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1. 发明申请

US20090141516A1 OPTOELECTRONIC SEMICONDUCTOR COMOPNENT CAPABLE OF CENTRALIZING EMITTED LIGHT 有权
标题翻译：光电子半导体能够集中发光的能力
公开(公告)号：US20090141516A1
公开(公告)日：2009-06-04
申请号：US12117723
申请日：2008-05-08
申请人： Yung-Fu Wu , He-Feng Zhang
发明人： Yung-Fu Wu , He-Feng Zhang
IPC分类号： H01L33/00 , F21V7/04
CPC分类号： H01L33/60 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor component includes a light-emitting chip for emitting light, and a reflective substrate. A plurality of linear indent structures is formed on the reflective substrate. The light-emitting chip is installed on the reflective substrate and located on a side of the plurality of linear indent structures. The plurality of linear indent structures is capable of reflecting the light emitted from the light-emitting chip.
摘要翻译：光电子半导体部件包括用于发光的发光芯片和反射基板。在反射基板上形成多个线性凹陷结构。发光芯片安装在反射基板上并位于多个线性压痕结构的一侧。多个线性压入结构能够反射从发光芯片发射的光。

2. 发明授权

US07855392B2 Optoelectronic semiconductor component capable of centralizing emitted light 有权
标题翻译：能够集中发光的光电半导体元件
公开(公告)号：US07855392B2
公开(公告)日：2010-12-21
申请号：US12117723
申请日：2008-05-08
申请人： Yung-Fu Wu , He-Feng Zhang
发明人： Yung-Fu Wu , He-Feng Zhang
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor component includes a light-emitting chip for emitting light, and a reflective substrate. A plurality of linear indent structures is formed on the reflective substrate. The light-emitting chip is installed on the reflective substrate and located on a side of the plurality of linear indent structures. The plurality of linear indent structures is capable of reflecting the light emitted from the light-emitting chip.
摘要翻译：光电子半导体部件包括用于发光的发光芯片和反射基板。在反射基板上形成多个线性凹陷结构。发光芯片安装在反射基板上并位于多个线性压痕结构的一侧。多个线性压入结构能够反射从发光芯片发射的光。

3. 发明授权

US08496771B2 Method of filling and sealing a fluorescent layer in a slot space defined by two optical lenses and a partition ring 有权
标题翻译：在由两个光学透镜和分隔环限定的狭槽空间中填充和密封荧光层的方法
公开(公告)号：US08496771B2
公开(公告)日：2013-07-30
申请号：US13014708
申请日：2011-01-26
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： B32B17/00
CPC分类号： H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A method of filling and sealing a fluorescent layer in a slot space defined by two optical lenses and a partition ring is disclosed, in which a slot space is defined by two optical glasses and a partition frame having a partition ring on the inner wall surface. The partition frame is installed with two slots diametrically opposite to each other, and the slot space is evacuated to allow filling of a fluorescent material, and then the two slots are sealed so that the moisture is prevented from permeating into the fluorescent layer, and thus the optical performance can be maintained over a long period.
摘要翻译：公开了一种在由两个光学透镜和分隔环限定的狭槽空间中填充和密封荧光层的方法，其中槽空间由两个光学眼镜和在内壁表面上具有分隔环的分隔框架限定。分隔框架安装有两个彼此径向相对的槽，并且槽空间被抽真空以允许填充荧光材料，然后将两个槽密封，使得防止水分渗入荧光层，因此可以长时间保持光学性能。

4. 发明申请

US20130126913A1 THIN MULTI-LAYER LED ARRAY ENGINE 有权
标题翻译：薄多层LED阵列发动机
公开(公告)号：US20130126913A1
公开(公告)日：2013-05-23
申请号：US13301782
申请日：2011-11-22
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A thin multi-layer LED array engine is provided, which includes a substrate having a phosphor layer and a silica gel protection layer formed thereon. The phosphor layer is disposed on LED dices and makes direct contact with the substrate, and the silica gel protection layer is disposed on the phosphor layer. The LED dices are covered with the phosphor layer, and thereby the phosphor particles in the phosphor layer can be uniformly dispersed around the LED dices, so that the narrow color temperature distribution can be achieved. Furthermore, the phosphor layer makes direct contacts with the substrate, and thereby heat generated in the phosphor layer can be effectively dissipated through the substrate, and thereby the reliability of the optical components can be increased.
摘要翻译：提供了一种薄的多层LED阵列引擎，其包括在其上形成有荧光体层和硅胶保护层的基板。磷光体层设置在LED芯片上，与基板直接接触，硅胶保护层设置在荧光体层上。 LED芯片被荧光体层覆盖，从而荧光体层中的荧光体颗粒能够均匀地分散在LED芯片周围，从而可以实现窄的色温分布。此外，荧光体层与衬底直接接触，从而可以通过衬底有效地消散荧光体层中产生的热，从而可以提高光学部件的可靠性。

