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    • 5. 发明授权
    • Substrate with through-holes for grid-like auxiliary wiring pattern
    • 基板具有栅格状辅助布线图案的通孔
    • US08530748B2
    • 2013-09-10
    • US13080269
    • 2011-04-05
    • Nobuhiro NakamuraYumiko AokiNaoya Wada
    • Nobuhiro NakamuraYumiko AokiNaoya Wada
    • H05K1/03
    • H01L51/5212H01L51/5268
    • A substrate includes an auxiliary wiring pattern formed on a first main surface of a glass substrate in a grid-like pattern arranged horizontally and vertically, and a translucent glass layer formed on a surface of the glass substrate to cover the first main surface and the auxiliary wiring pattern. Through-holes exposing the auxiliary wiring pattern are formed in a portion of the translucent glass layer formed on the auxiliary wiring pattern, in each side of each grid of the grid-like pattern at uniform intervals. The substrate may be used in an electronic device having a long-life and a high reliability in which exfoliation or deterioration of a wiring is inhibited by embedding the wiring therein while maintaining smoothness of the surface.
    • 基板包括形成在玻璃基板的第一主表面上的水平和垂直布置的格子状图案的辅助布线图案,以及形成在玻璃基板的表面上以覆盖第一主表面和辅助件的半透明玻璃层 接线图案。 露出辅助布线图案的通孔形成在形成在辅助布线图案上的半透明玻璃层的一部分中,网格状图案的每个网格的每一侧以均匀的间隔。 基板可以用在具有长寿命和高可靠性的电子器件中,其中通过在其中嵌入布线来抑制布线的剥离或劣化,同时保持表面的平滑度。