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1. 发明授权

US08143608B2 Package-on-package (POP) optical proximity sensor 有权
标题翻译：封装封装（POP）光学接近传感器
公开(公告)号：US08143608B2
公开(公告)日：2012-03-27
申请号：US12557516
申请日：2009-09-10
申请人： Yufeng Yao , Chi Boon Ong
发明人： Yufeng Yao , Chi Boon Ong
IPC分类号： H01J40/14 , H01L31/09
CPC分类号： G01S17/026 , G01S7/4813 , G01S17/48 , H01L25/167 , H01L31/0203 , H01L31/173 , H01L2224/48465 , H01L2924/3025 , H03K17/941 , H03K2217/94108 , H01L2924/00
摘要： Various embodiments of a package-on-package optical sensor comprising three distinct different packages are disclosed. The three different packages are combined to form the optical proximity sensor, where the first package is a light emitter package, the second package is a light detector package, and the third package is an integrated circuit package. First and second infrared light pass components are molded or casted atop the light emitter package and the light detector package after they have been mounted atop the integrated circuit package. An infrared light cut component is then molded or casted between and over portions of the light emitter package and the light detector package.
摘要翻译：公开了包括三个不同的封装的封装封装的光学传感器的各种实施例。三个不同的组合被组合以形成光学接近传感器，其中第一封装是光发射器封装，第二封装是光检测器封装，第三封装是集成电路封装。第一和第二红外光通过部件在它们被安装在集成电路封装之上之后被模制或铸造在光发射器封装和光检测器封装之上。然后将红外光切割部件模制或铸造在光发射器封装和光检测器封装的部分之间。

2. 发明授权

US08558161B2 Lens having multiple conic sections for LEDs and proximity sensors 有权
标题翻译：透镜具有用于LED和接近传感器的多个圆锥截面
公开(公告)号：US08558161B2
公开(公告)日：2013-10-15
申请号：US12853566
申请日：2010-08-10
申请人： Chi Boon Ong , Yufeng Yao , Sze Ping Ong
发明人： Chi Boon Ong , Yufeng Yao , Sze Ping Ong
IPC分类号： H01J3/14
CPC分类号： H01L33/58 , G02B3/02 , G02B19/0028 , G02B19/0061 , G02B19/0071 , G02B19/008 , H01L25/167 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A lens element comprising a base, a plurality of lens sections and a top lens section is disclosed. The plurality of lens sections are formed above a planar parallel to the base with each of the lens sections being positioned rotationally symmetric about an optical axis. The lens sections define a dome shape with every adjoining lens sections being conjugated with each other. A top lens section is formed at the center above the other lens sections and conjugated therewith. All of the lens sections are conjugated with each of its neighboring lens sections. Each of the lens sections has a optical property to direct light towards a target point. The target point may be positioned along the optical axis.
摘要翻译：公开了一种包括基座，多个透镜部分和顶部透镜部分的透镜元件。多个透镜部分形成在平行于基部的平面上方，每个透镜部分围绕光轴旋转对称。透镜部分限定圆顶形状，每个相邻的透镜部分彼此共轭。顶透镜部分形成在其它透镜部分上方的中心并与之共轭。所有透镜部分与其相邻透镜部分中的每一个共轭。每个透镜部分具有将光引向目标点的光学性质。目标点可以沿着光轴定位。

3. 发明授权

US08232883B2 Optical proximity sensor with improved shield and lenses 有权
标题翻译：带有改进的屏蔽和透镜的光学接近传感器
公开(公告)号：US08232883B2
公开(公告)日：2012-07-31
申请号：US12631793
申请日：2009-12-04
申请人： Yufeng Yao , Chi Boon Ong , Sze Ping Ong
发明人： Yufeng Yao , Chi Boon Ong , Sze Ping Ong
IPC分类号： G08B17/12
CPC分类号： G01J1/02 , G01J1/0214 , G01J1/0271 , H03K17/945
摘要： Various embodiments of an optical sensor comprising a novel shield that may be quickly and accurately aligned and positioned with respect to an underlying light emitting and light detecting assembly are disclosed. Also disclosed are novel lens arrangements for efficiently collimating light emitted and received by the optical proximity sensor, and for reducing crosstalk.
摘要翻译：公开了包括可以相对于下面的发光和光检测组件快速且准确地对准和定位的新型屏蔽的光学传感器的各种实施例。还公开了用于有效地准直由光学接近传感器发射和接收的光并且用于减少串扰的新型透镜装置。