5. 发明授权

US08316534B2 Method for packaging airtight multi-layer array type LED 有权
标题翻译：封装密封多层阵列型LED的方法
公开(公告)号：US08316534B2
公开(公告)日：2012-11-27
申请号：US13014706
申请日：2011-01-26
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H05K3/30
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48137 , H01L2924/09701 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： A method for packaging an airtight multi-layer array type LED is disclosed. The method includes: integrally forming a metal substrate with an airtight metal frame surrounding an accommodating space; forming a light outlet platform surrounding a light outlet opening on a bottom of the accommodating space; forming two horizontal sealing through holes in the airtight metal frame, wherein each sealing through hole has one lead frame inserted therethrough, and all interstitial space in the two horizontal sealing through holes is completely sealed with a sealing material; disposing the optical units and optical components in the accommodating space; sequentially forming a dice protection layer, a fluorescent layer, and a silicone layer on the LED dices; and installing an optical glass cover on the top surface of the airtight metal frame to seal the packaging structure of the present invention.
摘要翻译：公开了一种用于封装气密多层阵列型LED的方法。该方法包括：用围绕容纳空间的气密金属框架一体地形成金属基板; 形成围绕容纳空间的底部上的出光口的光出口平台; 在气密金属框架中形成两个水平密封通孔，其中每个密封通孔具有插入其中的一个引线框架，两个水平密封通孔中的所有间隙空间用密封材料完全密封; 将光学单元和光学部件布置在容纳空间中; 在LED芯片上依次形成芯片保护层，荧光层和硅树脂层; 以及在气密金属框架的顶面安装光学玻璃盖以密封本发明的包装结构。

6. 发明申请

US20120186726A1 Method Of Filling And Sealing A Fluorescent Layer In A Slot Space Defined By Two Optical Lenses And A Partition Ring 有权
标题翻译：在由两个光学透镜和分隔环定义的槽空间中填充和密封荧光层的方法
公开(公告)号：US20120186726A1
公开(公告)日：2012-07-26
申请号：US13014708
申请日：2011-01-26
申请人： JON-FWU HWU , Yung-Fu Wu , Kui-Chiang Liu
发明人： JON-FWU HWU , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： B29C65/48
CPC分类号： H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A method of filling and sealing a fluorescent layer in a slot space defined by two optical lenses and a partition ring is disclosed, in which a slot space is defined by two optical glasses and a partition frame having a partition ring on the inner wall surface. The partition frame is installed with two slots diametrically opposite to each other, and the slot space is evacuated to allow filling of a fluorescent material, and then the two slots are sealed so that the moisture is prevented from permeating into the fluorescent layer, and thus the optical performance can be maintained over a long period.
摘要翻译：公开了一种在由两个光学透镜和分隔环限定的狭槽空间中填充和密封荧光层的方法，其中槽空间由两个光学眼镜和在内壁表面上具有分隔环的分隔框架限定。分隔框架安装有两个彼此径向相对的槽，并且槽空间被抽真空以允许填充荧光材料，然后将两个槽密封，使得防止水分渗透到荧光层中，因此可以长时间保持光学性能。

7. 发明授权

US07161189B2 LED package including a frame 有权
标题翻译： LED封装包括一个框架
公开(公告)号：US07161189B2
公开(公告)日：2007-01-09
申请号：US11141023
申请日：2005-06-01
申请人： Yung-Fu Wu
发明人： Yung-Fu Wu
IPC分类号： H01L27/15
CPC分类号： H01L33/486 , H01L33/483 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/00012 , H01L2924/00014
摘要： A power LED package module includes a frame, a chip heat-conductive support, a light-emitting chip and a package body. The frame has a conductive pin, and a support separated from the conductive pin and connecting to the chip heat-conductive support. The light-emitting chip is arranged on the chip heat-conducting support and electrically connected to the conductive pin. The frame, the chip heat-conducting support and the light-emitting chip are packaged via the package body. The chip heat-conducting support is partially exposed out of the package body for connecting to a heat-dissipating element for increasing the efficiency of heat dissipation of the power LED package module. The power LED package module thus provides electrical conduction and heat conduction in a split manner.
摘要翻译：功率LED封装模块包括框架，芯片导热支架，发光芯片和封装体。框架具有导电引脚和与导电引脚分离并连接到芯片导热支撑件的支撑件。发光芯片布置在芯片导热支架上并电连接到导电引脚。框架，芯片导热支架和发光芯片经封装主体封装。芯片导热支撑件部分地暴露在封装主体外部，用于连接到散热元件，以提高功率LED封装模块的散热效率。因此，功率LED封装模块以分开的方式提供导电和热传导。

