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1. 发明授权

US08351180B1 Multilayer ceramic capacitor 有权
标题翻译：多层陶瓷电容器
公开(公告)号：US08351180B1
公开(公告)日：2013-01-08
申请号：US13531237
申请日：2012-06-22
申请人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
发明人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
IPC分类号： H01G4/06
CPC分类号： H01G4/12 , H01G4/012 , H01G4/30
摘要： There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA1/CA1) of MA1 to CA1 is between 0.07 and 0.20, wherein CA1 represents an area of the multilayer body in a cross section of the multilayer body taken in a length and thickness direction, and MA1 represents an area of a first margin part in the cross section of the multilayer body taken in the length and thickness direction, the first margin part being a portion of the multilayer body, other than a first capacitance forming part thereof in which the first and second inner electrodes overlap in the thickness direction.
摘要翻译：提供了一种多层陶瓷电容器，包括：多层体，其中多个电介质层在厚度方向上堆叠; 以及形成在所述多层体内并且包括彼此相对设置的第一和第二内部电极的内部电极层; 其中MA1与CA1的比率（MA1 / CA1）在0.07和0.20之间，其中CA1表示在长度和厚度方向上取下的多层体的横截面中的多层体的面积，MA1表示第一边缘部分是沿着长度和厚度方向截取的第一边缘部分，第一边缘部分是多层体的一部分，除了第一电容形成部分之外，第一和第二内部电极在其中重叠厚度方向。

2. 发明授权

US08373964B2 Multi-layered ceramic capacitor 有权
标题翻译：多层陶瓷电容
公开(公告)号：US08373964B2
公开(公告)日：2013-02-12
申请号：US13064153
申请日：2011-03-08
申请人： Young Ghyu Ahn , Dong Seok Park , Sang Soo Park , Min Cheol Park , Byoung Hwa Lee
发明人： Young Ghyu Ahn , Dong Seok Park , Sang Soo Park , Min Cheol Park , Byoung Hwa Lee
IPC分类号： H01G4/30 , H01G4/06 , H01G4/228 , H01G4/005
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12
摘要： There is provided a multi-layered ceramic capacitor with reduced internal resistance by forming internal electrode groups including internal electrodes having different lengths. The multi-layered ceramic capacitor of the present invention includes a sintered ceramic body part in which cover layers are provided on both surfaces thereof as an outermost layer and a plurality of ceramic layers are stacked therebetween, first and second external electrodes each formed on an outer surface of the sintered ceramic body part, a plurality of first and second internal electrode groups adjacent to each other in a stacking direction of the plurality of ceramic layers, having the ceramic layer therebetween, and including 2N or 2N+1 (N is an integer number larger than 1) internal electrodes electrically connected to the first and second external electrodes, wherein the 2N or 2N+1 (N is an integer number larger than 1) internal electrodes are disposed to face at least one internal electrode of other adjacent internal electrode groups. A length of each internal electrode has a pyramid shape.
摘要翻译：通过形成具有不同长度的内部电极的内部电极组，提供具有降低的内部电阻的多层陶瓷电容器。本发明的多层陶瓷电容器包括烧结陶瓷体部分，其两面上设有覆盖层作为最外层，并且多个陶瓷层堆叠在其间，第一和第二外部电极各自形成在外部烧结陶瓷体部的表面，在多个陶瓷层的堆叠方向上彼此相邻的多个第一和第二内部电极组，其间具有陶瓷层，并且包括2N或2N + 1（N是整数大于1的数字）电连接到第一和第二外部电极的内部电极，其中设置2N或2N + 1（N为大于1的整数）的内部电极，以面对其他相邻内部电极的至少一个内部电极团体每个内部电极的长度具有金字塔形状。

