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1. 发明申请

US20120014099A1 Lamp 审中-公开
标题翻译：灯
公开(公告)号：US20120014099A1
公开(公告)日：2012-01-19
申请号：US12868186
申请日：2010-08-25
申请人： Young Hoon An , Kwang Soo Kim , Kyu Sop Song
发明人： Young Hoon An , Kwang Soo Kim , Kyu Sop Song
IPC分类号： F21S4/00
CPC分类号： F21V21/30 , F21S2/00 , F21V29/507 , F21V29/51 , F21V29/717 , F21V29/73 , F21V29/763 , F21V29/83 , F21V29/89 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , F28D15/0275
摘要： Provided is a lighting system having a printed circuit board on which a plurality of light emitting diodes are arranged; a base holding the printed circuit board; a heat sink provided on a lateral side of the base in a horizontal direction of the printed circuit board; a heat pipe which connects the base with the heat sink; and a rotating unit provided in at least end portion of one end portions and the other end portions of the base or the heat sink, to easily control the illuminating angle and the illuminating range and therefore to improve the energy efficiency, and to improve the heat-radiating property since the heat sink is provided in the lateral side of the substrate of heat-generating member.
摘要翻译：提供一种具有布置有多个发光二极管的印刷电路板的照明系统; 一个固定印刷电路板的基座; 设置在所述基座的横向方向上的印刷电路板的水平方向上的散热器; 将基座与散热器连接的热管; 以及设置在基座或散热器的一个端部和另一个端部的至少端部的旋转单元，以容易地控制照明角度和照明范围，从而提高能量效率，并且提高热量因为散热器设置在发热元件的基板的侧面。

2. 发明申请

US20050099774A1 Semiconductor chip cooling module with fin-fan-fin configuration 审中-公开
标题翻译：半导体芯片散热模块，散热片翅片配置
公开(公告)号：US20050099774A1
公开(公告)日：2005-05-12
申请号：US10704187
申请日：2003-11-06
申请人： Kyu Sop Song
发明人： Kyu Sop Song
IPC分类号： H01L23/367 , H01L23/467 , H05K7/20
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a semiconductor chip cooling module with fin-fan-fin configuration employing a heat pipe provided with air ventilating means having a forced convection cooling type radiating method of forcedly cooling heat radiating fins by ventilating a wind to rapidly discharge and cool heat generated from a central processing unit (hereinafter referred to as “CPU”) mounted on a main board of a computer; the present invention comprises a heat radiating plate having a plurality of slots, a pair of heat pipes installed in the slots in a symmetrical relationship, and air ventilating means having a ventilating fan installed between heat radiating pins of the pair of heat pipes, wherein an air is ventilated to the heat radiating pins to forcedly radiate the heat radiating pins. The present invention is capable of embodying a rapid radiation on an overheat of the CPU by employing a forced direct cooling method that air ventilating means is installed at a center of plural rows of heat pipes to ventilate an air to thereby forcedly and directly cool the heat radiating fins mounted on the plural rows of heat pipes.
摘要翻译：本发明涉及一种具有翅片翅片结构的半导体芯片冷却模块，该半导体芯片冷却模块采用具有通风装置的热管的热管，该通风装置具有强制对流冷却型辐射方法，该方法通过风吹风来强制冷却散热片，从安装在计算机的主板上的中央处理单元（以下称为“CPU”）生成; 本发明包括具有多个槽的散热板，以对称关系安装在槽中的一对热管，以及具有安装在该对热管的散热销之间的通风扇的通风装置，其中，空气通向散热销以强制辐射散热销。本发明能够通过使用强制直接冷却方式来实现对CPU过热的快速辐射，该方法是将空气通风装置安装在多排热管的中心以使空气通风，从而强制并直接冷却热量安装在多排热管上的散热片。

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