8. 发明授权

US08575645B2 Thin multi-layer LED array engine 有权
标题翻译：薄多层LED阵列引擎
公开(公告)号：US08575645B2
公开(公告)日：2013-11-05
申请号：US13301782
申请日：2011-11-22
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A thin multi-layer LED array engine is provided, which includes a substrate having a phosphor layer and a silica gel protection layer formed thereon. The phosphor layer is disposed on LED dices and makes direct contact with the substrate, and the silica gel protection layer is disposed on the phosphor layer. The LED dices are covered with the phosphor layer, and thereby the phosphor particles in the phosphor layer can be uniformly dispersed around the LED dices, so that the narrow color temperature distribution can be achieved. Furthermore, the phosphor layer makes direct contacts with the substrate, and thereby heat generated in the phosphor layer can be effectively dissipated through the substrate, and thereby the reliability of the optical components can be increased.
摘要翻译：提供了一种薄的多层LED阵列引擎，其包括在其上形成有荧光体层和硅胶保护层的基板。磷光体层设置在LED芯片上，与基板直接接触，硅胶保护层设置在荧光体层上。 LED芯片被荧光体层覆盖，从而荧光体层中的荧光体颗粒能够均匀地分散在LED芯片周围，从而可以实现窄的色温分布。此外，荧光体层与衬底直接接触，从而可以通过衬底有效地消散荧光体层中产生的热，从而可以提高光学部件的可靠性。

9. 发明申请

US20130283604A1 METHOD FOR MANUFACTURING INTEGRALLY FORMED MULTI-LAYER LIGHT-EMITTING DEVICE 有权
标题翻译：制造整体式多层发光装置的方法
公开(公告)号：US20130283604A1
公开(公告)日：2013-10-31
申请号：US13457833
申请日：2012-04-27
申请人： JON-FWU HWU , Yung-Fu Wu , Kui-Chiang Liu
发明人： JON-FWU HWU , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： F21V99/00
CPC分类号： F21V7/22 , F21K9/00 , F21K9/90 , F21V23/002 , F21V29/773 , F21Y2115/10 , Y10T29/49117
摘要： A method for manufacturing an integrally formed multi-layer light-emitting device is provided, in which a seat is integrally formed in such a manner that the light-emitting elements can be directly disposed in the chamber. The lens mask is used to seal the light-emitting elements in the chamber of the seat so that some packaging steps can be omitted, and the manufacturing process is simplified. The seat is made of metal having good thermal conductivity instead of plastic materials. The consumption of the package material is reduced, and the heat-dissipation efficiency is increased in the present invention.
摘要翻译：提供了一种制造整体形成的多层发光装置的方法，其中座椅一体地形成为使得发光元件可以直接设置在腔室中。透镜掩模用于密封座的腔室中的发光元件，使得可以省略一些包装步骤，并且简化了制造过程。座椅由金属制成，具有良好的导热性，而不是塑料材料。减少了包装材料的消耗，并且在本发明中增加了散热效率。

10. 发明授权

US08253330B2 Airtight multi-layer array type LED 有权
标题翻译：气密多层阵列式LED
公开(公告)号：US08253330B2
公开(公告)日：2012-08-28
申请号：US12957378
申请日：2010-11-30
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01J1/62
CPC分类号： F21V31/00 , F21K9/64 , F21V29/507 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/507 , H01L33/56 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： An airtight multi-layer array type LED is disclosed, which comprises a metal substrate with an airtight metal frame formed thereon, and the metal substrate is integrally formed with the airtight metal frame, and an airtight sealing frame slot is formed around the upper surface of the airtight metal frame, the airtight metal frame is installed with two sets of sealing through hole pairs accommodating the lead frames. The interior of the airtight metal frame can be installed with packaging materials or optical components. The sealing holes are sealed with a glass or ceramic material. A fluorescent layer is formed on a silica gel layer, wherein the fluorescent layer can also be installed inside a silica glass package cover. The silica glass package cover is installed on the top surface of the airtight metal frame, and the silica glass package cover is engaged and sealed to a sealing rack. Nitrogen is filled in a space defined between the silica glass package cover and the fluorescent layer, so that moisture is prevented from permeating through the airtight metal frame and a dice protection layer. As such, a sealed-type LED packaging structure is formed and is suitable to be used in extreme or severe environments.
摘要翻译：公开了一种气密的多层阵列型LED，其包括形成有气密金属框架的金属基板，并且金属基板与气密金属框架一体形成，并且气密密封框槽形成在气密金属框架，气密金属框架安装有两组容纳引线框架的密封通孔对。气密金属框架的内部可以安装包装材料或光学元件。密封孔用玻璃或陶瓷材料密封。在硅胶层上形成荧光层，其中荧光层也可以安装在石英玻璃封装盖的内部。石英玻璃封装盖安装在气密金属框架的顶表面上，石英玻璃封装盖接合并密封到密封架上。氮气填充在石英玻璃封装盖和荧光层之间的空间中，防止水分渗入气密金属框架和骰子保护层。因此，形成密封型LED封装结构，适用于极端或恶劣环境。

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