3. 发明申请

US20110317327A1 Multi-layered ceramic capacitor 有权
标题翻译：多层陶瓷电容
公开(公告)号：US20110317327A1
公开(公告)日：2011-12-29
申请号：US13064153
申请日：2011-03-08
申请人： Young Ghyu Ahn , Dong Seok Park , Sang Soo Park , Min Cheol Park , Byoung Hwa Lee
发明人： Young Ghyu Ahn , Dong Seok Park , Sang Soo Park , Min Cheol Park , Byoung Hwa Lee
IPC分类号： H01G4/30
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12
摘要： There is provided a multi-layered ceramic capacitor with reduced internal resistance by forming internal electrode groups including internal electrodes having different lengths. The multi-layered ceramic capacitor of the present invention includes a sintered ceramic body part in which cover layers are provided on both surfaces thereof as an outermost layer and a plurality of ceramic layers are stacked therebetween, first and second external electrodes each formed on an outer surface of the sintered ceramic body part, a plurality of first and second internal electrode groups adjacent to each other in a stacking direction of the plurality of ceramic layers, having the ceramic layer therebetween, and including 2N or 2N+1 (N is an integer number larger than 1) internal electrodes electrically connected to the first and second external electrodes, wherein the 2N or 2N+1 (N is an integer number larger than 1) internal electrodes are disposed to face at least one internal electrode of other adjacent internal electrode groups. A length of each internal electrode has a pyramid shape.
摘要翻译：通过形成具有不同长度的内部电极的内部电极组，提供具有降低的内部电阻的多层陶瓷电容器。本发明的多层陶瓷电容器包括烧结陶瓷体部分，其两面上设有覆盖层作为最外层，并且多个陶瓷层堆叠在其间，第一和第二外部电极各自形成在外部烧结陶瓷体部的表面，在多个陶瓷层的堆叠方向上彼此相邻的多个第一和第二内部电极组，其间具有陶瓷层，并且包括2N或2N + 1（N是整数大于1的数字）电连接到第一和第二外部电极的内部电极，其中设置2N或2N + 1（N为大于1的整数）的内部电极，以面对其他相邻内部电极的至少一个内部电极团体每个内部电极的长度具有金字塔形状。

4. 发明授权

US08681475B2 Mounting structure of circuit board having multi-layered ceramic capacitor thereon 有权
标题翻译：具有多层陶瓷电容器的电路板的安装结构
公开(公告)号：US08681475B2
公开(公告)日：2014-03-25
申请号：US13590270
申请日：2012-08-21
申请人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
发明人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
IPC分类号： H01G4/06
CPC分类号： H01G4/12 , H01G4/228 , H01G4/30
摘要： Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, the multi-layered ceramic capacitor including dielectric sheets laminated thereon and external terminal electrodes formed at both ends thereof, the dielectric sheets having internal electrodes formed thereon, and the external terminal electrodes being connected in parallel with the internal electrode, wherein the internal electrodes are disposed to be in parallel with the circuit board, the external terminal electrodes are bonded to lands of the circuit board by a conductive material, and a bonding height (Ts) of the conductive material is lower than a sum of a gap (Ta) between the circuit board and a bottom surface of the multi-layered ceramic capacitor and a thickness (Tc) of a cover layer on a lower portion of the multi-layered ceramic capacitor, whereby vibration noise can be greatly reduced.
摘要翻译：这里公开了一种其上具有多层陶瓷电容器的电路板的安装结构，其中层叠有电介质片的多层陶瓷电容器和形成在其两端的外部端子电极，其上形成有内部电极的电介质片，以及外部端子电极与内部电极并联连接，其中内部电极被设置为与电路板平行，外部端子电极通过导电材料接合到电路板的焊盘，并且接合高度 Ts）低于多层陶瓷电容器的电路板和底面之间的间隙（Ta）和多层陶瓷电容器的下表面的覆盖层的厚度（Tc）之和，层状陶瓷电容器，从而可以大大降低振动噪声。

5. 发明申请

US20120152604A1 MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTI-LAYERED CERAMIC CAPACITOR, METHOD THEREOF, LAND PATTERN OF CIRCUIT BOARD FOR THE SAME, PACKING UNIT FOR MULTI-LAYERED CERAMIC CAPACITOR TAPED HORIZONTALLY AND ALIGNING METHOD THEREOF 审中-公开
标题翻译：具有多层陶瓷电容器的电路板的安装结构，其方法，电路板的土地图案，多层陶瓷电容器的包装单元和水平方法
公开(公告)号：US20120152604A1
公开(公告)日：2012-06-21
申请号：US13331619
申请日：2011-12-20
申请人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
发明人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
IPC分类号： H05K1/18 , H05K3/00 , H01G4/30
CPC分类号： H01G2/065 , H01G4/232 , H01G4/30 , H05K3/3442 , H05K13/022 , H05K2201/10015 , H05K2203/166 , Y02P70/613 , Y10T29/49124
摘要： The present invention provides a method of mounting a circuit board having thereon a multi-layered ceramic capacitor and a land pattern of a circuit board for the same. The method of mounting a circuit board having thereon a multi-layered ceramic capacitor on which a plurality of dielectric sheet having internal electrodes formed thereon are stacked and the external terminal electrodes connected to the internal electrodes in parallel are formed on both ends thereof includes conductively connecting lands of a circuit board to the external terminal electrodes in such a way that internal electrode layers of the multi-layered ceramic capacitor and the circuit board are arranged in a horizontal direction, wherein a height TS of conductive material to conductively connect the external terminal electrodes to the lands is less than ⅓ of a thickness TMLCC of the multi-layered ceramic capacitor.
摘要翻译：本发明提供了一种安装电路板的方法，其上具有多层陶瓷电容器和用于其的电路板的焊盘图案。在其上堆叠有多层陶瓷电容器的电路板的方法，其上形成有形成有内部电极的多个电介质层，并且在其两端形成有与内部电极并联连接的外部端子电极的方法包括导电连接电路板的接地部分以外部端子电极的方式使多层陶瓷电容器和电路板的内部电极层沿水平方向排列，其中导电材料的高度TS导电连接外部端子电极到土地的厚度小于多层陶瓷电容器的厚度TMLCC的1/3。

