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    • 3. 发明申请
    • RESISTIVE MEMORY AND PROGRAM VERIFICATION METHOD THEREOF
    • 电阻记忆和程序验证方法
    • US20130051119A1
    • 2013-02-28
    • US13340467
    • 2011-12-29
    • Heng-Yuan LEEYu-Sheng Chen
    • Heng-Yuan LEEYu-Sheng Chen
    • G11C11/00
    • G11C13/0002G11C13/0007G11C13/0064G11C13/0069G11C2013/0071G11C2213/79
    • A resistive memory including a transistor and a variable resistor is disclosed. The transistor includes a gate, a source and a drain. The variable resistor is coupled between the drain and a node. During a setting period, the gate receives a first gate voltage, the source receives a first source voltage, the node receives a first drain voltage, and the first source voltage is equal to a grounding voltage. After the setting period, if a resistance value of the variable resistor is not less than a first pre-determined value, a first verification operation is performed. When the first verification operation is being performed, the gate receives a second gate voltage, the node receives a second drain voltage less than the first drain voltage, and the source receives a second source voltage equal to the grounding voltage.
    • 公开了一种包括晶体管和可变电阻器的电阻存储器。 晶体管包括栅极,源极和漏极。 可变电阻耦合在漏极和节点之间。 在设定期间,栅极接收第一栅极电压,源极接收第一源电压,节点接收第一漏极电压,第一源极电压等于接地电压。 在设定期间后,如果可变电阻器的电阻值不小于第一预定值,则执行第一验证操作。 当执行第一验证操作时,门接收第二栅极电压,节点接收小于第一漏极电压的第二漏极电压,并且源接收等于接地电压的第二源极电压。
    • 4. 发明申请
    • METHOD FOR FORMING CAPACITOR IN DYNAMIC RANDOM ACCESS MEMORY
    • 在动态随机存取存储器中形成电容器的方法
    • US20090191685A1
    • 2009-07-30
    • US12179996
    • 2008-07-25
    • Heng-Yuan LEEChing-Chiun WANGTai-Yuan WU
    • Heng-Yuan LEEChing-Chiun WANGTai-Yuan WU
    • H01L21/334
    • H01L28/91H01L27/10817H01L27/10852H01L27/10855
    • A method for forming a capacitor in a dynamic random access memory, comprising steps of: providing a semiconductor substrate having at least a transistor, whereon an interlayer dielectric layer having at least a first plug is formed so that the first plug is connected to the drain of the transistor; depositing an etching stop layer on the first plug and the interlayer dielectric layer; depositing a first insulating layer on the etching stop layer; forming at least a second plug on the first insulating layer and the etching stop layer so that the second plug is connected to the first plug; depositing a second insulating layer on the first insulating layer and the second plug; forming at least a mold cavity in the second insulating layer so that the aperture of the mold cavity is larger than the diameter of the second plug and there is a deviation between the mold cavity and the second plug; removing the first insulating layer in the mold cavity until the etching stop layer; depositing a first electrode layer to cover the second insulating layer, a sidewall portion of the mold cavity, the second plug and the etching stop layer; removing the second insulating layer so that the first electrode layer forms a single open-ended cavity; and depositing a dielectric layer and a second electrode layer.
    • 一种用于在动态随机存取存储器中形成电容器的方法,包括以下步骤:提供至少具有晶体管的半导体衬底,其中形成至少具有第一插塞的层间介电层,使得第一插头连接到漏极 的晶体管; 在所述第一插塞和所述层间电介质层上沉积蚀刻停止层; 在所述蚀刻停止层上沉积第一绝缘层; 在所述第一绝缘层和所述蚀刻停止层上形成至少第二插头,使得所述第二插头连接到所述第一插头; 在第一绝缘层和第二插塞上沉积第二绝缘层; 在所述第二绝缘层中至少形成模腔,使得所述模腔的孔径大于所述第二插塞的直径,并且所述模腔和所述第二插塞之间存在偏差; 去除模腔中的第一绝缘层直到蚀刻停止层; 沉积第一电极层以覆盖第二绝缘层,模腔的侧壁部分,第二插塞和蚀刻停止层; 去除第二绝缘层,使得第一电极层形成单个开口腔; 以及沉积介电层和第二电极层。