专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US6043165A Methods of forming electrically interconnected lines using ultraviolet radiation as an organic compound cleaning agent 失效
标题翻译：使用紫外线辐射作为有机化合物清洗剂形成电互连线的方法
公开(公告)号：US6043165A
公开(公告)日：2000-03-28
申请号：US890578
申请日：1997-07-09
申请人： Young-hun Park , Sung-hoon Ko , Jong-seob Lee
发明人： Young-hun Park , Sung-hoon Ko , Jong-seob Lee
IPC分类号： H01L21/3205 , H01L21/3105 , H01L21/311 , H01L21/768 , H01L23/522 , H01L21/31 , H01L21/469
CPC分类号： H01L21/31055 , H01L21/31133 , Y10S438/94 , Y10S438/963
摘要： Methods of forming electrically interconnected lines using organic compound cleaning agents include the steps of forming a first electrically conductive line on a substrate and then forming a first electrically insulating layer on the first electrically conductive line to electrically isolate the first conductive line from adjacent regions and lines. An organic spin-on-glass (SOG) passivation layer is then formed as a planarization layer on the first electrically insulating layer. The organic SOG layer is then etched-back to define a first etched surface thereon, using a carbon-fluoride gas which also preferably contains argon. The organic SOG layer may even be sufficiently etched back to expose an upper surface of the first electrically insulating layer. The first etched surface is then exposed to an organic compound cleaning agent so that organic residues can be removed from the etched surface so that layers subsequently formed on the etched surface are less susceptible to lift-off and flaking. The organic compound cleaning agents preferably consist of ultraviolet radiation and/or an oxygen containing plasma. After the first etched surface has been cleaned, the first electrically insulating layer is patterned to define a via therein which exposes an underlying portion of the first electrically conductive line. A second electrically conductive line (e.g., second level metallization) is then preferably formed in ohmic contact with the exposed portions of the first electrically conductive line and the ohmic contact therebetween is preferably free of organic residues which might adversely affect contact reliability and resistance.
摘要翻译：使用有机化合物清洁剂形成电互连线的方法包括以下步骤：在衬底上形成第一导电线，然后在第一导电线上形成第一电绝缘层，以将第一导电线与相邻区域和线电隔离。然后在第一电绝缘层上形成有机旋涂玻璃（SOG）钝化层作为平坦化层。然后使用也优选含有氩的氟化碳气体将有机SOG层回蚀刻以限定其上的第一蚀刻表面。有机SOG层甚至可以被充分地回蚀刻以暴露第一电绝缘层的上表面。然后将第一蚀刻表面暴露于有机化合物清洁剂，使得可以从蚀刻表面除去有机残留物，使得随后在蚀刻表面上形成的层不易剥离和剥落。有机化合物清洗剂优选由紫外线辐射和/或含氧等离子体组成。在第一蚀刻表面已经被清洁之后，第一电绝缘层被图案化以限定其中暴露第一导电线的下面部分的通孔。优选地，第二导电线（例如，第二级金属化）与第一导电线的暴露部分欧姆接触形成，并且其之间的欧姆接触优选不含可能不利地影响接触可靠性和电阻的有机残余物。

IPRDB

热门服务

关于我们

友情链接

联系方式