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    • 2. 发明授权
    • Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device
    • III族氮化物半导体激光器件以及III族氮化物半导体激光器件的制造方法
    • US08139619B2
    • 2012-03-20
    • US13209054
    • 2011-08-12
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • H01S5/00
    • H01S5/34333B82Y20/00H01S5/0202H01S5/2201H01S5/3202
    • Provided are a group-III nitride semiconductor laser device with a laser cavity to enable a low threshold current on a semipolar surface of a hexagonal group-III nitride, and a method for fabricating the group-III nitride semiconductor laser device on a stable basis. Notches, e.g., notch 113a and others, are formed at four respective corners of a first surface 13a located on the anode side of a group-III nitride semiconductor laser device 11. The notch 113a or the like is a part of a scribed groove provided for separation of the device 11. The scribed grooves are formed with a laser scriber and the shape of the scribed grooves is adjusted by controlling the laser scriber. For example, a ratio of the depth of the notch 113a or the like to the thickness of the group-III nitride semiconductor laser device 11 is not less than 0.05 and not more than 0.4, a tilt of a side wall surface at an end of the notch 113a is not less than 45° and not more than 85°, and a tilt of a side wall surface at an end of the notch 113b is not less than 10° and not more than 30°.
    • 提供了具有激光腔的III族氮化物半导体激光器件,其能够在六边形III族氮化物的半极性表面上实现低阈值电流,以及稳定地制造III族氮化物半导体激光器件的方法。 在位于III族氮化物半导体激光装置11的阳极侧的第一表面13a的四个相应的角部处形成缺口,例如凹口113a等。凹口113a等是设置在划线槽中的一部分 用于分离设备11.划线槽由激光划线器形成,并且通过控制激光划线机来调节划线槽的形状。 例如,凹口113a的深度等于III族氮化物半导体激光器件11的厚度的比率不小于0.05且不大于0.4,则侧壁表面的端部的倾斜度 凹口113a不小于45°并且不大于85°,并且凹口113b的端部处的侧壁表面的倾斜度不小于10°并且不大于30°。
    • 3. 发明授权
    • Method of fabricating group-III nitride semiconductor laser device
    • III族氮化物半导体激光器件的制造方法
    • US08105857B2
    • 2012-01-31
    • US12837306
    • 2010-07-15
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • H01L21/18
    • H01S5/0202H01S5/2201H01S5/3202H01S5/32341
    • A method for fabricating a III-nitride semiconductor laser device includes: forming a substrate product having a laser structure; scribing a first surface of the substrate product to form a scribed mark, which extends along a reference line indicative of a direction of the a-axis of the hexagonal III-nitride semiconductor, on the first surface, a scribed mark; mounting the substrate product on a breaking device to support first and second regions of the substrate product by first and second support portions, respectively, of the breaking device; and carrying out breakup of the substrate product by press in alignment with the scribed mark in a third region, without supporting the third region of the substrate product located between the first and second regions, to form another substrate product and a laser bar. First and second end faces of the laser bar form a laser cavity of the III-nitride semiconductor laser device.
    • 一种制造III族氮化物半导体激光器件的方法包括:形成具有激光结构的衬底产品; 划定衬底产品的第一表面以形成刻痕,其沿着表示六边形III族氮化物半导体的a轴的方向的参考线延伸在第一表面上,划线标记; 将所述基板产品安装在断开装置上以分别通过所述断路装置的第一和第二支撑部分支撑所述基板产品的第一和第二区域; 并且在不支撑位于第一和第二区域之间的基板产品的第三区域的情况下,在第三区域中通过压制与基板标记对准地分解基板产品,以形成另一基板产品和激光条。 激光棒的第一和第二端面形成III族氮化物半导体激光器件的激光腔。