6. 发明授权

US08054607B2 Multilayer chip capacitor and circuit board device 有权
标题翻译：多层片式电容器和电路板器件
公开(公告)号：US08054607B2
公开(公告)日：2011-11-08
申请号：US12649071
申请日：2009-12-29
申请人： Byoung Hwa Lee , Dong Seok Park , Young Ghyu Ahn , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Dong Seok Park , Young Ghyu Ahn , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/005
CPC分类号： H01G4/30 , H01G4/005
摘要： There are provided a multilayer chip capacitor and a circuit board device. The multilayer chip capacitor includes a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes formed on an outer surface of the capacitor body and having opposite polarity, first and second inner electrodes opposing each other, interleaved with the dielectric layers in the capacitor body, and each including an electrode plate forming capacitance and a lead extending from the electrode plate, the lead of the first inner electrode and the lead of the second electrode being respectively connected to the first and second outer electrodes, and third inner electrodes interposed between the first and second inner electrodes. At least one of the third inner electrodes adjacent to the first inner electrode includes a conductive pattern having the same shape as the lead of the first inner electrode and is connected to the first outer electrode. At least one of the third inner electrodes adjacent to the second inner electrode includes a conductive pattern having the same shape as the lead of the second inner electrode and is connected to the second outer electrode.
摘要翻译：提供了多层片状电容器和电路板装置。多层片状电容器包括电容器本体，其包括层叠的多个电介质层，形成在电容器本体的外表面上并具有相反极性的第一和第二外部电极，彼此相对的第一和第二内部电极，与电介质层，并且每个包括电极板形成电容和从电极板延伸的引线，第一内部电极的引线和第二电极的引线分别连接到第一和第二外部电极，第三介于第一和第二内部电极之间的内部电极。与第一内部电极相邻的第三内部电极中的至少一个包括具有与第一内部电极的引线相同形状并且连接到第一外部电极的导电图案。与第二内部电极相邻的第三内部电极中的至少一个包括具有与第二内部电极的引线相同形状并且连接到第二外部电极的导电图案。

7. 发明申请

US20110013341A1 MULTILAYER CHIP CAPACITOR 审中-公开
标题翻译：多层芯片电容器
公开(公告)号：US20110013341A1
公开(公告)日：2011-01-20
申请号：US12651175
申请日：2009-12-31
申请人： Min Cheol PARK , Dong Seok Park , Byoung Hwa Lee , Young Ghyu Ahn , Sang Soo Park
发明人： Min Cheol PARK , Dong Seok Park , Byoung Hwa Lee , Young Ghyu Ahn , Sang Soo Park
IPC分类号： H01G4/06 , H01G4/30
CPC分类号： H01G4/228 , H01G4/005 , H01G4/30
摘要： Disclosed is a multilayer chip capacitor including a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes of opposite polarity disposed on an outer face of the capacitor body, first and second inner electrodes opposing each other inside the capacitor body to interpose the dielectric layer therebetween, the first inner electrode comprising an electrode plate forming capacitance and a lead extending from the electrode plate and connected to the first outer electrode, and the second inner electrode comprising an electrode plate forming capacitance and a lead extending from the electrode plate and connected to the second outer electrode. The leads are bent at least once and each have an overlap portion overlapping a lead of an adjacent inner electrode of opposite or like polarity when viewed along a stacked direction in which the plurality of dielectric layers are stacked.
摘要翻译：公开了一种多层片状电容器，包括：电容器本体，包括层叠的多个电介质层，设置在电容器主体的外表面上的相反极性的第一外部电极和第二外部电极，电容器主体内部彼此相对的第一和第二内部电极将电介质层介于其间，第一内电极包括电极板形成电容和从电极板延伸并连接到第一外电极的引线，第二内电极包括电极板形成电容和从电极板并连接到第二外部电极。引线弯曲至少一次，并且当沿堆叠多个电介质层的堆叠方向观察时，引线与相邻或相似极性的相邻内部电极的引线重叠，并且每个引线重叠。

