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1. 发明申请

US20120299794A1 ANTENNA APPARATUS 有权
标题翻译：天线装置
公开(公告)号：US20120299794A1
公开(公告)日：2012-11-29
申请号：US13476314
申请日：2012-05-21
申请人： Yuji Sugimoto , Tadao Suzuki , Ryohei Kataoka , Miyuki Mizoguchi
发明人： Yuji Sugimoto , Tadao Suzuki , Ryohei Kataoka , Miyuki Mizoguchi
IPC分类号： H01Q1/48
CPC分类号： H01Q1/3275 , H01Q3/247 , H01Q9/40 , H01Q21/245 , H01Q23/00
摘要： A wireless communication module is arranged such that a radio frequency circuit board stands vertically on a first earth plate. The radio frequency circuit board includes first and second radio frequency transmission and reception circuits at both end portions, respectively. The radio frequency circuit board includes a second earth plate serving as a grounding electric potential of the radio frequency transmission and reception circuits. Feed lines from the radio frequency transmission and reception circuits are connected to the first earth plate, respectively. Ground lines of the feed from the radio frequency transmission and reception circuits, respectively, are connected to the second earth plate. Thus, vertical exciting currents flow at both end portions of the second earth plane, enabling transmission and reception of vertical polarization waves.
摘要翻译：无线通信模块被布置成使得射频电路板垂直地搁置在第一接地板上。射频电路板分别在两端部包括第一和第二射频发送和接收电路。射频电路板包括用作射频发送和接收电路的接地电位的第二接地板。来自射频发送和接收电路的馈线分别连接到第一接地板。来自射频发送和接收电路的馈线的接地线分别连接到第二接地板。因此，垂直激磁电流在第二接地平面的两端部流动，能够发送和接收垂直极化波。

2. 发明授权

US08730123B2 Antenna apparatus 有权
标题翻译：天线装置
公开(公告)号：US08730123B2
公开(公告)日：2014-05-20
申请号：US13476314
申请日：2012-05-21
申请人： Yuji Sugimoto , Tadao Suzuki , Ryohei Kataoka , Miyuki Mizoguchi
发明人： Yuji Sugimoto , Tadao Suzuki , Ryohei Kataoka , Miyuki Mizoguchi
IPC分类号： H01Q21/00
CPC分类号： H01Q1/3275 , H01Q3/247 , H01Q9/40 , H01Q21/245 , H01Q23/00
摘要： A wireless communication module is arranged such that a radio frequency circuit board stands vertically on a first earth plate. The radio frequency circuit board includes first and second radio frequency transmission and reception circuits at both end portions, respectively. The radio frequency circuit board includes a second earth plate serving as a grounding electric potential of the radio frequency transmission and reception circuits. Feed lines from the radio frequency transmission and reception circuits are connected to the first earth plate, respectively. Ground lines of the feed from the radio frequency transmission and reception circuits, respectively, are connected to the second earth plate. Thus, vertical exciting currents flow at both end portions of the second earth plane, enabling transmission and reception of vertical polarization waves.
摘要翻译：无线通信模块被布置成使得射频电路板垂直地搁置在第一接地板上。射频电路板分别在两端部包括第一和第二射频发送和接收电路。射频电路板包括用作射频发送和接收电路的接地电位的第二接地板。来自射频发送和接收电路的馈线分别连接到第一接地板。来自射频发送和接收电路的馈线的接地线分别连接到第二接地板。因此，垂直激磁电流在第二接地平面的两端部流动，能够发送和接收垂直极化波。

3. 发明申请

US20060044735A1 Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device 有权
标题翻译：用于半导体器件的封装衬底，其制造方法和半导体器件
公开(公告)号：US20060044735A1
公开(公告)日：2006-03-02
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
IPC分类号： H05K1/00
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译：具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。

4. 发明授权

US07378745B2 Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns 有权
标题翻译：用于具有热塑性树脂层和导电图案的半导体器件的封装衬底
公开(公告)号：US07378745B2
公开(公告)日：2008-05-27
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/053 , H01L23/12 , H01L23/29
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译：具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。

5. 发明授权

US07323238B2 Printed circuit board having colored outer layer 失效
标题翻译：具有彩色外层的印刷电路板
公开(公告)号：US07323238B2
公开(公告)日：2008-01-29
申请号：US11232078
申请日：2005-09-22
申请人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
发明人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
IPC分类号： B32B3/00
CPC分类号： H05K3/4688 , H05K1/0269 , H05K1/0373 , H05K1/111 , H05K3/28 , H05K3/285 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0112 , H05K2201/0129 , H05K2203/161 , Y10T428/24917
摘要： In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
摘要翻译：在具有焊盘作为电极的印刷电路板中，在热塑性树脂部件的焊盘形成面上配置有色热塑性树脂膜，以将焊盘和着色热塑性树脂膜之间的光反射率设定为较大比土地和热塑性树脂构件之间的距离大。在有色热塑性树脂膜中设置有开口部，使得至少一部分接地部从开口部露出。由于着色热塑性树脂膜位于开口部分的圆周部分上，因此可以有效地增加焊盘相对于其周边部分的光反射率差异。因此，可以有效地提高土地的识别率。

