compound. The novel epoxy compound has a resin structure represented by structural formula 1 below (in the formula, R1s each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeat unit and an integer of 2 to 10).
摘要翻译：本发明要解决的问题是提供一种新型环氧树脂，其在耐热性和固化产物的热膨胀性低的情况下表现出优异的性能，使用其的可固化组合物和具有优异耐热性和低热性的固化产物可扩展性。固化性组合物含有作为必要成分的环氧化合物和固化剂，作为环氧化合物使用的杯芳烃型新型环氧化合物。新型环氧化合物具有下述结构式1所示的树脂结构（式中，R 1各自独立地表示氢原子，烷基或烷氧基，n为重复单元，2〜10的整数）。

10. 发明授权

US07835188B2 Semiconductor memory device 有权
标题翻译：半导体存储器件
公开(公告)号：US07835188B2
公开(公告)日：2010-11-16
申请号：US12361620
申请日：2009-01-29
申请人： Yutaka Satou , Fumiyasu Utsunomiya , Tomohiro Oka
发明人： Yutaka Satou , Fumiyasu Utsunomiya , Tomohiro Oka
IPC分类号： G11C16/00
CPC分类号： G11C29/50 , G11C16/04 , G11C29/50004
摘要： Provided is a semiconductor memory device, which realizes characteristic evaluation even in a case where a threshold voltage is a negative potential by a test method which is similar to a case of a positive potential. The semiconductor memory device includes a plurality of memory cells for storing data. When a test signal is input, the semiconductor memory device changes from a normal mode to a test mode for evaluating characteristics of the plurality of memory cells. The semiconductor memory device also includes: a memory cell selecting portion for selecting a memory cell; a constant voltage portion for generating a reference voltage; a constant current portion for generating a reference current; an X switch voltage switching control circuit for supplying one of an X selection signal and a voltage signal input from an external terminal to a gate of the memory cell; a Y switch portion for supplying the reference current to a drain of the memory cell selected by a Y selection signal; a comparator for detecting whether or not a drain voltage that is a voltage of the drain has exceeded the reference voltage; and a decision level changing portion for adjusting a current value of the reference current and a voltage value of the reference voltage so as to change a decision level of the comparator based on a control signal in the test mode.
摘要翻译：提供一种半导体存储器件，即使在通过与正电位的情况相似的测试方法的阈值电压为负电位的情况下也实现特性评估。半导体存储器件包括用于存储数据的多个存储单元。当输入测试信号时，半导体存储器件从正常模式改变为用于评估多个存储器单元的特性的测试模式。半导体存储装置还包括：存储单元选择部，用于选择存储单元; 用于产生参考电压的恒定电压部分; 用于产生参考电流的恒定电流部分; X开关电压切换控制电路，用于将X选择信号和从外部端子输入的电压信号中的一个提供给存储器单元的栅极; Y开关部分，用于将参考电流提供给由Y选择信号选择的存储器单元的漏极; 用于检测作为所述漏极的电压的漏极电压是否超过所述参考电压的比较器; 以及判定电平改变部分，用于调整参考电流的当前值和参考电压的电压值，以便基于测试模式中的控制信号来改变比较器的判定电平。

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