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1. 发明申请

US20130098768A1 ELECTRODEPOSITION OF GRAPHENE LAYER FROM DOPED GRAPHITE 有权
标题翻译：从石墨层析出石墨层的电沉积
公开(公告)号：US20130098768A1
公开(公告)日：2013-04-25
申请号：US13546268
申请日：2012-07-11
申请人： Young Kwan LEE , Mi Suk CHO , Su Jeong LEE
发明人： Young Kwan LEE , Mi Suk CHO , Su Jeong LEE
IPC分类号： C25D9/04
CPC分类号： C25D9/02 , C25D9/04 , C25D13/02
摘要： Provided is a method of forming a uniform graphene layer on a substrate (metal- or conductive-polymer-coated, ITO) by doping expanded graphite using various kinds of dopants (Lewis acid) to grant a positive charge thereto, dispersing the doped expanded graphite in an organic solvent using ultrasonic waves to obtain a solution in which the graphene is dispersed in the organic solvent, and electrically applying a negative voltage to the solution.
摘要翻译：提供了通过使用各种掺杂剂（路易斯酸）掺杂膨胀石墨来在基底（金属或导电聚合物涂覆的ITO）上形成均匀的石墨烯层以赋予其正电荷的方法，将掺杂的膨胀石墨在使用超声波的有机溶剂中，得到石墨烯分散在有机溶剂中的溶液，并向溶液中施加负电压。

2. 发明申请

US20090286082A1 MONOMER FOR BINDING NANO-METAL, CONDUCTIVE POLYMER COMPOSITE AND METHOD OF PREPARING THE CONDUCTIVE POLYMER COMPOSITE 有权
标题翻译：用于结合纳米金属，导电聚合物复合材料的单体和制备导电聚合物复合材料的方法
公开(公告)号：US20090286082A1
公开(公告)日：2009-11-19
申请号：US12275745
申请日：2008-11-21
申请人： Byung Hee SOHN , Young Kwan LEE , Yi Yoiung YUN , Won Jae JOO
发明人： Byung Hee SOHN , Young Kwan LEE , Yi Yoiung YUN , Won Jae JOO
IPC分类号： B32B15/08 , C08G75/00 , B05D3/00
CPC分类号： C07D333/22 , H01B1/127 , H01B1/22 , Y10T428/294
摘要： Disclosed herein is a monomer for binding nano-metal, which is useful for the preparation of a conductor having increased conductivity with ensuring flexibility and transparency. Polymerization of the monomer for binding nano-metal provides a conductive polymer composite including a nano-metal rod. A method of preparing the conductive polymer composite is also provided.
摘要翻译：本文公开了用于结合纳米金属的单体，其可用于制备具有增加的导电性并且确保柔性和透明度的导体。用于结合纳米金属的单体的聚合提供了包括纳米金属棒的导电聚合物复合材料。还提供了制备导电聚合物复合材料的方法。

3. 发明申请

US20130093437A1 CAPACITOR SENSOR CAPABLE OF CONTROLLING SENSITIVITY 有权
标题翻译：电容传感器可控制灵敏度
公开(公告)号：US20130093437A1
公开(公告)日：2013-04-18
申请号：US13569427
申请日：2012-08-08
申请人： Ja Choon KOO , Hyouk Ryeol CHOI , Hyung Pil MOON , Young Kwan LEE , Jae Do NAM , Baek Chul KIM , Jin Ah CHUNG , Sung Gi KIM
发明人： Ja Choon KOO , Hyouk Ryeol CHOI , Hyung Pil MOON , Young Kwan LEE , Jae Do NAM , Baek Chul KIM , Jin Ah CHUNG , Sung Gi KIM
IPC分类号： G01R27/26
CPC分类号： G01R27/2605 , G01D5/24 , G01D5/2412 , G01L1/142 , G01L5/165 , G01L25/00
摘要： There is provided a capacitor sensor capable of controlling sensitivity, wherein the capacitor sensor measures the magnitude and direction of a shear force applied to the sensor, as well as the magnitude of a normal force applied on the surface of the sensor, and consists of a single cell including a pattern electrode capable of varying its shape to control the sensitivity of the sensor.
摘要翻译：提供了一种能够控制灵敏度的电容传感器，其中电容器传感器测量施加到传感器的剪切力的大小和方向以及施加在传感器表面上的法向力的大小，并由单电池包括能够改变其形状以控制传感器的灵敏度的图案电极。

4. 发明申请

US20130025913A1 METHOD FOR SURFACE-TREATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD 有权
标题翻译：表面处理印刷电路板和印刷电路板的方法
公开(公告)号：US20130025913A1
公开(公告)日：2013-01-31
申请号：US13524701
申请日：2012-06-15
申请人： Su Jin LEE , Hye In KIM , Young Kwan LEE , Chang Kyung WOO , Je Kyoung KIM
发明人： Su Jin LEE , Hye In KIM , Young Kwan LEE , Chang Kyung WOO , Je Kyoung KIM
IPC分类号： B23K1/20 , H05K1/00
CPC分类号： H05K3/282 , H05K3/26 , H05K3/3484 , H05K2203/095
摘要： Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate.According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.
摘要翻译：这里公开了一种表面处理印刷电路板和包括表面处理层的印刷电路板的方法。该方法包括：等离子体处理印刷电路板的表面; 用有机可焊性保存处理等离子体处理的基板; 对用有机可焊性保持剂处理的基材进行热处理; 在经过热处理的基板上印刷焊膏; 回流焊膏印刷基板以固定焊膏; 并且对所得到的底物进行去焊洗涤。根据本发明，由于铜的氧化引起的变色问题可以通过在有机可焊性保存处理后在预定条件下进行热处理来解决。因此，与现有技术的产品相比，本发明可以满足各种多回流工艺。

5. 发明申请

US20130008938A1 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20130008938A1
公开(公告)日：2013-01-10
申请号：US13234935
申请日：2011-09-16
申请人： Je Kyoung KIM , Seong Hoon BAE , Young Kwan LEE , Su Jin LEE
发明人： Je Kyoung KIM , Seong Hoon BAE , Young Kwan LEE , Su Jin LEE
IPC分类号： B23K1/20 , B23K31/02
CPC分类号： B23K1/20 , B23K1/0016 , B23K2101/42
摘要： Disclosed herein is a method for manufacturing a printed circuit board, the method including: preparing a base substrate having a connection pad; forming a surface treatment layer on the connection pad; refrigeration-treating the base substrate having the connection pad on which the surface treatment layer is formed; and printing a solder paste on the connection pad of the refrigeration-treated base substrate.
摘要翻译：本发明公开了印刷电路板的制造方法，该方法包括：准备具有连接垫的基底基板; 在连接垫上形成表面处理层; 对具有形成表面处理层的连接焊盘的基底基板进行制冷处理; 以及在所述冷冻处理过的基底基板的连接垫上印刷焊膏。

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