6. 发明授权

US07031674B2 Radio terminal and fault detection method 失效
公开(公告)号：US07031674B2
公开(公告)日：2006-04-18
申请号：US10261154
申请日：2002-09-30
申请人： Ryohei Kataoka , Hisashi Takeshita , Hiroyuki Itazu , Mio Okamoto
发明人： Ryohei Kataoka , Hisashi Takeshita , Hiroyuki Itazu , Mio Okamoto
IPC分类号： H04B17/00
CPC分类号： H04W52/04 , H04W52/08 , H04W52/50 , H04W52/54
摘要： Method for detecting transmission power faults in cellular telephones without detecting transmission power. A microcomputer compares a criteria B with an absolute value |Pi−Pc| of the differential between initial transmission power value Pi and transmission power concentration value PC. A transmission power fault is determined to have occurred when the absolute value 51 Pi−Pc| is larger than criteria B (|Pi−Pc|>B), so transmission power faults can be detected without detecting the transmission power.

7. 发明申请

US20060068180A1 Printed board and manufacturing method thereof 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20060068180A1
公开(公告)日：2006-03-30
申请号：US11232078
申请日：2005-09-22
申请人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
发明人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
IPC分类号： B32B3/00 , B32B37/00
CPC分类号： H05K3/4688 , H05K1/0269 , H05K1/0373 , H05K1/111 , H05K3/28 , H05K3/285 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0112 , H05K2201/0129 , H05K2203/161 , Y10T428/24917
摘要： In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
摘要翻译：在具有焊盘作为电极的印刷电路板中，在热塑性树脂部件的焊盘形成面上配置有色热塑性树脂膜，以将焊盘和着色热塑性树脂膜之间的光反射率设定为较大比土地和热塑性树脂构件之间的距离大。在有色热塑性树脂膜中设置有开口部，使得至少一部分接地部从开口部露出。由于着色热塑性树脂膜位于开口部分的圆周部分上，因此可以有效地增加焊盘相对于其周边部分的光反射率差异。因此，可以有效地提高土地的识别率。

8. 发明授权

US06848178B2 Enhancement of current-carrying capacity of a multilayer circuit board 有权
标题翻译：增强多层电路板的载流能力
公开(公告)号：US06848178B2
公开(公告)日：2005-02-01
申请号：US10437041
申请日：2003-05-14
申请人： Koji Kondo , Ryohei Kataoka , Gentaro Masuda
发明人： Koji Kondo , Ryohei Kataoka , Gentaro Masuda
IPC分类号： H05K1/02 , H01L23/12 , H01L23/498 , H05K3/10 , H05K3/24 , H05K3/40 , H05K3/46 , H04K1/14
CPC分类号： H05K3/4632 , H01L23/498 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/09881 , Y10T29/49165 , H01L2924/00
摘要： A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating layer, a conductive compound, and a conductive pattern. The insulating layer has a trench. The conductive compound is located in the trench. The conductive pattern adjoins the trench and is electrically connected to the conductive compound. The conductive pattern and the conductive compound make up a conductive wire that has a higher current-carrying capacity than the conductive pattern.
摘要翻译：层叠有多个绝缘层和多个导体层的多层电路基板，其中，所述多个绝缘层和多个导体层包含导体图案，其中包括绝缘层，导电性化合物和导体图案。绝缘层具有沟槽。导电化合物位于沟槽中。导电图案与沟槽相邻并且与导电化合物电连接。导电图案和导电化合物组成导电线，其具有比导电图案更高的载流能力。

9. 发明授权

US4070257A Electrolytic process using novel diaphragm 失效
标题翻译：电解过程采用新型隔膜
公开(公告)号：US4070257A
公开(公告)日：1978-01-24
申请号：US653397
申请日：1976-01-29
申请人： Kensuke Motani , Shunji Matuura , Ryohei Kataoka
发明人： Kensuke Motani , Shunji Matuura , Ryohei Kataoka
IPC分类号： B01D39/20 , C25B13/04 , C25B13/06 , C25B13/08 , C25B1/26
CPC分类号： B01D69/02 , B01D39/2024 , B01D39/2048 , B01D39/2065 , B01D39/2089 , B01D69/141 , B01D69/148 , C25B13/04 , B01D2239/064 , B01D2239/086 , B01D2239/1258 , B01D71/32
摘要： An electrolytic process employing a diaphragm of a size of at least 1 cm in length in at least two directions, the diaphragm comprising a diaphragm base composed of fibers of fibrous structure containing inorganic fibers and a binder containing a fluorine-containing resin, the fluorine-containing resin being present in an amount of 0.5 - 60% by weight based on the weight of the diaphragm.
摘要翻译：一种使用长度至少为1cm的膜片至少两个方向的电解方法，所述隔膜包括由含有无机纤维的纤维结构纤维构成的隔膜基底和含有含氟树脂的粘合剂，含有树脂的含量为0.5-60重量％，基于隔膜的重量。

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