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1. 发明授权

US06403150B1 Heat-sensitive stencil and method of fabricating same 失效
标题翻译：热敏模板及其制造方法
公开(公告)号：US06403150B1
公开(公告)日：2002-06-11
申请号：US09610384
申请日：2000-07-05
申请人： Masayuki Ohta , Takehiko Iwaoka , Fumiaki Arai , Hiroshi Tateishi , Masanori Rimoto , Hideki Ono , Tetsuo Tanaka , Yuji Natori
发明人： Masayuki Ohta , Takehiko Iwaoka , Fumiaki Arai , Hiroshi Tateishi , Masanori Rimoto , Hideki Ono , Tetsuo Tanaka , Yuji Natori
IPC分类号： B41N124
CPC分类号： B32B37/24 , B32B2305/026 , B41C1/144 , B41N1/242 , B41N1/243 , Y10T428/24322 , Y10T428/24331 , Y10T428/24802 , Y10T428/249977 , Y10T428/249986
摘要： A heat-sensitive stencil having a thermoplastic resin film, and a porous resin layer formed thereon. The stencil has an air permeability in the range of 1.0 cm3/cm2·sec to 157 cm3/cm2·sec in a portion thereof when the thermoplastic resin film of the portion is perforated to form perforations providing an open ratio SO/SP of at least 0.2, wherein SO represents a total area of the perforations and SP represents the area of the portion. The heat-sensitive stencil is prepared by applying a coating liquid containing the resin of the porous resin layer to the thermoplastic resin film and drying the coating. The coating liquid contains a mixture of a good solvent and a poor solvent less vaporizable than the good solvent so that the porous resin layer is formed after drying.
摘要翻译：具有热塑性树脂膜的热敏模版和形成在其上的多孔树脂层。当该部分的热塑性树脂膜被穿孔时，模板的透气度在1.0cm 3 / cm 2·sec至157cm 3 / cm 2·sec的范围内，以形成提供至少为开放比SO / SP的穿孔 0.2，其中SO表示穿孔的总面积，SP表示该部分的面积。通过将含有多孔树脂层的树脂的涂布液涂布到热塑性树脂膜上并干燥该涂层来制备热敏模版。涂布液含有良溶剂和不良溶剂不良溶剂的混合物，从而在干燥后形成多孔树脂层。

2. 发明授权

US5843560A Heat-sensitive stencil and method of fabricating same 失效
公开(公告)号：US5843560A
公开(公告)日：1998-12-01
申请号：US738658
申请日：1996-10-30
申请人： Masayuki Ohta , Takehiko Iwaoka , Fumiaki Arai , Hiroshi Tateishi , Masanori Rimoto , Hideki Ono , Tetsuo Tanaka , Yuji Natori
发明人： Masayuki Ohta , Takehiko Iwaoka , Fumiaki Arai , Hiroshi Tateishi , Masanori Rimoto , Hideki Ono , Tetsuo Tanaka , Yuji Natori
IPC分类号： B32B37/24 , B41C1/14 , B41N1/24 , B05C17/06 , B32B3/24
CPC分类号： B32B37/24 , B41C1/144 , B41N1/242 , B41N1/243 , B32B2305/026 , Y10T428/24322 , Y10T428/24331 , Y10T428/24802 , Y10T428/249977 , Y10T428/249986
摘要： A heat-sensitive stencil having a thermoplastic resin film, and a porous resin layer formed thereon. The stencil has an air permeability in the range of 1.0 cm.sup.3 /cm.sup.2 .multidot.sec to 157 cm.sup.3 /cm.sup.2 .multidot.sec in a portion thereof when the thermoplastic resin film of the portion is perforated to form perforations providing an open ratio S.sub.O /S.sub.P of at least 0.2, wherein S.sub.O represents a total area of the perforations and S.sub.P represents the area of the portion. The heat-sensitive stencil is prepared by applying a coating liquid containing the resin of the porous resin layer to the thermoplastic resin film and drying the coating. The coating liquid contains a mixture of a good solvent and a poor solvent less vaporizable than the good solvent so that the porous resin layer is formed after drying.

