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    • 2. 发明授权
    • Magnetic sensor module
    • 磁传感器模块
    • US07868612B2
    • 2011-01-11
    • US12707263
    • 2010-02-17
    • Toshiaki KonnoNaoki KitauraNobuaki Haga
    • Toshiaki KonnoNaoki KitauraNobuaki Haga
    • G01B7/14G01R33/05H01L23/48
    • G01R33/0206G01R33/0005G01R33/0047H01L2224/48137H01L2224/73265
    • In a magnetic sensor module, using die-bond resin as a joining material, a Z-axis magnetic sensor is mounted onto a substrate having a wire formed on its principal surface. The Z-axis magnetic sensor having electrode pads formed on its bottom surface is tilted by 90 degrees and mounted onto the substrate. Therefore, the electrode pads are positioned at a side surface thereof. A joining material accommodation area which the die-bond resin can fill is provided at the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate. This joining material accommodation area has a grooved structure. At the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate, the grooved structure is provided at an end portion near the wire formed on the substrate.
    • 在磁传感器模块中,使用芯片接合树脂作为接合材料,将Z轴磁传感器安装在具有在其主表面上形成的导线的基板上。 具有形成在其底面上的电极焊盘的Z轴磁传感器倾斜90度并安装在基板上。 因此,电极焊盘位于其侧面。 在与基板的主面相对的Z轴磁传感器的表面设置有可以填充芯片接合树脂的接合材料容纳区域。 该接合材料容纳区域具有沟槽结构。 在Z轴磁传感器的与基板主表面相对的表面上,槽形结构设置在靠近基板上的金属丝的端部。
    • 6. 发明申请
    • MAGNETIC SENSOR MODULE
    • 磁传感器模块
    • US20110074402A1
    • 2011-03-31
    • US12961235
    • 2010-12-06
    • Toshiaki KonnoNaoki KitauraNobuaki Haga
    • Toshiaki KonnoNaoki KitauraNobuaki Haga
    • G01R33/02
    • G01R33/0206G01R33/0005G01R33/0047H01L2224/48137H01L2224/73265
    • In a magnetic sensor module, using die-bond resin as a joining material, a Z-axis magnetic sensor is mounted onto a substrate having a wire formed on its principal surface. The Z-axis magnetic sensor having electrode pads formed on its bottom surface is tilted by 90 degrees and mounted onto the substrate. Therefore, the electrode pads are positioned at a side surface thereof. A joining material accommodation area which the die-bond resin can fill is provided at the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate. This joining material accommodation area has a grooved structure. At the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate, the grooved structure is provided at an end portion near the wire formed on the substrate.
    • 在磁传感器模块中,使用芯片接合树脂作为接合材料,将Z轴磁传感器安装在具有在其主表面上形成的导线的基板上。 具有形成在其底面上的电极焊盘的Z轴磁传感器倾斜90度并安装在基板上。 因此,电极焊盘位于其侧面。 在与基板的主面相对的Z轴磁传感器的表面设置有可以填充芯片接合树脂的接合材料容纳区域。 该接合材料容纳区域具有沟槽结构。 在Z轴磁传感器的与基板主表面相对的表面上,槽形结构设置在靠近基板上的金属丝的端部。
    • 10. 发明申请
    • MAGNETIC SENSOR MODULE
    • 磁传感器模块
    • US20100141250A1
    • 2010-06-10
    • US12707263
    • 2010-02-17
    • Toshiaki KonnoNaoki KitauraNobuaki Haga
    • Toshiaki KonnoNaoki KitauraNobuaki Haga
    • G01R33/02
    • G01R33/0206G01R33/0005G01R33/0047H01L2224/48137H01L2224/73265
    • In a magnetic sensor module, using die-bond resin as a joining material, a Z-axis magnetic sensor is mounted onto a substrate having a wire formed on its principal surface. The Z-axis magnetic sensor having electrode pads formed on its bottom surface is tilted by 90 degrees and mounted onto the substrate. Therefore, the electrode pads are positioned at a side surface thereof. A joining material accommodation area which the die-bond resin can fill is provided at the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate. This joining material accommodation area has a grooved structure. At the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate, the grooved structure is provided at an end portion near the wire formed on the substrate.
    • 在磁传感器模块中,使用芯片接合树脂作为接合材料,将Z轴磁传感器安装在具有在其主表面上形成的导线的基板上。 具有形成在其底面上的电极焊盘的Z轴磁传感器倾斜90度并安装在基板上。 因此,电极焊盘位于其侧面。 在与基板的主面相对的Z轴磁传感器的表面设置有可以填充芯片接合树脂的接合材料容纳区域。 该接合材料容纳区域具有沟槽结构。 在Z轴磁传感器的与基板主表面相对的表面上,槽形结构设置在靠近基板上的金属丝的端部。