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    • 3. 发明授权
    • Method for generating optical tomographic information, optical tomographic information generating apparatus, and storage medium
    • 光学断层信息的生成方法,光学层析信息生成装置和存储介质
    • US08742371B2
    • 2014-06-03
    • US13145564
    • 2010-02-01
    • Hiroaki YamamotoYukio YamadaShinpei Okawa
    • Hiroaki YamamotoYukio YamadaShinpei Okawa
    • G01N21/64
    • A61B5/0073A61B5/1075A61B2503/40
    • Measurement data of intensities of fluorescence obtained by directing excitation light onto a subject is acquired. An initial value of an absorption coefficient of the phosphor is set on the basis of a concentration distribution of the phosphor, an intensity distribution of the fluorescence on the basis of an absorption coefficient and a diffusion coefficient (reduced scattering coefficient) of the subject, which are set beforehand, are calculated, and the measurement data is compared with the calculation result. If these are found not to be matched, an absorption coefficient of the phosphor at which the error will be a minimum is estimated by performing an inverse problem calculation using a mathematical model. The calculation of the intensity distribution of the fluorescence and evaluation of the error from the obtained concentration distribution are repeated using the absorption coefficient, and a concentration distribution for which the error is the minimum is acquired.
    • 获取通过将激发光引导到受试者上获得的荧光强度的测量数据。 基于荧光体的浓度分布,荧光的基于吸收系数的强度分布和扩散系数(降低的散射系数)来设定荧光体的吸收系数的初始值,其中, 预先设定,计算,并将测量数据与计算结果进行比较。 如果发现这些不匹配,则通过使用数学模型执行逆问题估计来估计误差将最小的磷光体的吸收系数。 使用吸收系数重复所得浓度分布的荧光强度分布的计算和误差的评价,求出误差为最小的浓度分布。
    • 4. 发明授权
    • Electrostatic coating apparatus
    • 静电涂装置
    • US08002208B2
    • 2011-08-23
    • US11909330
    • 2006-05-31
    • Yukio Yamada
    • Yukio Yamada
    • B05B5/00
    • B05B5/0533B05B5/04B05B5/0415B05B5/0426B05B15/50
    • A housing member includes a main housing body and an intermediate tube provided around the outer periphery of the main housing body. Located in a front portion of the main housing body is an atomizer including an air motor and a rotary atomizing head, while located in a rear portion of the main housing body is a high voltage generator to apply a high voltage to paint through the air motor. A multitude of hollow cavities are uniformly formed in the intermediate tube over the entire outer surface thereof by the use of through holes opened through the intermediate tube. A cover member is fitted on the outer surface of the intermediate tube in contact with the intermediate tube, thereby intensifying electric field strength in outer corner portions of the hollow cavities to prevent deposition of charged paint particles.
    • 壳体构件包括主壳体和设置在主壳体的外周周围的中间管。 位于主壳体的前部的是包括气动马达和旋转雾化头的雾化器,而位于主壳体的后部的是高压发生器,以通过气动马达施加高电压来涂装 。 通过使用通过中间管打开的通孔,在中间管的整个外表面上均匀地形成多个中空腔。 覆盖件安装在中间管的与中间管接触的外表面上,从而增强中空腔的外角部的电场强度,以防止带电涂料颗粒的沉积。
    • 5. 发明授权
    • Electrostatic coating apparatus
    • 静电涂装置
    • US07926443B2
    • 2011-04-19
    • US11571276
    • 2005-07-15
    • Yukio Yamada
    • Yukio Yamada
    • B05B5/025
    • B05B3/1035B05B5/0415B05B5/053
    • A current sensor for detecting a full return current is connected to a high voltage generator. A leakage current detector including current sensors for detecting a leakage current is provided at the surface of the cover of a coating machine, air passages and a paint passage. Based on current detection values obtained by the current sensors, a high voltage control unit controls a power supply voltage control unit and a high voltage to be output from the high voltage generator can be raised or dropped. By employing the current detection values, the high voltage control unit can identify and provide notification of a location where the leakage current is increased and the insulation is deteriorated, and can request an operator to perform maintenance for the pertinent location. Further, upon occurrence of the insulation being deteriorated, the high voltage control unit can stop the high voltage supply.
    • 用于检测全回流电流的电流传感器连接到高电压发生器。 在涂布机,空气通道和涂料通道的盖的表面设置有包括用于检测泄漏电流的电流传感器的漏电检测器。 基于由电流传感器获得的电流检测值,高压控制单元控制电源电压控制单元,并且可以提高或降低从高电压发生器输出的高电压。 通过采用电流检测值,高电压控制单元可以识别和提供泄漏电流增加并且绝缘劣化的位置的通知,并且可以请求操作者对相关位置进行维护。 此外,在发生绝缘劣化时,高电压控制单元可以停止高电压供应。
    • 7. 发明授权
    • Bumpless semiconductor device
    • 无铅半导体器件
    • US07638876B2
    • 2009-12-29
    • US11486075
    • 2006-07-14
    • Yukio YamadaMasayuki NakamuraHiroyuki Hishinuma
    • Yukio YamadaMasayuki NakamuraHiroyuki Hishinuma
    • H01L23/48
    • H01L21/563H01L21/4853H01L24/11H01L24/13H01L2224/05571H01L2224/05573H01L2224/11003H01L2224/11332H01L2224/13099H01L2224/131H01L2224/73203H01L2924/0001H01L2924/01004H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01029H01L2924/01033H01L2924/01078H01L2924/01079H01L2924/014H01L2924/07802H01L2924/07811H01L2924/14H01L2924/00015H01L2924/00H01L2224/05624H01L2924/00014
    • When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
    • 当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时,提供半导体器件而不在其上形成凸块,这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接,同时确保抑制短路 电路,降低连接成本,抑制接头处的应力集中,降低IC芯片或电路板的损坏。 无电解半导体器件在其表面上设置有电极焊盘2,并且在电极焊盘2的周围具有钝化膜3,并且导电颗粒4金属地结合到电焊盘2.复合颗粒,其中金属镀层 形成在树脂粒子表面的导电粒子4.这种无凸起的半导体器件可以通过(a)使导电粒子静电吸附在平板的一个面上来制造; 和(b)将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上,并且在电极焊盘的周围具有钝化膜, 并且超声波焊接该组件,使得导电颗粒被金属地结合并从平板转移到电极焊盘。