3. 发明授权

US06889605B1 Heat-sensitive stencil, process of fabricating same and printer using same 有权
标题翻译：热敏模板，其制造过程和打印机使用相同
公开(公告)号：US06889605B1
公开(公告)日：2005-05-10
申请号：US09679747
申请日：2000-10-05
申请人： Yuji Natori , Fumiaki Arai , Masanori Rimoto , Tetsuo Tanaka , Hiroshi Tateishi
发明人： Yuji Natori , Fumiaki Arai , Masanori Rimoto , Tetsuo Tanaka , Hiroshi Tateishi
IPC分类号： B41N1/24
CPC分类号： B41N1/242 , Y10T428/24802
摘要： A heat-sensitive stencil including a resin film on which a thin resin layer and a porous resin layer are formed in succession.
摘要翻译：包括树脂膜的热敏模板，其上形成有薄树脂层和多孔树脂层。

4. 发明授权

US6096374A Heat-sensitive stencil and method of fabricating same 有权
标题翻译：热敏模板及其制造方法
公开(公告)号：US6096374A
公开(公告)日：2000-08-01
申请号：US138667
申请日：1998-08-24
申请人： Masayuki Ohta , Takehiko Iwaoka , Fumiaki Arai , Hiroshi Tateishi , Masanori Rimoto , Hideki Ono , Tetsuo Tanaka , Yuji Natori
发明人： Masayuki Ohta , Takehiko Iwaoka , Fumiaki Arai , Hiroshi Tateishi , Masanori Rimoto , Hideki Ono , Tetsuo Tanaka , Yuji Natori
IPC分类号： B32B37/24 , B41C1/14 , B41N1/24 , B41M3/12
CPC分类号： B32B37/24 , B41C1/144 , B41N1/242 , B41N1/243 , B32B2305/026 , Y10T428/24322 , Y10T428/24331 , Y10T428/24802
摘要： A heat-sensitive stencil having a thermoplastic resin film, and a porous resin layer formed thereon. The stencil has an air permeability in the range of 1.0 cm.sup.3 /cm.sup.2 .multidot.sec to 157 cm.sup.3 /cm.sup.2 .multidot.sec in a portion thereof when the thermoplastic resin film of the portion is perforated to form perforations providing an open ratio S.sub.O /S.sub.P of at least 0.2, wherein S.sub.O represents a total area of the perforations and S.sub.P represents the area of the portion. The heat-sensitive stencil is prepared by applying a coating liquid containing the resin of the porous resin layer to the thermoplastic resin film and drying the coating. The coating liquid contains a mixture of a good solvent and a poor solvent less vaporizable than the good solvent so that the porous resin layer is formed after drying.
摘要翻译：具有热塑性树脂膜的热敏模版和形成在其上的多孔树脂层。当该部分的热塑性树脂膜被穿孔以形成提供至少为0.2的开放比率SO / SP的穿孔时，该模版的透气度在1.0cm 3 / cm 2×sec至157cm 3 / cm 2·sec的范围内，其中SO 表示穿孔的总面积，SP表示该部分的面积。通过将含有多孔树脂层的树脂的涂布液涂布到热塑性树脂膜上并干燥该涂层来制备热敏模版。涂布液含有良溶剂和不良溶剂不良溶剂的混合物，从而在干燥后形成多孔树脂层。

