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1. 发明申请

US20090284276A1 PROBE CARD 有权
标题翻译：探针卡
公开(公告)号：US20090284276A1
公开(公告)日：2009-11-19
申请号：US12464916
申请日：2009-05-13
申请人： Yuichi TAGUCHI , Akinori Shiraishi , Masahiro Sunohara , Kei Murayama , Hideaki Sakaguchi
发明人： Yuichi TAGUCHI , Akinori Shiraishi , Masahiro Sunohara , Kei Murayama , Hideaki Sakaguchi
IPC分类号： G01R31/02
CPC分类号： G01R1/06716 , G01R1/06755 , G01R1/07314 , G01R3/00
摘要： A probe card is disclosed that includes a board having a first surface and a second surface facing away from each other and a through hole formed between the first and second surfaces; and a probe needle having a penetration part and a support part. The penetration part is placed in the through hole without contacting the board and projects from the first and second surfaces of the board. The support part is integrated with a first one of the end portions of the penetration part and connected to one of the first and second surfaces of the board. The support part has a spring characteristic. The penetration part is configured to have a second one of its end portions come into contact with an electrode pad of a semiconductor chip at the time of conducting an electrical test on the semiconductor chip.
摘要翻译：公开了一种探针卡，其包括具有第一表面和彼此背离的第二表面的板和形成在第一表面和第二表面之间的通孔; 以及具有穿透部和支撑部的探针。穿透部分放置在通孔中而不与板接触并从板的第一和第二表面突出。所述支撑部与所述贯通部的所述端部的第一端部一体化，且与所述基板的所述第一面和所述第二表面中的一个连接。支撑部分具有弹簧特性。穿透部被配置为在半导体芯片上进行电气测试时使其第二端部与半导体芯片的电极焊盘接触。

2. 发明申请

US20090081867A1 METHOD OF MANUFACTURING SUBSTRATE 有权
标题翻译：制造基板的方法
公开(公告)号：US20090081867A1
公开(公告)日：2009-03-26
申请号：US12233875
申请日：2008-09-19
申请人： Yuichi TAGUCHI , Akinori Shiraishi , Masahiro Sunohara , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
发明人： Yuichi TAGUCHI , Akinori Shiraishi , Masahiro Sunohara , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
IPC分类号： H01L21/44 , H01L21/302
CPC分类号： H01L33/486 , B81B2207/096 , B81C1/00301 , H01L24/97 , H01L33/62 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/12041 , H01L2924/15788 , H01L2224/81 , H01L2924/00 , H01L2224/05599
摘要： The present disclosure relates to a method of manufacturing a substrate. The method includes: (a) forming through holes by applying an anisotropic etching to a silicon substrate from a first surface of the silicon substrate; (b) forming a first insulating film to cover the first surface of the silicon substrate, surfaces of the silicon substrate exposed from the through holes, and a second surface of the silicon substrate opposite to the first surface; (c) forming an opening in a portion of the first insulating film provided on the second surface, the portion of the first insulating film corresponding to an area in which the through holes are formed; (d) etching the silicon substrate using the first insulating film provided on the second surface as a mask, thereby forming a cavity in the silicon substrate; and (e) removing the first insulating film.
摘要翻译：本公开涉及一种制造衬底的方法。该方法包括：（a）通过从硅衬底的第一表面向硅衬底施加各向异性蚀刻形成通孔; （b）形成第一绝缘膜以覆盖硅衬底的第一表面，从通孔露出的硅衬底的表面和与第一表面相对的硅衬底的第二表面; （c）在设置在第二表面上的第一绝缘膜的一部分中形成开口，第一绝缘膜的与形成通孔的区域相对应的部分; （d）使用设置在第二表面上的第一绝缘膜作为掩模蚀刻硅衬底，从而在硅衬底中形成空腔; 和（e）去除第一绝缘膜。

