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    • 3. 发明申请
    • Process For Producing Unsaturated Aldehyde And/or Unsaturated Carboxylic Acid
    • 生产不饱和醛和/或不饱和羧酸的方法
    • US20130310604A1
    • 2013-11-21
    • US13982808
    • 2012-01-16
    • Tatsuhiko KurakamiSusumu MatsumotoAtsushi SudoKazuo ShiraishiMasashi Hashiba
    • Tatsuhiko KurakamiSusumu MatsumotoAtsushi SudoKazuo ShiraishiMasashi Hashiba
    • C07C51/25C07C45/38C07C51/235C07C45/35
    • C07C51/235C07C45/35C07C45/38C07C51/252C07C47/22C07C57/04
    • There is provided a process for producing aerolein, acrylic acid, methacrolein, methacrylic acid in a safe and steady manner and in high yields, which avoids a phenomenon of occurrence of an abnormal reaction attributable to the fact that the temperature at a raw material gas outlet side becomes considerably higher than the temperature at a raw material gas inlet side, with regard to the temperature of a catalyst packed in a reaction tube at vapor-phase catalytic oxidation of propylene, isobutylene, or the like.In the process of using a reaction tube on which a plurality of catalyst layers formed in a raw material gas flow direction, a catalyst and a catalyst packing schedule are designed so that a relation between the raw material conversion rate at which the yield of the objective product becomes maximum and the raw material conversion rate at which a high and low correlation between maximum temperature of the catalyst layer present closest to a reaction gas inlet side Zin and maximum temperature of the catalyst layer present closest to a reaction gas outlet side Zout is reversed satisfies a specific condition of 0.5≦Cmax−Ccrs≦5, in which Cmax: a raw material conversion rate at which yield of the objective products becomes maximum; and Ccrs: a raw material conversion rate at which, when maximum temperature of the catalyst layer Zin is regarded as Tin, maximum temperature of the catalyst layer Zout is regarded as Tout, and the raw material conversion rate is changed, a high and low correlation between Tin and Tout is reversed.
    • 提供了以安全稳定的方式和高产率生产气溶胶,丙烯酸,甲基丙烯醛,甲基丙烯酸的方法,避免了由于原料气体出口处的温度导致的异常反应的发生现象 相对于在丙烯,异丁烯等的气相催化氧化反应管中填充的催化剂的温度,原料气体入口侧的温度显着高于原料气体入口侧的温度。 在使用在原料气体流动方向上形成有多个催化剂层的反应管的过程中,设计催化剂和催化剂填充进度,使得目的物的产率的原料转化率之间的关系 产物变得最大,并且最接近反应气体入口侧的催化剂层的最高温度和最接近反应气体出口侧的催化剂层的最高温度之间的高低相关性的原料转化率反转 满足0.5 @ Cmax-Ccrs @ 5的特定条件,其中Cmax:目标产物的产率变为最大的原料转化率; Ccrs:将催化剂层Zin的最高温度设为Tin时的原料转化率,将催化剂层Zout的最高温度设为Tout,将原料转化率变更为高,低相关 Tin和Tout之间是相反的。
    • 8. 发明授权
    • Method of fabricating a semiconductor memory device
    • 制造半导体存储器件的方法
    • US5405800A
    • 1995-04-11
    • US274048
    • 1994-07-12
    • Hisashi OgawaSusumu MatsumotoShin HashimotoHiroyuki Umimoto
    • Hisashi OgawaSusumu MatsumotoShin HashimotoHiroyuki Umimoto
    • H01L27/108H01L21/70
    • H01L27/10808
    • A method of fabricating a semiconductor memory device on a semiconductor substrate is disclosed. A gate electrode that becomes a word line, a bit line, and a charge-storage electrode are formed in a memory cell array region of a semiconductor substrate. A capacitor insulator layer and a plate electrode are formed in that order. Then, a BPSG film is formed in the memory cell array region and in the peripheral circuit region. A resist pattern is formed on the BPSG film, leaving the memory cell array region exposed. Using the resist pattern thus formed as a mask, an etching treatment is applied to remove an upper surface portion of the BPSG film lying within the memory cell array region by a given amount. After the resist pattern is removed, the BPSG film is heated in order that it reflows to planarize.
    • 公开了一种在半导体衬底上制造半导体存储器件的方法。 在半导体衬底的存储单元阵列区域中形成成为字线,位线和电荷存储电极的栅电极。 依次形成电容器绝缘体层和平板电极。 然后,在存储单元阵列区域和外围电路区域中形成BPSG膜。 在BPSG膜上形成抗蚀剂图案,使存储单元阵列区域暴露。 使用如此形成的抗蚀剂图案作为掩模,进行蚀刻处理以将存在于存储单元阵列区域内的BPSG膜的上表面部分除去给定量。 在除去抗蚀剂图案之后,加热BPSG膜,使其回流平坦化。