4. 发明申请

US20120037793A1 LENS HAVING MULTIPLE CONIC SECTIONS FOR LEDS AND PROXIMITY SENSORS 有权
标题翻译：具有LED和接近传感器的多个连续部分的镜头
公开(公告)号：US20120037793A1
公开(公告)日：2012-02-16
申请号：US12853566
申请日：2010-08-10
申请人： Chi Boon Ong , Yufeng Yao , Sze Ping Ong
发明人： Chi Boon Ong , Yufeng Yao , Sze Ping Ong
IPC分类号： H01J3/14 , F21V5/00
CPC分类号： H01L33/58 , G02B3/02 , G02B19/0028 , G02B19/0061 , G02B19/0071 , G02B19/008 , H01L25/167 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A lens element comprising a base, a plurality of lens sections and a top lens section is disclosed. The plurality of lens sections are formed above a planar parallel to the base with each of the lens sections being positioned rotationally symmetric about an optical axis. The lens sections define a dome shape with every adjoining lens sections being conjugated with each other. A top lens section is formed at the center above the other lens sections and conjugated therewith. All of the lens sections are conjugated with each of its neighboring lens sections. Each of the lens sections has a optical property to direct light towards a target point. The target point may be positioned along the optical axis.
摘要翻译：公开了一种包括基座，多个透镜部分和顶部透镜部分的透镜元件。多个透镜部分形成在平行于基部的平面上方，每个透镜部分围绕光轴旋转对称。透镜部分限定圆顶形状，每个相邻的透镜部分彼此共轭。顶透镜部分形成在其它透镜部分上方的中心并与之共轭。所有透镜部分与其相邻透镜部分中的每一个共轭。每个透镜部分具有将光引向目标点的光学性质。目标点可以沿着光轴定位。

5. 发明授权

US08716665B2 Compact optical proximity sensor with ball grid array and windowed substrate 有权
标题翻译：紧凑型光学接近传感器，带球栅阵列和开窗基板
公开(公告)号：US08716665B2
公开(公告)日：2014-05-06
申请号：US12557438
申请日：2009-09-10
申请人： Yufeng Yao , Chi Boon Ong , Wee Sin Tan
发明人： Yufeng Yao , Chi Boon Ong , Wee Sin Tan
IPC分类号： G01J5/00 , G01J5/02 , G01J5/04
CPC分类号： H01L31/173 , G01S7/4813 , G01S17/026 , G01S17/48 , H01L25/167 , H01L31/0203 , H01L2224/48091 , H01L2924/3025 , H03K17/941 , H03K2017/9455 , H01L2924/00014 , H01L2924/00
摘要： Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components.
摘要翻译：公开了具有球栅阵列和窗口或有孔基板的紧凑型光学接近传感器的各种实施例。在一个实施例中，光学接近传感器包括印刷电路板（“PCB”）基板，其包括孔和设置在其上的电触点的下表面，安装在基板的上表面上的红外光发射器和红外光检测器，至少部分位于孔内的集成电路，设置在集成电路和衬底的部分之间的模制化合物，安装在集成电路的上表面上的环境光检测器，设置在其上的第一和第二模制红外光通过部件，分别覆盖红外光发射器和红外光检测器，以及设置在第一和第二红外光通过部件的部分之间的模制的红外光切割部件。

6. 发明申请

US20120086018A1 PACKAGE-ON-PACKAGE PROXIMITY SENSOR MODULE 有权
标题翻译：封装接近传感器模块
公开(公告)号：US20120086018A1
公开(公告)日：2012-04-12
申请号：US12901037
申请日：2010-10-08
申请人： Yufeng Yao , Chi Boon Ong , Chee Heng Wong
发明人： Yufeng Yao , Chi Boon Ong , Chee Heng Wong
IPC分类号： H01L31/167 , H01L31/0232 , H01L31/0216
CPC分类号： H01L31/0203 , G01S7/4813 , H01L31/02325 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/4917 , H01L2924/00014 , H01L2924/00
摘要： A package-on-package proximity sensor module including a infrared transmitter package and a infrared receiver package is presented. The proximity sensor module may include a fully-assembled infrared transmitter package and a fully-assembled infrared receiver package disposed on a quad flat pack no-lead (QFN) lead frame molded with an IR cut compound housing. A bottom surface of the QFN lead frame may be etched and covered with the IR cut compound to provide a locking feature between the QFN lead frame and the IR cut compound housing.
摘要翻译：提供了包括红外发射器封装和红外接收器封装的封装封装间接近传感器模块。接近传感器模块可以包括完全组装的红外发射器封装和设置在用IR切割复合壳体模制的四边形扁平封装无铅（QFN）引线框架上的完全组装的红外接收器封装。 QFN引线框架的底表面可以被蚀刻并被IR切割的化合物覆盖，以在QFN引线框架和IR切割复合壳体之间提供锁定特征。