3. 发明申请

US20100038772A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20100038772A1
公开(公告)日：2010-02-18
申请号：US12535751
申请日：2009-08-05
申请人： Yuichi TAGUCHI , Mitsutoshi Higashi , Akinori Shiraishi , Hideaki Sakaguchi , Masahiro Sunohara
发明人： Yuichi TAGUCHI , Mitsutoshi Higashi , Akinori Shiraishi , Hideaki Sakaguchi , Masahiro Sunohara
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L23/481 , H01L21/6835 , H01L21/7682 , H01L21/76898 , H01L23/49822 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/6835 , H01L2221/68372 , H01L2224/02335 , H01L2224/0401 , H01L2224/05572 , H01L2224/13009 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/16 , H01L2224/81097 , H01L2224/81193 , H01L2224/81815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situated inside the penetration hole without contacting a wall of the penetration hole. The penetration electrode has one end fixed to the one surface of the semiconductor chip and an opposite end protruding from the opposite surface of the semiconductor chip. A connection terminal is formed on the opposite end of the penetration electrode and electrically connected to the wiring board.
摘要翻译：半导体封装包括布线板和安装在布线板上的半导体器件。至少一个穿透孔从半导体芯片的一个表面延伸到半导体芯片的相对表面。穿透电极位于穿透孔的内部，而不与穿透孔的壁接触。穿透电极具有固定在半导体芯片的一个表面上的一端和从半导体芯片的相对表面突出的相对端。连接端子形成在穿透电极的相对端并电连接到布线板。

4. 发明申请

US20100207218A1 ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电子元件装置及其制造方法
公开(公告)号：US20100207218A1
公开(公告)日：2010-08-19
申请号：US12704146
申请日：2010-02-11
申请人： Yuichi TAGUCHI , Akinori Shiraishi , Mitsutoshi Higashi , Kei Murayama
发明人： Yuichi TAGUCHI , Akinori Shiraishi , Mitsutoshi Higashi , Kei Murayama
IPC分类号： H01L29/84 , H05K3/30 , H01L21/50
CPC分类号： H01L23/13 , B81B7/007 , B81B2207/096 , H01L21/486 , H01L21/6835 , H01L23/147 , H01L23/49827 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2221/68345 , H01L2224/0401 , H01L2224/04042 , H01L2224/0558 , H01L2224/05599 , H01L2224/05644 , H01L2224/13023 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2224/81097 , H01L2224/8114 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/19041 , H01L2924/351 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing an electronic component device, includes the steps of preparing a wiring substrate, which includes a silicon substrate, a concave portion provided on its upper surface side, a through hole formed to penetrate the silicon substrate on a bottom surface side of the concave portion, an insulating layer formed on the silicon substrate, a penetration electrode constructed by a lower conductor portion formed to a halfway position of a height direction from a bottom portion of the through hole and a connection metal member (indium layer) formed on the lower conductor portion in the through hole, and an electronic component having a terminal metal member (gold bump) on a lower surface side, and softening the connection metal member of the wiring substrate in a heating atmosphere and then sticking the terminal metal member of the electronic component into the connection metal member and connecting thereto.
摘要翻译：一种电子部件装置的制造方法，其特征在于，包括：制作布线基板的步骤，所述布线基板包括硅基板，设置在其上表面侧的凹部，形成为贯通所述硅基板的通孔，形成在硅基板上的绝缘层，由形成在通孔的底部的高度方向的中途位置的下部导体部分构成的贯通电极，以及形成在该基板上的连接金属部件（铟层）通孔中的下导体部分和在下表面侧具有端子金属部件（金凸块）的电子部件，并且在加热气氛中软化接线基板的连接金属部件，然后将端子金属部件电子部件插入连接金属部件并与其连接。

5. 发明申请

US20100193939A1 WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING STRUCTURE 有权
标题翻译：接线基板，电子设备和电子设备安装结构
公开(公告)号：US20100193939A1
公开(公告)日：2010-08-05
申请号：US12686590
申请日：2010-01-13
申请人： Yuichi TAGUCHI , Akinori Shiraishi , Mitsutoshi Higashi
发明人： Yuichi TAGUCHI , Akinori Shiraishi , Mitsutoshi Higashi
IPC分类号： H01L23/48 , H01L23/488
CPC分类号： B81B7/0074 , H01L24/16 , H01L24/45 , H01L24/85 , H01L2224/16 , H01L2224/16235 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/78301 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H05K3/328 , H05K2201/10287 , H05K2201/10454 , H05K2201/10727 , H05K2201/10946 , H01L2924/00 , H01L2224/48
摘要： A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a penetration electrode formed in the through hole, a wiring layer formed on at least one surface of the silicon substrate and connected to the penetration electrode, and a metal wire terminal connected to the wiring layer and formed to extend from one surface of the silicon substrate to a side surface thereof. The metal wire terminal on the side surface of the electronic device is connected to the mounting substrate such that a substrate direction of the electronic device in which an electronic component is mounted on the wiring substrate intersects orthogonally with a substrate direction of the mounting substrate.
摘要翻译：布线基板包括硅基板，形成为在厚度方向上穿透硅基板的通孔，形成在硅基板的两个表面和侧表面上的绝缘层和通孔的内表面，形成在所述通孔，形成在所述硅衬底的至少一个表面上并连接到所述穿透电极的布线层和连接到所述布线层并形成为从所述硅衬底的一个表面延伸到其侧表面的金属线端子。电子装置的侧面上的金属线端子与安装基板连接，使得其中电子部件安装在布线基板上的电子装置的基板方向与安装基板的基板方向正交地交叉。

