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    • 8. 发明申请
    • LENS UNIT AND VEHICLE-MOUNTED INFRARED LENS UNIT
    • 镜头单元和车身安装的红外线镜头单元
    • US20120019905A1
    • 2012-01-26
    • US13131812
    • 2009-11-26
    • Kanji TeraokaAkihito FujiiTatsuya Izumi
    • Kanji TeraokaAkihito FujiiTatsuya Izumi
    • G02B13/14G02B7/02
    • G02B7/028G02B7/021G02B13/14
    • Provided are a lens unit and a vehicle-mounted infrared lens unit capable of correcting a focal shift due to a temperature change without increasing the apparatus size, complicating a production process, and increasing the costs. In a vehicle-mounted infrared lens unit 4 configured such that a plurality of infrared lenses are held by a barrel 30 and a spacer 40 is interposed between two infrared lenses, a first infrared lens 10 is held sandwiched between the spacer 40 and a lens holding portion 31 of the barrel 30. The spacer 40 and the barrel 30 are formed of materials having different thermal expansion coefficients. An O-ring 60 is interposed between a lock portion 32 of the lens holding portion 31 and the first infrared lens 10. Thermal expansion of the spacer 40 allows the first infrared lens 10 to move in the axial direction against the elastic force of the O-ring 60. When the spacer 40 is shrunken, the elastic force of the O-ring 60 allows the first infrared lens 10 to move in the opposite direction.
    • 提供一种透镜单元和车载红外透镜单元,其能够在不增加设备尺寸,使生产过程复杂化并增加成本的情况下校正由于温度变化引起的焦点偏移。 在车载红外线透镜单元4中,第一红外线透镜单元4被配置为使得多个红外透镜被筒30保持,并且间隔物40插入在两个红外透镜之间,第一红外透镜10夹持在间隔件40和透镜保持 隔套40和筒体30由具有不同热膨胀系数的材料形成。 O形环60插入在透镜保持部31的锁定部32和第一红外线透镜10之间。间隔物40的热膨胀允许第一红外线透镜10抵抗O的弹力沿轴向移动 当间隔件40收缩时,O形环60的弹性力允许第一红外线透镜10沿相反方向移动。
    • 10. 发明授权
    • Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
    • 用于半导体工作的压敏粘合片和用于制造半导体芯片的方法
    • US07351645B2
    • 2008-04-01
    • US11140763
    • 2005-05-31
    • Hitoshi OhashiTatsuya IzumiKazuhiro Takahashi
    • Hitoshi OhashiTatsuya IzumiKazuhiro Takahashi
    • H01L21/301
    • H01L21/6836C09J7/29C09J2201/162C09J2203/326H01L21/67132H01L21/78H01L2221/68327
    • A pressure sensitive adhesive sheet to be used in producing an extremely thin semiconductor chip which is free of breakage and discoloration by a predicing process and a method of use thereof are provided. The pressure sensitive adhesive sheet is used in a method for producing a semiconductor chip, in which the method involves the steps of: forming a groove having depth smaller than thickness of a wafer on a surface of the wafer on which a semiconductor circuit is formed; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer. The pressure sensitive adhesive sheet contains a rigid substrate, a vibration relaxation layer provided on one face of the rigid substrate and a pressure sensitive adhesive layer provided on the other face of the rigid substrate, in which thickness of the rigid substrate is 10 to 150 μm and Young's modulus thereof is 1000 to 30000 MPa, and thickness of the vibration relaxation layer is 5 to 80 μm and a maximum value of tan δ of dynamic viscoelasticity thereof at −5° C. to 120° C. is 0.5 or more.
    • 本发明提供一种压敏粘合片,其用于生产通过预处理方法没有破损和变色的极薄的半导体芯片及其使用方法。 压敏粘合片用于制造半导体芯片的方法中,其中所述方法包括以下步骤:在其上形成有半导体电路的晶片的表面上形成深度小于晶片厚度的凹槽; 减小晶片的厚度,最后通过研磨晶片的背面将晶片分成单独的芯片。 压敏粘合片包含刚性基材,设置在刚性基材的一个面上的振动缓冲层和设置在刚性基材的另一面上的压敏粘合剂层,其中刚性基材的厚度为10至150μm 杨氏模量为1000〜30000MPa,振动缓和层的厚度为5〜80μm,在-5℃〜120℃下的动态粘弹性的tanδ的最大值为0.5以上。