7. 发明申请

US20110057129A1 Package-on-Package (POP) Optical Proximity Sensor 有权
标题翻译：封装封装（POP）光学接近传感器
公开(公告)号：US20110057129A1
公开(公告)日：2011-03-10
申请号：US12557516
申请日：2009-09-10
申请人： Yufeng Yao , Chi Boon Ong
发明人： Yufeng Yao , Chi Boon Ong
IPC分类号： H01L31/09 , H01L31/0232 , H01L31/18 , H01L33/00
CPC分类号： G01S17/026 , G01S7/4813 , G01S17/48 , H01L25/167 , H01L31/0203 , H01L31/173 , H01L2224/48465 , H01L2924/3025 , H03K17/941 , H03K2217/94108 , H01L2924/00
摘要： Various embodiments of a package-on-package optical sensor comprising three distinct different packages are disclosed. The three different packages are combined to form the optical proximity sensor, where the first package is a light emitter package, the second package is a light detector package, and the third package is an integrated circuit package. First and second infrared light pass components are molded or casted atop the light emitter package and the light detector package after they have been mounted atop the integrated circuit package. An infrared light cut component is then molded or casted between and over portions of the light emitter package and the light detector package.
摘要翻译：公开了包括三个不同的封装的封装封装的光学传感器的各种实施例。三个不同的组合被组合以形成光学接近传感器，其中第一封装是光发射器封装，第二封装是光检测器封装，第三封装是集成电路封装。第一和第二红外光通过部件在它们被安装在集成电路封装之上之后被模制或铸造在光发射器封装和光检测器封装之上。然后将红外光切割部件模制或铸造在光发射器封装和光检测器封装的部分之间。

8. 发明授权

US08937377B2 Package-on-package proximity sensor module 有权
标题翻译：封装封装接近传感器模块
公开(公告)号：US08937377B2
公开(公告)日：2015-01-20
申请号：US12901037
申请日：2010-10-08
申请人： Yufeng Yao , Chi Boon Ong , Chee Heng Wong
发明人： Yufeng Yao , Chi Boon Ong , Chee Heng Wong
IPC分类号： H01L31/167 , H01L31/0203 , G01S7/481 , H01L31/0232
CPC分类号： H01L31/0203 , G01S7/4813 , H01L31/02325 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/4917 , H01L2924/00014 , H01L2924/00
摘要： A package-on-package proximity sensor module including a infrared transmitter package and a infrared receiver package is presented. The proximity sensor module may include a fully-assembled infrared transmitter package and a fully-assembled infrared receiver package disposed on a quad flat pack no-lead (QFN) lead frame molded with an IR cut compound housing. A bottom surface of the QFN lead frame may be etched and covered with the IR cut compound to provide a locking feature between the QFN lead frame and the IR cut compound housing.
摘要翻译：提供了包括红外发射器封装和红外接收器封装的封装封装间接近传感器模块。接近传感器模块可以包括完全组装的红外发射器封装和设置在用IR切割复合壳体模制的四边形扁平封装无铅（QFN）引线框架上的完全组装的红外接收器封装。 QFN引线框架的底表面可以被蚀刻并被IR切割的化合物覆盖，以在QFN引线框架和IR切割复合壳体之间提供锁定特征。

9. 发明授权

US08350216B2 Miniaturized optical proximity sensor 有权
标题翻译：小型化光学接近传感器
公开(公告)号：US08350216B2
公开(公告)日：2013-01-08
申请号：US12631804
申请日：2009-12-04
申请人： Yufeng Yao , Chi Boon Ong , Wee Sin Tan
发明人： Yufeng Yao , Chi Boon Ong , Wee Sin Tan
IPC分类号： G01J5/02
CPC分类号： G01J1/32 , G01J1/44 , H01L2224/48465 , H01L2924/3025 , Y10T29/49126 , H01L2924/00
摘要： Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, a light emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.
摘要翻译：公开了一种小型化光学接近传感器的各种实施例。在一个实施例中，环境光传感器和光检测器安装在第一和第二间隔件上，第一和第二间隔件依次安装到附接到基板的集成电路芯片的顶表面。在环境光传感器，光检测器，集成电路，光发射器和衬底的周边部分上模制光学透射的红外线通过化合物。接下来，将光学上不透光的红外线切割化合物模制在光学透射的红外线通过化合物上，以提供不具有金属屏蔽但呈现非常低的串扰特性的小型化的光学接近传感器。

10. 发明申请

US20110133941A1 Optical Proximity Sensor with Improved Shield and Lenses 有权
标题翻译：具有改进的屏蔽和镜头的光学接近传感器
公开(公告)号：US20110133941A1
公开(公告)日：2011-06-09
申请号：US12631793
申请日：2009-12-04
申请人： Yufeng Yao , Chi Boon Ong , Sze Ping Ong
发明人： Yufeng Yao , Chi Boon Ong , Sze Ping Ong
IPC分类号： G08B17/12 , G01J5/00 , H01J40/14
CPC分类号： G01J1/02 , G01J1/0214 , G01J1/0271 , H03K17/945
摘要： Various embodiments of an optical sensor comprising a novel shield that may be quickly and accurately aligned and positioned with respect to an underlying light emitting and light detecting assembly are disclosed. Also disclosed are novel lens arrangements for efficiently collimating light emitted and received by the optical proximity sensor, and for reducing crosstalk.
摘要翻译：公开了包括可以相对于下面的发光和光检测组件快速且准确地对准和定位的新型屏蔽的光学传感器的各种实施例。还公开了用于有效地准直由光学接近传感器发射和接收的光并且用于减少串扰的新型透镜装置。

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