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1. 发明申请

US20100059252A1 METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE AND COMPOSITE SHEET 有权
标题翻译：制造多层陶瓷基板和复合板的方法
公开(公告)号：US20100059252A1
公开(公告)日：2010-03-11
申请号：US12621642
申请日：2009-11-19
申请人： Yusuke OTSUKA , Kazuo KISHIDA , Takahiro TAKADA
发明人： Yusuke OTSUKA , Kazuo KISHIDA , Takahiro TAKADA
IPC分类号： H05K1/00 , B32B37/06 , B32B18/00
CPC分类号： H05K1/167 , B32B18/00 , C04B35/632 , C04B35/6342 , C04B35/63424 , C04B35/6346 , C04B35/6365 , C04B2235/656 , C04B2235/9661 , C04B2237/32 , C04B2237/34 , C04B2237/341 , C04B2237/343 , C04B2237/348 , C04B2237/56 , C04B2237/62 , C04B2237/68 , C04B2237/702 , C04B2237/704 , C04B2237/82 , H01L21/4807 , H01L21/4867 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/125 , H05K3/4614 , H05K3/4629 , H05K2203/013 , H05K2203/308 , H01L2924/00
摘要： A high-quality resistor pattern and conductor pattern is formed on an external surface of a multilayer ceramic substrate by an ink jet method. A composite sheet including a first ceramic green layer and a shrinkage-retardant layer is formed, and a resistor pattern and a conductor pattern are formed on the first ceramic green layer of the composite sheet by an ink jet method. Subsequently, a plurality of second ceramic green layers are stacked with the composite sheet such that the shrinkage-retardant layer of the composite sheet defines an outermost layer, thus forming a multilayer composite including an unfired multilayer ceramic substrate and the shrinkage-retardant layer. Then, the multilayer composite is fired, and the shrinkage-retardant layer is removed to obtain a sintered multilayer ceramic substrate.
摘要翻译：通过喷墨法在多层陶瓷基板的外表面上形成高质量的电阻图案和导体图案。形成包括第一陶瓷生坯层和收缩阻止层的复合片材，并且通过喷墨法在复合片材的第一陶瓷生坯层上形成电阻器图案和导体图案。随后，复合片层叠多个第二陶瓷生层，使得复合片材的收缩阻止层定义为最外层，由此形成包含未烧成的多层陶瓷基板和收缩阻止层的多层复合体。然后，对多层复合材料进行烧成，除去收缩层，得到烧结体的多层陶瓷基板。

2. 发明申请

US20110266036A1 LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：层压型陶瓷电子元件及其制造方法
公开(公告)号：US20110266036A1
公开(公告)日：2011-11-03
申请号：US13181572
申请日：2011-07-13
申请人： Yuichi IIDA , Yusuke OTSUKA
发明人： Yuichi IIDA , Yusuke OTSUKA
IPC分类号： H05K1/03 , C03B29/00
CPC分类号： H05K1/167 , B32B18/00 , C04B2235/9607 , C04B2237/343 , C04B2237/562 , C04B2237/62 , C04B2237/68 , H05K1/0306 , H05K3/28 , H05K3/4611 , H05K3/4629 , H05K2201/017 , H05K2203/308
摘要： A laminate type ceramic electronic component includes a thick film resistor and an overcoat layer so as to prevent defects such as delamination from being caused and to prevent the thick film resistor from being cracked after laser trimming, even when a method is adopted in which an unfired composite laminate is subjected to firing in such a way that an unfired ceramic laminate, an unfired thick film resistor, and an unfired overcoat layer are each integrally sintered. The unfired overcoat layer includes a glass ceramic material containing a ceramic and glass having substantially the same constituents and compositional ratio as those of the glass contained in the unfired ceramic layer. The respective glass ceramic materials constituting the unfired ceramic layer and the unfired overcoat layer are adjusted so that the ratio of a crystalline phase with a smaller coefficient of thermal expansion than the coefficient of thermal expansion of the fired ceramic layer is higher in the overcoat layer than in the ceramic layer.
摘要翻译：叠层型陶瓷电子部件包括厚膜电阻器和外涂层，以便防止在产生分层之类的缺陷，并且防止厚膜电阻器在激光修整之后破裂，即使采用不熟悉的方法将复合层叠体进行焙烧，使得未烧结的陶瓷层压体，未烧结的厚膜电阻器和未烧结的外涂层均被一体烧结。未焙烧的外涂层包括含有陶瓷和玻璃的玻璃陶瓷材料，其具有与未焙烧陶瓷层中所含的玻璃的成分和组成比基本相同的成分和组成比。调整构成未烧结的陶瓷层和未烧结的外涂层的各玻璃陶瓷材料，使得在外涂层中，具有比煅烧陶瓷层的热膨胀系数小的热膨胀系数的结晶相的比例高于在陶瓷层中。

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