5. 发明授权

US6092461A Heat-sensitive stencil, process of fabricating same and method of producing printing master using same 有权
标题翻译：热敏模板，其制造方法以及使用其制造印刷母版的方法
公开(公告)号：US6092461A
公开(公告)日：2000-07-25
申请号：US469537
申请日：1999-12-22
申请人： Tetsuo Tanaka , Hiroshi Tateishi , Fumiaki Arai , Masanori Rimoto , Hiroshi Adachi , Kohichi Ohshima
发明人： Tetsuo Tanaka , Hiroshi Tateishi , Fumiaki Arai , Masanori Rimoto , Hiroshi Adachi , Kohichi Ohshima
IPC分类号： B41C1/055 , B32B5/18 , B41C1/14 , B41N1/24
CPC分类号： B41N1/242 , B41C1/144 , B41N1/245 , Y10T428/24802
摘要： A heat-sensitive stencil including a porous support, and a thermoplastic resin film laminated on the support and having a surface smoothness of at least 10,000 seconds. The stencil is fabricated by bonding a thermoplastic resin film to a porous support with an adhesive having a specific viscosity and a specific volatile matter content, while maintaining each of the support and the film under a specific tension. The stencil may also be fabricated by applying a coating composition containing a resin and first and second solvents having a specific solubility and specific evaporation rates, and drying the applied composition to form a porous support. A printing master is produced by heating the above stencil imagewise by a thermal head with a heating energy of not greater than 0.05 mJ/dot.
摘要翻译：包括多孔载体的热敏模板和层压在载体上的表面平滑度至少为10,000秒的热塑性树脂膜。通过用具有特定粘度和特定挥发性物质含量的粘合剂将热塑性树脂膜粘合到多孔载体上，同时将每个载体和膜保持在特定张力下来制造模版。模板也可以通过涂布含有树脂的涂料组合物和具有特定溶解度和特定蒸发速率的第一溶剂和第二溶剂，并干燥所施加的组合物以形成多孔载体来制造。通过以不大于0.05mJ /点的加热能量的热头加热上述模版来制造印刷母版。

6. 发明授权

US5924360A Smooth stencil base sheet, method of producing a printing master from the stencil base sheet and method of performing stencil printing 失效
标题翻译：平滑模版基片，从模板基片制造印刷母版的方法和执行模版印刷的方法
公开(公告)号：US5924360A
公开(公告)日：1999-07-20
申请号：US867477
申请日：1997-06-02
申请人： Hiroshi Adachi , Kouichi Ohshima , Masanori Rimoto , Fumiaki Arai , Hiroshi Tateishi , Tetsuo Tanaka
发明人： Hiroshi Adachi , Kouichi Ohshima , Masanori Rimoto , Fumiaki Arai , Hiroshi Tateishi , Tetsuo Tanaka
IPC分类号： B41C1/14 , B41N1/24
CPC分类号： B41C1/144
摘要： A stencil base sheet includes a thermoplastic resin film, with a surface of the stencil base sheet on the side of the thermoplastic resin film having a surface smoothness of at least 6000 seconds. From this stencil base sheet, a printing master is prepared by use of a heat-emitting resistor with the application of electric signals thereto with pulse modulation corresponding to image recording density, thereby forming perforations of a different size corresponding to recording image density in the stencil base sheet by thermal fusing. Furthermore, a monochrome or multi-color stencil printing is performed by using the printing master.
摘要翻译：蜡纸底片包括热塑性树脂膜，其中在热塑性树脂膜侧面上的蜡纸基片的表面具有至少6000秒的表面平滑度。通过该模板基片，通过使用发射电阻器对其进行脉冲调制而对图像记录密度施加电脉冲来准备打印母版，从而形成与模板中的记录图像密度对应的不同大小的穿孔基片通过热熔。此外，通过使用打印母版来执行单色或多色模版印刷。

7. 发明授权

US6050183A Heat-sensitive stencil, process of fabricating same and method of producing printing master using same 失效
公开(公告)号：US6050183A
公开(公告)日：2000-04-18
申请号：US111436
申请日：1998-07-08
申请人： Tetsuo Tanaka , Hiroshi Tateishi , Fumiaki Arai , Masanori Rimoto , Hiroshi Adachi , Kohichi Ohshima
发明人： Tetsuo Tanaka , Hiroshi Tateishi , Fumiaki Arai , Masanori Rimoto , Hiroshi Adachi , Kohichi Ohshima
IPC分类号： B41C1/055 , B32B5/18 , B41C1/14 , B41N1/24
CPC分类号： B41N1/242 , B41C1/144 , B41N1/245 , Y10T428/24802
摘要： A heat-sensitive stencil including a porous support, and a thermoplastic resin film laminated on the support and having a surface smoothness of at least 10,000 seconds. The stencil is fabricated by bonding a thermoplastic resin film to a porous support with an adhesive having a specific viscosity and a specific volatile matter content, while maintaining each of the support and the film under a specific tension. The stencil may also be fabricated by applying a coating composition containing a resin and first and second solvents having a specific solubility and specific evaporation rates, and drying the applied composition to form a porous support. A printing master is produced by heating the above stencil imagewise by a thermal head with a heating energy of not greater than 0.05 mJ/dot.