8. 发明授权

US09148955B2 Mounting structure of circuit board having multi-layered ceramic capacitor thereon 有权
标题翻译：具有多层陶瓷电容器的电路板的安装结构
公开(公告)号：US09148955B2
公开(公告)日：2015-09-29
申请号：US13481348
申请日：2012-05-25
申请人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
发明人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
IPC分类号： H05K1/18 , H05K1/11 , H05K3/34
CPC分类号： H05K1/111 , H01G4/12 , H01G4/30 , H05K3/3442 , H05K2201/10015 , H05K2201/2045 , Y02P70/611 , Y02P70/613
摘要： Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on which inner electrodes are disposed is stacked and external electrode terminals connecting the inner electrodes in parallel are disposed on both ends thereof, wherein the inner electrodes of the multi-layered ceramic capacitor and the circuit board are disposed so as to be a horizontal direction to connect the external electrode terminals with a land on the circuit board by a conductive material and a ratio of a bonding area ASOLEDER of the conductive material to the area AMLCC of the external electrode terminals AMLCC is set to be less than 1.4, thereby remarkably reducing the vibration noise.
摘要翻译：这里公开了一种其上具有多层陶瓷电容器的电路板的安装结构。其上设置有多层陶瓷电容器的电路板的安装结构，其中布置有内部电极的电介质层，并且将其内部电极并联连接的外部电极端子设置在其两端，其中内部电极将多层陶瓷电容器和电路板设置成水平方向，以通过导电材料将导电材料的外部电极端子与电路板上的焊盘接合，并且将导电材料的接合面积ASOLEDER与外部电极端子AMLCC的面积AMLCC被设定为小于1.4，从而显着地降低了振动噪声。

9. 发明授权

US08630083B2 Multi-layered capacitor and manufacturing method thereof 有权
标题翻译：多层电容器及其制造方法
公开(公告)号：US08630083B2
公开(公告)日：2014-01-14
申请号：US13447692
申请日：2012-04-16
申请人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
发明人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/232 , H01G4/12 , H01G4/30 , H01G4/35
摘要： A multi-layered capacitor includes a capacitor element in which a plurality of dielectric layers are multi-layered, and which comprises a first inner electrode and a second inner electrode that are alternately formed on neighboring dielectric layers of the plurality of dielectric layers, a first external electrode and a second external electrode which are formed on an outside surface of the capacitor element to be electrically connected to the first inner electrode and the second inner electrode, respectively, and a deformation suppressing electrode which is formed on the outside surface of the capacitor element and separated from the first external electrode and the second external electrode to be electrically isolated from the first inner electrode and the second inner electrode.
摘要翻译：多层电容器包括电容器元件，其中多个电介质层是多层的，并且包括交替地形成在多个电介质层的相邻电介质层上的第一内电极和第二内电极，第一外部电极和第二外部电极，分别形成在电容器元件的外表面上以与第一内部电极和第二内部电极电连接;变形抑制电极，形成在电容器的外表面上并且与第一外部电极和第二外部电极分离以与第一内部电极和第二内部电极电隔离。

10. 发明申请

US20130155574A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开
标题翻译：多层陶瓷电子元件
公开(公告)号：US20130155574A1
公开(公告)日：2013-06-20
申请号：US13541494
申请日：2012-07-03
申请人： Min Cheol PARK , Byoung Hwa Lee , Dong Seok Park , Young Ghyu Ahn , Sang Soo Park
发明人： Min Cheol PARK , Byoung Hwa Lee , Dong Seok Park , Young Ghyu Ahn , Sang Soo Park
IPC分类号： H01G4/012
CPC分类号： H01G4/232 , H01G4/012 , H01G4/30
摘要： A multilayer ceramic electronic component having high reliability by reducing equivalent series resistance (ESR) dispersion is provided. Connectivity between internal electrodes and external electrodes is secured by introducing dummy electrodes connected to first and second terminal electrodes, to third and fourth internal electrode layers. ESR dispersion of the multilayer ceramic electronic component is reduced to obtain high reliability.
摘要翻译：提供了通过降低等效串联电阻（ESR）色散而具有高可靠性的多层陶瓷电子元件。通过将连接到第一和第二端子电极的虚设电极引入第三和第四内部电极层来确保内部电极和外部电极之间的连通性。降低多层陶瓷电子部件的ESR分散，获得高可靠性。

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