6. 发明申请

US20110272821A1 Wiring Substrate Manufacturing Method and Wiring Substrate 审中-公开
标题翻译：接线基板制造方法和接线基板
公开(公告)号：US20110272821A1
公开(公告)日：2011-11-10
申请号：US13098620
申请日：2011-05-02
申请人： Yuichi TAGUCHI , Akinori Shiraishi
发明人： Yuichi TAGUCHI , Akinori Shiraishi
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L21/6835 , H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/01078 , H01L2924/1461 , H01L2924/00
摘要： A wiring substrate manufactured by thinning a silicon substrate, which is coated by an insulation film, from a lower surface to an upper surface to form a substrate body. The substrate body is etched using a resist, which includes an opening, as a mask and the insulation film as an etching stopper layer to form a through hole and a cover, which covers an opening of the through hole at the upper surface of the substrate body. In a state in which the cover is formed, a functional element is formed on the upper surface of a further insulation film at the upper side of the substrate body. Then, a through electrode is formed in at least the through hole.
摘要翻译：通过将由绝缘膜涂覆的硅衬底从下表面变薄到上表面而制造的布线衬底以形成衬底本体。使用包括开口作为掩模的抗蚀剂和作为蚀刻停止层的绝缘膜以形成通孔和覆盖物的覆盖基板本体的上表面的通孔的蚀刻身体。在形成盖的状态下，在基板主体的上侧的另一绝缘膜的上表面上形成功能元件。然后，至少在通孔中形成贯通电极。

7. 发明申请

US20120086116A1 ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND WIRING SUBSTRATE 有权
标题翻译：电子元件装置，其制造方法和接线基板
公开(公告)号：US20120086116A1
公开(公告)日：2012-04-12
申请号：US13221064
申请日：2011-08-30
申请人： Yuichi TAGUCHI , Akinori Shiraishi , Mitsutoshi Higashi
发明人： Yuichi TAGUCHI , Akinori Shiraishi , Mitsutoshi Higashi
IPC分类号： H01L23/04 , H01L21/58 , H01L23/48
CPC分类号： H01L23/10 , B81B7/0048 , B81C2203/019 , H01L21/50 , H01L21/6835 , H01L23/055 , H01L23/13 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68372 , H01L2224/0401 , H01L2224/05644 , H01L2224/13109 , H01L2224/81191 , H01L2224/81192 , H01L2224/81203 , H01L2224/81409 , H01L2224/81444 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1461 , H01L2924/15788 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component whose connection electrode is connected to the electrode post, wherein the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post.
摘要翻译：一种电子部件装置，包括：基板，由金属材料制成的电极柱，设置在基板上，以及连接电极与电极柱连接的电子部件，其中，电子部件的连接电极和电极柱通过包含与电极柱的金属材料不同的金属的合金层连接。

8. 发明申请

US20100082935A1 COMPUTER SYSTEM AND CAPACITY MANAGEMENT METHOD OF COMPUTER SYSTEM 审中-公开
标题翻译：计算机系统的计算机系统和能力管理方法
公开(公告)号：US20100082935A1
公开(公告)日：2010-04-01
申请号：US12324909
申请日：2008-11-28
申请人： Toru TANAKA , Yuichi TAGUCHI , Noriko NAKAJIMA
发明人： Toru TANAKA , Yuichi TAGUCHI , Noriko NAKAJIMA
IPC分类号： G06F12/02 , G06F12/00
CPC分类号： H04L67/1097 , G06F11/3442 , G06F2201/88
摘要： It is necessary to install a program called an agent in order to keep track of how much a file system on a computer uses a disk. On this account, loads might be applied to a server due to installation work or the agent program to increase primary costs. In addition, software inside a storage device determines and records a target block for data input/output and keeps track of capacity utilization, which might degrade the input/output performance of the storage device. A computer system is provided in which configuration information and operating information are acquired from a storage device, when data input/output is made from a computer to a logical unit, it is determined that the computer uses the logical unit to which input/output is made, and capacity used by the computer is computed.
摘要翻译：有必要安装一个名为代理的程序，以便跟踪计算机上的文件系统使用多少磁盘。在此帐户中，由于安装工作或代理程序，负载可能会应用于服务器以增加主要成本。此外，存储设备内的软件确定并记录用于数据输入/输出的目标块，并跟踪容量利用率，这可能降低存储设备的输入/输出性能。提供了一种计算机系统，其中当从计算机向逻辑单元进行数据输入/输出时，从存储装置获取配置信息和操作信息，确定计算机使用输入/输出的逻辑单元计算出计算机使用的容量。