8. 发明授权

US5813329A Printer for wrapping stencil around drum 失效
标题翻译：用于将钢板包裹在滚筒周围的打印机
公开(公告)号：US5813329A
公开(公告)日：1998-09-29
申请号：US469764
申请日：1995-06-06
申请人： Hiroshi Tateishi , Fumiaki Arai , Tetsuo Tanaka
发明人： Hiroshi Tateishi , Fumiaki Arai , Tetsuo Tanaka
IPC分类号： B41L13/04 , B41L13/06 , B41L13/14
CPC分类号： B41L13/06 , B41L13/04
摘要： In a printer using a stencil, a drum and a stencil feed and discharge unit are constructed integrally with each other. Hence, a stencil can be fed, cut by a thermal head, wrapped around the drum, and then discharged without being cut off. Even a stencil substantially implemented by a thermoplastic resin film, which is thin and soft, can be transported without being creased or otherwise deformed.
摘要翻译：在使用模板的打印机中，鼓和模版进给和排出单元彼此一体地构造。因此，可以将模板送入，用热头切割，缠绕在滚筒上，然后排出而不被切断。即使是由薄且软的热塑性树脂膜基本上实现的模板也可以被输送而不会变形或变形。

9. 发明授权

US5415090A Method for manufacturing a printing master using thermosensitive stencil paper 失效
标题翻译：使用热敏蜡纸制造印刷母版的方法
公开(公告)号：US5415090A
公开(公告)日：1995-05-16
申请号：US168228
申请日：1993-12-17
申请人： Yuji Natori , Hiroshi Tateishi
发明人： Yuji Natori , Hiroshi Tateishi
IPC分类号： B41C1/14 , B41C1/055
CPC分类号： B41C1/144
摘要： A method of manufacturing a printing master by forming perforations in a thermosensitive stencil paper. Thermal energy is applied by a thermal head to the stencil paper, the other side of the paper being free from contact with any other element at a location opposite the thermal head while thermal energy is applied.
摘要翻译：通过在热敏蜡纸中形成穿孔来制造印刷母版的方法。通过热头将热能施加到模板纸上，在施加热能的同时，纸的另一面在与热敏头相对的位置处与任何其它元件无接触。

10. 发明授权

US5417156A Thermal stencil plate making method 失效
标题翻译：热模板制版方法
公开(公告)号：US5417156A
公开(公告)日：1995-05-23
申请号：US127435
申请日：1993-09-27
申请人： Hiroshi Tateishi , Yuji Natori
发明人： Hiroshi Tateishi , Yuji Natori
IPC分类号： B41C1/14 , B41C1/055
CPC分类号： B41C1/144
摘要： A thermal stencil plate making method, by which a perforation image is formed on a thermal stencil original sheet comprising a thermoplastic resin film and a porous support laminated on each other or a thermal stencil original sheet composed substantially only of a thermoplastic resin film by applying thermal energy to the thermal stencil original sheet by means of a thermal head, is characterized in that a distance between heating elements in the thermal head: d (.mu.m) and a thickness of a heating element protection layer: T (.mu.m) satisfy the following condition of Equation (1) and that a secondary scan direction heating element spacing between heating elements in the thermal head: D (.mu.m) and the thickness of the heating element protection layer: T (.mu.m) satisfy the following condition of Equation (2):5.ltoreq.d/T (1);4.5.ltoreq.D/T (2).
摘要翻译：一种热模版印版制作方法，其中在热模版原稿上形成穿孔图像，所述热模板原稿片材包括热塑性树脂薄膜和彼此层压的多孔载体，或热模版原稿片基本上仅由热塑性树脂薄膜构成，其特征在于，热敏头中的加热元件之间的距离：d（μm）和加热元件保护层的厚度T（μm）满足：（1）的条件和热敏头中的加热元件之间的二次扫描方向加热元件间隔：D（μm）和加热元件保护层的厚度T（μm）满足以下等式的条件（2）：5

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