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    • 1. 发明授权
    • Electronic component and manufacturing method thereof
    • 电子元器件及其制造方法
    • US07541722B2
    • 2009-06-02
    • US12100459
    • 2008-04-10
    • Yutaka IshiuraTakeshi MatsumaeKazuhiro InoueToshiaki Takata
    • Yutaka IshiuraTakeshi MatsumaeKazuhiro InoueToshiaki Takata
    • H01L41/047
    • H03H9/02992H03H3/08H03H9/02937H03H9/02984
    • An electronic component has a structure which prevents corrosion caused by moisture intrusion through an electrode pattern extending inwardly from an edge connecting a side and one of main surfaces of a substrate and, therefore, deterioration of a characteristic rarely occurs over time. The electronic component includes, on the first main surface of the substrate, the first electrode pattern extending inwardly from an edge connecting the side of the substrate and the first main surface of the substrate, the second electrode pattern that is opposite to the end of the first electrode pattern through the gap, and the third electrode pattern that is disposed on the first electrode pattern and the second electrode pattern such that it covers the gap. The third electrode pattern is formed from a metal film that is highly resistant to corrosion, the corrosion resistance of which is superior to that of metal films forming the first electrode pattern and the second electrode pattern.
    • 电子部件具有这样的结构,其防止湿气侵入通过从连接基板的一侧和一个主面的边缘向内延伸的电极图案而引起的腐蚀,因此,随着时间的推移,特性的劣化很少发生。 电子部件在基板的第一主表面上包括从连接基板的一侧和基板的第一主表面的边缘向内延伸的第一电极图案,与第二电极图案相对的第二电极图案 通过所述间隙的第一电极图案,以及设置在所述第一电极图案和所述第二电极图案上使得其覆盖所述间隙的所述第三电极图案。 第三电极图案由耐腐蚀性高的金属膜形成,其耐腐蚀性优于形成第一电极图案和第二电极图案的金属膜的耐腐蚀性。
    • 2. 发明申请
    • ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    • 电子元器件及其制造方法
    • US20080179991A1
    • 2008-07-31
    • US12100459
    • 2008-04-10
    • Yutaka IshiuraTakeshi MatsumaeKazuhiro InoueToshiaki Takata
    • Yutaka IshiuraTakeshi MatsumaeKazuhiro InoueToshiaki Takata
    • H03H9/25
    • H03H9/02992H03H3/08H03H9/02937H03H9/02984
    • An electronic component has a structure which prevents corrosion caused by moisture intrusion through an electrode pattern extending inwardly from an edge connecting a side and one of main surfaces of a substrate and, therefore, deterioration of a characteristic rarely occurs over time. The electronic component includes, on the first main surface of the substrate, the first electrode pattern extending inwardly from an edge connecting the side of the substrate and the first main surface of the substrate, the second electrode pattern that is opposite to the end of the first electrode pattern through the gap, and the third electrode pattern that is disposed on the first electrode pattern and the second electrode pattern such that it covers the gap. The third electrode pattern is formed from a metal film that is highly resistant to corrosion, the corrosion resistance of which is superior to that of metal films forming the first electrode pattern and the second electrode pattern.
    • 电子部件具有这样的结构,其防止湿气侵入通过从连接基板的一侧和一个主面的边缘向内延伸的电极图案而引起的腐蚀,因此,随着时间的推移,特性的劣化很少发生。 电子部件在基板的第一主表面上包括从连接基板的一侧和基板的第一主表面的边缘向内延伸的第一电极图案,与第二电极图案相对的第二电极图案 通过所述间隙的第一电极图案,以及设置在所述第一电极图案和所述第二电极图案上使得其覆盖所述间隙的所述第三电极图案。 第三电极图案由耐腐蚀性高的金属膜形成,其耐腐蚀性优于形成第一电极图案和第二电极图案的金属膜的耐腐蚀性。
    • 3. 发明授权
    • Surface acoustic wave device and communication apparatus
    • 声表面波装置及通信装置
    • US07049908B2
    • 2006-05-23
    • US10847584
    • 2004-05-18
    • Toshiaki Takata
    • Toshiaki Takata
    • H03H9/64
    • H03H9/6483
    • A surface acoustic wave device includes one-terminal-pair SAW series resonators and one-terminal-pair SAW parallel resonators arranged in a ladder configuration. Among the series resonators, the resonant frequencies of, for example, two series resonators forming the pass band are lower than the anti-resonant frequency of the parallel resonators forming the pass band. A capacitive area of one of the series resonator is disposed in an inductive area formed by the parallel resonators forming the pass band and the other series resonators forming the pass band.