9. 发明申请

US20130262811A1 METHOD AND APPARATUS OF MEMORY MANAGEMENT BY STORAGE SYSTEM 审中-公开
标题翻译：存储系统存储管理的方法与装置
公开(公告)号：US20130262811A1
公开(公告)日：2013-10-03
申请号：US13430861
申请日：2012-03-27
申请人： Yuichi TAGUCHI
发明人： Yuichi TAGUCHI
IPC分类号： G06F12/06
CPC分类号： G06F9/5016
摘要： Exemplary embodiments provide high-speed memory devices such as high-speed DRAM resources in a storage system for external computers. In accordance with an aspect of the invention, a computer system comprises: a computer which includes an internal memory and an external memory, the external memory being provided by a storage system coupled to the computer; and a controller operable to manage a virtual memory space provided by the internal memory and the external memory. The controller is operable to add a logical unit provided by the storage system, to the external memory included in the virtual memory space, based on a usage level of the virtual memory space. The controller is operable to release a logical unit provided by the storage system, from the external memory included in the virtual memory space, based on the usage level of the virtual memory space.
摘要翻译：示例性实施例在用于外部计算机的存储系统中提供诸如高速DRAM资源的高速存储器件。根据本发明的一个方面，计算机系统包括：计算机，其包括内部存储器和外部存储器，所述外部存储器由耦合到所述计算机的存储系统提供; 以及控制器，其可操作以管理由所述内部存储器和所述外部存储器提供的虚拟存储器空间。控制器可操作以基于虚拟存储器空间的使用级别将由存储系统提供的逻辑单元添加到虚拟存储器空间中包括的外部存储器。控制器可操作以基于虚拟存储器空间的使用级别从包括在虚拟存储器空间中的外部存储器释放由存储系统提供的逻辑单元。

10. 发明申请

US20120246205A1 EFFICIENT DATA STORAGE METHOD FOR MULTIPLE FILE CONTENTS 审中-公开
标题翻译：多文件内容的有效数据存储方法
公开(公告)号：US20120246205A1
公开(公告)日：2012-09-27
申请号：US13069847
申请日：2011-03-23
申请人： Yuichi TAGUCHI
发明人： Yuichi TAGUCHI
IPC分类号： G06F17/30
CPC分类号： G06F3/0685 , G06F3/061 , G06F3/0643 , G06F16/1752
摘要： Embodiments of the invention provide efficient data storage for multiple file contents. In specific embodiments, a content management computer is coupled via a network to a storage system, and comprises a processor, a memory, and a content compose/decompose module. The content compose/decompose module is configured to: decompose a file into multiple parts of data and store the multiple parts into adaptive logical storage partitions; and in response to a read request for the file, re-compose the multiple parts into an original file and send the original file. The file is decomposed into the multiple parts based on both structure and characteristics of the data in the file. The multiple parts are stored into different media provided by the adaptive logical storage partitions according to the structure and characteristics of the data in the multiple parts.
摘要翻译：本发明的实施例为多个文件内容提供有效的数据存储。在具体实施例中，内容管理计算机经由网络耦合到存储系统，并且包括处理器，存储器和内容撰写/分解模块。内容组合/分解模块被配置为：将文件分解成数据的多个部分并将多个部分存储到自适应逻辑存储分区中; 并且响应于对文件的读取请求，将多个部分重新组合成原始文件并发送原始文件。基于文件中的数据的结构和特征，将文件分解成多个部分。根据多部分数据的结构和特点，将多个部分存储到由自适应逻辑存储分区提供的不同媒体中。

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