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    • 1. 发明申请
    • ELECTRONIC DEVICE WITH A MOTHERBOARD WATERPROOFING MECHANISM
    • 具有母板防水机构的电子设备
    • US20100328906A1
    • 2010-12-30
    • US12578698
    • 2009-10-14
    • Yu-Han TSAIChun-Wang LINYu-Hsien HUANGChi-Jen LOFeng-Hsiung WU
    • Yu-Han TSAIChun-Wang LINYu-Hsien HUANGChi-Jen LOFeng-Hsiung WU
    • H05K5/00
    • H05K5/061
    • An electronic device includes: first and second housing bodies cooperating to form an inner receiving space; a motherboard disposed in the inner receiving space, partitioned by a partition line into a port zone having at least one input/output connector, and a non-port zone; first and second waterproof strips disposed respectively between the first housing body and the motherboard and between the second housing body and the motherboard, and disposed at the partition line, the second waterproof strip having opposite ends formed with respective extension parts extending perpendicularly toward the first waterproof strip and disposed at the peripheral edge of the motherboard; and a third waterproof strip connected to the first waterproof strip to form a closed seal ring therewith, disposed between the first and second housing bodies, and disposed at an outer side of a peripheral edge of the non-port zone.
    • 电子设备包括:第一和第二壳体,配合形成内接收空间; 设置在内部接收空间中的主板,由分隔线划分成具有至少一个输入/输出连接器的端口区域和非端口区域; 第一和第二防水条分别设置在第一壳体和母板之间以及第二壳体和主板之间,并且设置在分隔线处,第二防水条带具有相对的端部,其形成有相应的延伸部分,其垂直于第一防水 剥离并设置在母板的周边边缘; 以及第三防水条,其连接到所述第一防水条以与其形成封闭的密封环,设置在所述第一和第二壳体之间,并且设置在所述非端口区的外围边缘的外侧。