    • 表面声波装置包括以梯形结构布置的单端对SAW串联谐振器和单端对SAW并联谐振器。 在串联谐振器中,形成通带的例如两个串联谐振器的谐振频率低于形成通带的并联谐振器的反谐振频率。 串联谐振器之一的电容区域设置在由形成通带的并联谐振器和形成通带的其它串联谐振器形成的感应区域中。
    • 4. 发明授权
    • Elastic wave duplexer
    • 弹性波双工器
    • US07619491B2
    • 2009-11-17
    • US12274411
    • 2008-11-20
    • Toshiaki TakataOsamu Yokokura
    • Toshiaki TakataOsamu Yokokura
    • H03H9/72H03H9/64
    • H03H9/0576H01L2224/16H01L2224/48227H01L2224/49171H01L2924/30111H03H9/725H01L2924/00
    • An elastic wave duplexer includes a transmission filter chip and a reception filter chip each defined by an elastic wave filter chip and flip-chip bonded to a laminated board. A coil-shaped line including coil-shaped line patterns is provided inside the laminated board. The coil-shaped line defines an impedance matching circuit. In plan view, the transmission filter chip is disposed on one side of a center line passing through the approximate center of the laminated board and extending between a first edge and a second edge, and the reception filter chip is disposed on the other side of the center line. The coil-shaped line is disposed on the side on which the reception filter chip is disposed.
    • 弹性波双工器包括传输滤波器芯片和接收滤波器芯片,每个接收滤波器芯片由弹性波滤波器芯片和倒装芯片结合到层压板上而定义。 在层叠板内设置有包括线圈状线状的线圈状线。 线圈形线路限定了阻抗匹配电路。 在平面图中,透射滤光片芯片配置在穿过层叠板的大致中心的中心线的一侧,并且在第一边缘和第二边缘之间延伸,并且接收滤波器芯片设置在 中心线。 线圈状线设置在配置有接收滤波器芯片的一侧。
    • 5. 发明授权
    • Process for producing polycarbonate resin with high flowability
    • 具有高流动性的聚碳酸酯树脂的制造方法
    • US5969084A
    • 1999-10-19
    • US59412
    • 1998-04-14
    • Takahiro AdachiToshiaki Takata
    • Takahiro AdachiToshiaki Takata
    • C08G64/24C08G64/00
    • C08G64/24
    • A process for producing a polycarbonate resin with high flowability having a viscosity average molecular weight (Mv) of 13,000 to 20,000 according to an interfacial polymerization method which comprises the steps of forming a reaction mixture while injecting phosgene into bisphenol, after the completion of injection of phosgene, adding a tetraammonium salt to the reaction mixture, then, conducting polycondensation reaction, after a viscosity average molecular weight (Mv) of a reaction mixture containing the resultant reaction products has reached to 3,000 or above and less than 6,000, adding a molecular weight modifier to the reaction mixture, further conducting polycondensation reaction, and thereby obtaining the polycarbonate resin.
    • 根据界面聚合方法制备粘度平均分子量(Mv)为13,000〜20,000的高流动性的聚碳酸酯树脂的方法,该方法包括以下步骤:在将光气注入双酚中之后形成反应混合物,注射完成后 光气,向反应混合物中加入四铵盐,然后在含有所得反应产物的反应混合物的粘均分子量(Mv)达到3,000以上且小于6,000之后进行缩聚反应,加入分子量 改性剂进一步进行缩聚反应,得到聚碳酸酯树脂。
    • 9. 发明授权
    • Branching filter
    • 分支过滤器
    • US07486158B2
    • 2009-02-03
    • US11766233
    • 2007-06-21
    • Toshiaki Takata
    • Toshiaki Takata
    • H03H9/72
    • H03H9/0576H03H9/6483H03H9/72H03H9/725
    • A branching filter suppresses the effect of a ripple at a high frequency side of a first band-pass filter having a relatively low frequency passband and achieves sufficient pass band widths of the first and second band-pass filters. The branching filter includes a first band-pass filter having a relatively low frequency passband and a second band-pass filter having a relatively high frequency passband. The first and second band-pass filters each have a SAW filter having a ladder circuit structure. The second band-pass filter has first to third parallel resonators. The first and second parallel resonators are commonly connected to a common-connection ground terminal. A first inductance is connected between the common-connection ground terminal and a ground potential. In the branching filter, a relationship f1>f0>f2 is satisfied, wherein f0 denotes an average of resonant frequencies of all the parallel resonators.
    • 分路滤波器抑制具有相对低频通带的第一带通滤波器的高频侧的纹波的影响,并且获得第一和第二带通滤波器的足够的通带宽度。 分路滤波器包括具有相对低频通带的第一带通滤波器和具有相对较高频率通带的第二带通滤波器。 第一和第二带通滤波器各自具有梯形电路结构的SAW滤波器。 第二带通滤波器具有第一至第三并联谐振器。 第一和第二并联谐振器通常连接到公共接地端子。 第一电感连接在公共接地端和地电位之间。 在分波器中,满足关系f1> f0> f2,其中f0表示所有并联谐振器的谐振频率的平均值。